Who are Semelab plc ?

• Privately-Owned UK Company• Established 35 years• Grown year -on- year• Profitable every year

• Based in Glenrothes, Scotland• Acquired 15 years ago• Key focus – Mixed-signal A.S. I.C.s• MEMS & NanoMems

• In house die supply

• Based at Lutterworth, Leics.

• Own diffusion fab – Semefab

Today solutions:- World wide producers are designing the next generation of commercial airliners

Boeing 787 Dream liner and Airbus A380 & A350 Tupolev TU334, Sukholi Superjet 100

Typical these are designed to have a 20 % reduction in fuel consumption and subsequent emissions, while offering exceptional noise reduction while in flight

This is achieved by the extensive use of the following:-• Composite bodies over 50% saving in the use of aluminium• Power electronic cooling system• Electronic braking rather than hydraulic• HID/ LED lighting• Advance Electronic Flight control and wing surfaces

All items marked in red supplied by Semelab

M.O.E.TMore Open Electrical Technology

A European commission led program to develop the next generation of electric aircraft

Main partners:-•Airbus•Goodrich•Safran Group•Leibherr •Rolls Royce•Semelab

P.O.A E.T.R.A.SPower Optimised Aircraft Electrical reverse thrust actuation system

Semelab working with Hispano Suiza, Messier Bugatti and SagemTo develop the next generation of flight control systems

“Tomorrows aircraft will based more on electronic systems offering more reliability affordable and cleaner aircraft”

Alain Coutrot Vice president Research and technology Safran Group

Typical Products being built and supplied now by Semelab PLC

for the future aircraft use

Power modules for the following applications:-• Flight surface actuation modules

• Rudder control• Slats controllers• Aeriolons controls

• Engine reverse thrust module• Advanced de-icing controllers• Wheel antilock braking systems

Advanced Flight module A380 Rudder control3 phase input rectifier

A380 I.G.B.T Module For flight actuation systems:-

•300 Amp•1200 Volts•3000 temp Cycles –50ºC - 150 ºC

Semelab have optimise standard plastic module for aircraft use in order to achieve the following:-

• Low weight typical 66% of the weight of conventional modules• Enhanced performance designed to last for a 25 year aircraft life

• Typically survives 2500 temperature cycles from -50 C - +150 Deg C

Typical constructions consist of:-• Lightweight metal matrix base plate

•CTE of 7 p.p.m• A.M.B substrates

•CTE of 6 p.p.m•State of the art die

•CTE of 4.5 p.p.m•Custom die coats and encapsulates

It can be see that our structure as a very closely match vertical C.T.E structure and hence the stress in the module is kept to a minimum.

In Flight ComfortState of the art electronics offer better air conditioning approx 20 % improvement on air circulation time

While building on Semelab world beating “D” Class Amplifiers, Anti noise system will be developed to ensure a more comfortable and relaxing flight

The same technology can also be used provide high efficiency power supplies in aircraft for your laptop Ipod or PDAPlease note the anti noise

system could also be used in Industrial or

office based systems

Hermetic packages for the future

Typical module construction for today’s application:-• Copper or copper base plate • Kovar ring frame• ALN substrate • Expensive glass or ceramic - metal seals

Typical application:-• Rocket steering thrust vectors• Oil feed drill steering• Engine vane control

Antle EngineAntle EngineTurbine Vane ACTUATORTurbine Vane ACTUATOR

Designed to increase fuel efficiency by 10%

• Removal of glass/ceramic seals – HermeticityHermeticity• Minimised number of wirebonds – ReliabilityReliability• Size/Weight reduction – EfficiencyEfficiency

FEATURES :• AMB (active metal brazed) • Hermetic Substrate Package• Copper conductors• Si3N4 Insulator• No glass/ceramic seals • Comparable thermal resistance to AlN

SI3N4 Via connectivity “state of the art” packaging

• Production Alumina DBC (Cu metallization) – 500(max) temp cycles -55°C to 125°C expected before conchoidal fractures appear

»(Source: Semelab Plc)

• Production AlN AMB (with Al metallization)– 2000 temp cycles passed -55°C to 125°C without fracture or delamination

(Source: Semelab Plc)

• AMB Silicon Nitride (Cu metallization)– 5000 temp cycles passed -60°C to 175°C without fracture or delamination

– 2000 temp cycles passed -65°C to 150°C without hermiticity failure

(Source: Kyocera Corp

Semelab parts under qualification)

• Alumina DBC package (no baseplate) – 0.3/0.635/0.3mm Cu/Al2O3/Cu

– 1.24 °C/W1.24 °C/W

• AlN AMB package (no baseplate)– 0.3/0.635/0.3mm Al/AlN/Al

– 0.42 °C/W0.42 °C/W

• Si3N4 package (integrated baseplate)– 0.3/0.32/0.3/0.3/0.635/0.3mm Cu/Si3N4/Cu/Cu/Si3N4/Cu

– 0.76 °C/W0.76 °C/W

AlN(0.635t)

Si3N4(0.32t)

Si3N4(0.635t)

Copper Thcikness (mm) (per Side)

Rth

1-2

( de

g.C

/W)

AlN Crack!

0.70

0.65

0.60

0.55

0.50

0.45

0.400 0.1 0.2 0.3 0.4 0.5 0.6

OK

Thermal Characteristics of Si3N4 against AlN

Typical use of Si3N4 Packages

Radiation tolerant Mosfet bridge with steering elementsAnd protection circuitry-Programs For space Altika and YAHsat satellites

• 150 Krad total dose• Good safe operating area up to 59 LET (MeV)

Full radiation specification available on request

Si3N4 Substrate combined With

Conventional technology

The use of Si3N4 offers:-• Low weight •Thermally efficiency•Increased current density•Vibration resistance

Fully authorised Aircraft wheel braking system

solder

Heat sink compound

MMC Base plate

solder

die

copper

Aluminium nitride

Copper

Copper or Aluminium Heat sink

MMC Heat sink (2) - Now

solder

solder

die

copper

Aluminium nitride

Copper

solder

die

copper

Aluminium nitride

Copper

Impingement cooler (3)

NEW DESIGN FOR OPTIMISED THERMAL PERFORMANCE

Future Advanced (4)- 3 years

solder

die

copper

SILICON CARBIDE

solder

MEDIUM RISK - Impingement cooling

DESIGN CONCEPTS TO ACHIEVE THERMAL PERFORMANCE AND RELIABILITY

• Total Pressure drop 13221 Pa (1.92 PSI)• Temperature rise ≤ 3.5 °C

Thank You