© 2003 APC corporation.. Improving Cooling efficiency in tomorrow's data centre Kevin Hughes, APC...
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Transcript of © 2003 APC corporation.. Improving Cooling efficiency in tomorrow's data centre Kevin Hughes, APC...
© 2003 APC corporation.
Improving Cooling efficiency in tomorrow's data centre
Kevin Hughes, APC Senior Systems Engineer
© 2003 APC corporation.
Agenda
The Problem: High Density IT Equipment
Legacy Cooling System Limitations
The Solution: APC InfraStruXure In-Row Cooling Innovation
The Benefits of IR Cooling Methodology
Summary
© 2003 APC corporation.
The Problem
Average rack in a typical data center is under 2 kW
Full deployment of high density servers (10-20 kW per rack) would greatly exceed the power and cooling ability of the typical data center
Providing 10-20kW of cooling per rack is technically impractical to infeasible using conventional methods
© 2003 APC corporation.
What is the industry saying ?
“You cannot keep it a secret, performance-per-watt will become critical over next decade. […] for every watt that goes into a processor you will use another watt to cool it“, Steve Prentice, research VP at Gartner June 2006
"There's no question that the issue of power and cooling is a growing concern. The assumptions used for building data centres have been blown away" , John Humphreys, IDC Analyst
© 2003 APC corporation.
Industry statistics Power & cooling #1 issue for CIOs
70% of respondents recently said power and/or cooling issues are now their single largest problem facing their datacenters
Projections are 48% of IT budget spent on energy, up from 8% 0
20
40
60
80
100
2004
2005
2006
All othercombined
TopIssuesPowerandCooling
Source: Gartner CIO Survey
© 2003 APC corporation.Sectional Plane @ 5’-6” from Raised Floor
Redundancy:
Any unit failure results in loss of cooling to an area
N+1 at room level does not provide adequate cooling in failure modes
Legacy Architecture
Legacy Limitation: Unpredictable Performance
© 2003 APC corporation.
Grate tile
Perf tile
Blade Servers
Standard IT Equipment
WithEffort
TypicalCapability Extreme Impractical
12
10
8
6
4
2
00 100 200 300 400 500 600 700 800 900 1000
[47.2] [94.4] [141.6] [188.8] [236.0] [283.2] [330.4] [377.6] [424.8] [471.9]
Requires careful raised floor design, careful CRAC placement,
and control of under-floor obstacles
300-500 cfm
RackPower(kW)
that can becooled by one tile with this
airflow
Floor Tile Cooling Ability
Cooling capability limitations of Legacy Architecture - Floor Tiles
Tile Airflow (cfm) [L/s]
© 2003 APC corporation.
Supplemental Solutions
-Effective only in the short term
-A new & different system to purchase, install, learn about, operate & maintain
-More failure points
-Increased Operator Error Risk
-Relatively Inflexible
-Redundancy is Questionable
The Solution: In-row rack-coupled CRAC
© 2003 APC corporation.
CFD model of in-row system:Modeling failure of one CRAC
© 2003 APC corporation.
Basic building block: rack form factor CRAC
InfraStruXure Cooling Distribution Unit
½ Rack form factor
N+1 hot-swap variable speed fans
Captures hot air exhaust from nearby IT racks
Overhead or under-floor piping
Works with any brand of IT cabinet
Add units for redundancy or density
© 2003 APC corporation.
InRow RC Product Design Benefits
Air Filter
Removes airborne particles, protects coil
Top or Bottom Piping Connections
Variable Speed Hot Swappable Fans
Rightsizes cooling capacity, energy savings
Cooling Coil
Removes heat using chilled water
Condensate Management
Detects and removes condensation
Field Configurable 2-Way or 3-Way Valve Operation
Casters
Allows unit to move easily
InfraStruXure® InRow RC
Dual A-B Power Inputs
Power redundancy and protection
Flow Meter
Measures water flow to facilitate determining unit kW output
© 2003 APC corporation.
In-row rack-coupled CRAC
InfraStruXure Cooling Distribution Unit
Bayed to adjacent IT racks
Up to 60kW rating
N+1 hot-swap fans
Directly ducts hot air exhaust from connected IT rack
Front may be open or ducted
Mix into existing legacy data center
Add second unit for redundancy or capacity
© 2003 APC corporation.
In-row with hot aisle containment
© 2003 APC corporation.
CDU serving 12 x RC’s
© 2003 APC corporation.
Isolation and balancing valve
Allows isolation for servicing and provides coolant flow adjustment
InfraStruXure® Cooling Distribution Unit
InfraStruXure® Coolant Distribution Unit (CDU)
Individual supply and return lines
Supplies and returns coolant to and from CRAC units
Main supply and return headers
Supplies and returns coolant to and from the Chiller
Top or bottom piping connections
Allows the CDU to be top or bottom piped
Condensate pan with drain connection
Casters
Allows the CDU to be installed easilyIsolation valve
Allows isolation for servicing
© 2003 APC corporation.
© 2003 APC corporation.
What about installation and piping?
InfraStruXure® InRow RC
Water in the data centre?
What about leaks and condensation?
Complicated installation?
Retrofittable to existing data centre?
© 2003 APC corporation.
What is PEX?
“Cross-Linked Polyethylene”
Semi-flexible piping solution Corrosion free, low head loss, highly reliable
Developed in 1960’s EU, 1980’s NAM
Applications Plumbing, district heating / cooling, hydronic radiant heating, snow melt, ice
rinks, refrigeration warehouses
Standardized product ASTM F877 (tubing), ASTM F1807 (fittings)
Approved material in all national plumbing codes
UL Flame Ratings
Why use in APC InfrastruXure™ cooling? ‘Pay as you grow’ compatibility Increased Reliability
© 2003 APC corporation.
PipingPiping
Standardized Fitting Decreased Human Error
Connections & Supports for PEX-AL-PEX
Alternative In-row rack-coupled CRAC Solutions
© 2003 APC corporation.
InfraStruXure® InRow RP
InfraStruXure® InRow RP
In-row precision air conditioning for medium to large data centers including high density applications.
The predictable solution for an unpredictable environment
© 2003 APC corporation.
InRow RP Product Design Benefits
Top or Bottom Piping Connections
Condensate Management
Detects and removes condensation
Cooling Coil
Removes heat using chilled water or refrigerant
Electric Reheat
Controls temperature during dehumidification
Steam Humidifier
Maintains moisture level in room
Casters
Allows unit to moved easily
InfraStruXure® InRow RP
Air Filter
Removes airborne particles, protects coil
Variable Speed Compressor
Only on DX Version
© 2003 APC corporation.
InfraStruXure InRow SC
Air from plenum space pulled into unit
via condenser fans
Cool air is supplied to row or room
Condenser air absorbs heat from
coil
Heat transferred to condenser coil
Heat rejected from condenser coil to
plenum space
Evaporator coil absorbs heat from air
Hot exhaust air from IT equipment pulled
into unit via evaporator fans
© 2003 APC corporation.
High Density Case Study
25-MAY-06 A
CONSTRUCTION INDUSTRY
NTS
Section
Hot
Cold
Hot
Cold
10 m
8.5 m
10 m
8.5 m
Back
Front
Row B
Front
Back
Row C
Front
Back
Row A
80kW - CW CDUC1/Wall
M
C...
C...
C...
C...
PP/C-1/Z...
7
SysBay
80kW - CW
8636
mm
10160mm.
3kW 3kW 3kW
3kW3kW12kW3kW
12kW
Cool Distribution Units (CDU) – Supports up to 12 x RC unit
Power Distribution Unit (PDU) Supports up to 80 kW
Power Distribution Unit (PDU) Supports 80 kW
Water Process Coolers. 80 kW net cooling. N+1 shown. Will support up to System bay and 4 storage with redundancy. Beyond that an additional unit will need to be installed
6 x InRow RC cooling units, as shown will support the current load with redundancy. Additional units may be installed as racks or densities are increased.
Hot Cold HotSysBay
FM
40-CW
3kWRack Rack80kW-CW
RAISED FLOOR PLENUMSA
Proposed Floor Layout
7kW
15kW
C...
C...
PP/C-1/Z...
6kW
7kW6kW
10kW
10kW
© 2003 APC corporation.
InfraStruXure® Designer: Intelligent data centre design tool
© 2003 APC corporation.
Summary
Your data centre’s Network Critical Physical Infrastructure (NCPI) must support dynamic business needs
High-density server deployment requires unique cooling and power solutions
In-row, close-coupled cooling maximises efficiency
NCPI Health Check increases availability and reduces TCO of existing systems
APC’s original In-Row Cooling is the most cost effective, agile solution to today’s cooling challenges
Complexity is not a necessity.
Do not tolerate unpredictable performance & inflexibility
Doing high density the right way costs less
© 2003 APC corporation.
Thank you
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