Post on 12-Nov-2020
Linecard SUPPLIER & TECHNOLOGY PORTFOLIO
3
Portfolio Avnet ASIC Solutions
2 AVS-004-E_Linecard | August 2020 avnet-silica.com
Avnet ASIC Solutions is your one-stop-shop for ASIC Design Services and Turnkey manufacturing services, operating for over 30 years with 350 successful completed projects. We can step in with a very skilled design team and offer you flexible business models.
We offer a complete range of ASIC services, from specification to mass production, with robust design practices and smooth ramp path to mass production.
Avnet ASIC Solutions has strong established relationships with the main foundries like Samsung, TSMC, Global Foundry, ST, Xfab and SocioNext. We choose the technology that is most suited for a particular application and your specific needs and we take charge to enable you to work with a single point of contact only: Avnet ASIC Solutions. Our proven technology nodes expertise get down to advanced EUV 7nm for Digital, Analog or Mix Signal designs.
The ASIC focus application areas are: Automotive, Industrial, Artificial Intelligent, Consumer, Internet of Things, Bio- Medical, Communication, Crypto Currency and many more.
END OF LIFE SOLUTIONS:
The current and upcoming market changes bring more and more mature technology to an End of Life Status. The needed re-designs can often not be implemented in time with all re-design and re-qualification needs.
Avnet ASIC Solutions offers you to develop pin compatible solutions which avoid system re-design and re-qualification. Our replacement capabilities are Analog, Digital, Mix Signal as well as old ASIC (standard cell and gate array) and FPGAs with the capability to offer 5V and 5V/3.3V core voltage.
Visit avnet-asic.com for more information or contact us at asic-solutions@avnet.eu.
OUR SERVICE FOR YOU:
• Logic Design • Verification • Emulation • Synthesis • Backend (Chip Layout) • Design for Test • Physical Verifications • Package Development • Production Test Program • Production Test H/W Development • Mass Production Logistics Management
4 5
ARM®
Arm
9
ARM
Cor
tex
A5
ARM
Cor
tex
A7
ARM
Cor
tex
A8
ARM
Cor
tex
A9
ARM
Cor
tex
A15
ARM
Cor
tex
A35
ARM
Cor
tex
A53
ARM
Cor
tex
A57
ARM
Cor
tex
A72
ARM
v7-A
Com
patib
le
ARM
Cor
tex
R4
ARM
Cor
tex
R5
Arm
Cor
tex
M0
Arm
Cor
tex
M0+
Arm
Cor
tex-
M23
ARM
Cor
tex
M3
Arm
Cor
tex-
M33
ARM
Cor
tex
M4
Arm
Cor
tex
M7
Digi • • • •Infineon • •Marvell • • • •
Maxim Integrated • • •Microchip • • • • •
Nordic • • •NXP • • • • • • • • • • • • • • •
Renesas Electronics • • • • • • • • • • • •STMicroelectronics • • • • • • •
Teledyne e2v • •Texas Instruments • • • • • • •
Xilinx • • • •
MCUs I MPUS
MC
U
MC
U W
irele
ss
MPU
x86
AMD • •Digi • • •
Echelon / Adesto • •Infineon • •
Intel • •ISSI •
Marvell • •Maxim Integrated •
Microchip • • •Nordic • •
NXP • • •ON Semiconductor • •
Renesas Electronics • • •Rohm •
STMicroelectronics • • •Teledyne e2v • • •
Xilinx •
OTHER
8 Bi
ts C
ore
16 B
its C
ore
32 B
its C
ore
RISC
-V
Echelon / Adesto proprietary
Infineon 8051 C166 Tricore
ISSI 8051
Maxim Integrated 8051 MAXQ MAXQ
Microchip AVR , PIC AVR, MIPS •
NXPHC08,
HCS08, LPC9x, 8051
ColdFire, ColdFire+, Power Architecture •
ON Semiconductor LC87, 8051
Renesas Electronics RL78 "RX100/200/600/700 V850, RH850"
Rohm 8051
STMicroelectronics STM8
Teledyne e2v ColdFire, ColdFire+, Power Architecture
Texas Instruments MSP430
Xilinx MicroBlaze, ARC, FPGA Soft Core
MCUs | MPUs
6 7
Switc
h &
Mux
Op
Amps
&
Com
para
tors
Cur
rent
Sen
se A
mps
Digi
tal P
ots
ADC
s &
DAC
s
Anal
og S
igna
l C
ondi
tione
rs
Ener
gy M
easu
rem
ent
AFE
Audi
o/Vi
deo
Proc
essin
g
Prog
ram
mab
le
Mix
ed S
igna
l
Volta
ge R
efer
ence
s
Cirrus Logic • • • • •Dialog Semiconductor • •
Diodes • • • • • •Elmos •
Maxim Integrated • • • • • • • • • •Microchip • • • • • • • •
Monolithic Power Systems • • • • •Nexperia •
NXP • • •ON Semicondutor • • • • • • •
Renesas Electronics • • • • • • • • •ROHM Semiconductor • • • • •
Semtech • • •STMicroelectronics • • • • • • • •
Teledyne e2v •
Analog Sensors
EnvironmentMotion
HMI & OthersAxis Sensors Speed/Position
Tem
pera
ture
Ligh
t/Pr
oxim
ity
Pres
sure
Hum
idity
Gas
/Sm
oke
Ultr
ason
ic
Mas
s Fl
ow
ToF
Rang
ing
Rada
r
Audi
o (M
ic.)
Acce
lero
met
er
Gyr
osco
pe
Com
pass
Hal
l
Mag
netic
Opt
ical
Indu
ctiv
e
Enco
der
Cur
rent
Touc
h Se
nse
IF
Imag
e
PIR
Con
trol
lers
3D S
ensin
g
Bios
ensin
g
Allegro • • • •Cirrus Logic •
Coilcraft •Dialog Semiconductor •
Diodes • • • • •*Elmos • • • •* •* • •*
Infineon • • • • • • •ISSI •
Maxim Integrated • • • •* •* • •Microchip • •* •* •* • •* • •
Monolithic Power Systems • •NXP • • • • • • •
ON Semicondutor • • • • • •*Renesas Electronics • • • • • • • • •
ROHM Semiconductor • • • • • • • • •*Semtech •
Sharp • • • •STMicroelectronics • • • • •* • • • • • • • •
TD next •Torex • •
*: signal conditioning only
8 9
DRAM NAND NOR MCP SRAM EEPROM
NVRA
M
Raw NAND Managed NAND Flash
Solid State Storage
EDO
& F
ast P
age
Mod
eSD
RAM
DDR
DDR2
DDR3
DDR4
GDD
R5RL
DRAM
Mem
ory
LPDR
AMDR
AM M
odul
es3D
NAN
DTL
C N
AND
MLC
NAN
DSL
C N
AND
Seri
al N
AND
Embe
dded
USB
Embe
dded
Mul
timed
ia C
ard
SD +
uSD
Car
dsC
F C
ards
PCM
CIA
USB
Flas
h Dr
ive
2.5"
mSA
TA
M.2
BGA
Para
llel N
OR
Flas
hSe
rial
NO
R Fl
ash
Oct
al N
OR
Flas
hN
OR-
Base
d M
CP
NAN
D-Ba
sed
MC
PAs
ynch
rono
us S
RAM
Sync
hron
ous
SRAM
Sync
hron
ous
DDR
SRAM
Sync
hron
ous
QDR
SRA
MSy
nchr
onou
s N
oBL
SRAM
Low
Pow
er S
RAM
Seri
al n
vSRA
M
Para
llel E
EPRO
Mv
Seri
al E
EPRO
M
MRA
M
Alliance • • • • • • • • • •Delkin Devices • • • • • • • • • •
Greenliant • • • • • • •GSI Technology • • • • •
Intel • • • •ISSI • • • • • • • • • • • • • • • • • • •
Macronix • • • • • • • •Mercury Systems • • • • • • • • • • • • •
Microchip • • • • • •Micron • • • • • • • • • • • • • • • • • • • • • • • • • •
On Semiconductor • • •Renesas Electronics • • • • • • •
ROHM • •SK Hynix • • • • • • • • • • • •
Smart Modular Technologies • • • • • • • • • • • •ST • •
Teledyne e2v • • • • • • • • • • • • • • • • • • • • •Western Digital • • • • • • • • •
Power
Hig
h Po
wer
WBG
(SiC
, GaN
)
Bipo
lar T
rans
isto
rs (>
1W)
MO
SFET
s
IGBT
s
MO
SFET
Mod
ules
IGBT
Mod
ules
IPM
Mod
ules
Diod
es
ESD
Prot
ectio
n &
TVS
Dev
ices
Thyr
isto
rs
Thyr
isto
r/ D
iode
Mod
ules
AC/D
C O
fflin
e
Pow
er F
acto
r Con
trol
lers
Line
ar &
LD
O R
egul
ator
s
DC
/DC
Con
trol
lers
DC
/DC
Con
vert
ers
PMIC
DC
/DC
Mod
ules
Volta
ge R
efer
ence
s
Gat
e Dr
iver
s
LED
Driv
ers
& C
ontr
olle
rs
Spec
ial P
ower
Fun
ctio
ns
Load
Sw
itche
s
Pow
er O
ver E
ther
net/
USB
Digi
tal P
ower
Batt
ery
Man
agem
ent
Mot
oion
Con
trol
RF P
ower
Wire
less
Cha
rgin
g
Pow
er M
agne
tics
EMI/
RFI/
LC F
ilter
s
Coilcraft x x x x x x x x x x x x x x • •Dialog Semiconductor • • • • • • • • •
Diodes • • • • • • • • • • • • • • • • • • •Elmos • • • • •
Infineon • • • • • • • • • • • • • • • • • • • • • • • • • •ISSI •
Maxim Integrated • • • • • • • • • • • • • • • • •Microchip • • • • • • • • • • • • • • • • • • • • • • •
Monolithic Power Systems • • • • • • • • • • • • • • • •Nexperia • • • • • •
NXP • • • • • • • • • • • • • • • • • • •On Semiconductor • • • • • • • • • • • • • • • • • • • • • • • •
Qorvo • • • •Renesas Electronics • • • • • • • • • • • • • • • • • • • • • •
ROHM Semiconductor • • • • • • • • • • • • • • • • • • • • • • •Semtech • • • • • • • • • • • • • •
STMicroelectronics • • • • • • • • • • • • • • • • • • • • • • • • • • • •Torex • • • • • • • • • • • • •WeEn • • • •
x: associated components
Memory
10 11
Wireless
C = Chip; M = ModulesG = LoRaWAN Gateway
S = LoRaWAN sensorFEM = Front End Module
* = Automotive market
NFC
/RFI
D
Sub
1GH
Z
Zigb
ee
Thre
ad
Prop
riet
ary
2.4
GH
Z
Blue
toot
h
WIF
I
Cellular
DEC
T
Loca
tion
Sigf
ox
Lora
2G, 3
G, 4
G
LTE
cat.
M1
LTE
cat.
NB1
5G
Azurewave M M
Dialog CM CM M
Digi International M M M M M
Laird M M M M M
Marvell C C
Microchip CM CM CM CM CM
MiroMico MGS
Nordic C C C C M M
NXP C C CM C CM CM C
ON Semiconductor C CM CM C CM C CM
Qorvo* C C C C FEM FEM FEM FEM FEM
Quectel M M M M M M M
Raytac M
Renesas CM
Semtech C C C
STMicroelectronics C CM C C CM M C C
TD-Next M
Datacom
10/1
00 E
ther
net
1G E
ther
net
2.5G
Eth
erne
t
10G
Eth
erne
t
25G
Eth
erne
t
40/5
0G
100G
Eth
erne
t
Opt
ics
Tim
ing
Sign
al In
tegr
ity
SAS
SATA
Indu
stri
al E
ther
net
PCIe
Oth
ers
Diodes • • •Finisar •
Halo •Infineon • • • •
Intel • • • • • • • • • • • • •Marvell • • • • • • • • • • •
Maxim Integrated • •Microchip • • • • • • • • • • • • •Nexperia • •
NXP • • • • • • • • • • •ON Semiconductor • • •
Renesas Electronics • • • • •STMicroelectronics • •
12 13
Programmable & System-on-Chip (SoC)
Security
Tech
nolo
gy (F
lash
/SRA
M)
Low
Pow
er C
apab
ilitie
s
Low
-den
sity
FPG
A (fr
om 0
to 15
0k L
C)
Mid
-Den
sity
FPG
A (fr
om 0
to 5
00k
LC)
Hi-
Den
sity
FPG
A (fr
om 0
to 2
M L
C)
Ultr
a-hi
gh d
ensi
ty F
PGA
(from
0 to
5.5
M L
C)
Def
ense
-Gra
de F
PGA
Spac
e-G
rade
FPG
A
Auto
mot
ive-
Gra
de F
PGA
DSP
Mul
ti G
b/s
Seri
al I/
O
10M
/100
M/1
G E
ther
net
100G
Eth
erne
t
Inte
rlak
en
PCIe
ARM
Cor
tex
A9 p
roce
ssor
(up
to)
ARM
Cor
tex
A53
proc
esso
r (up
to)
ARM
Cor
tex
R5 c
ontr
olle
r (up
to)
ARM
Cor
tex
M3
cont
rolle
r (up
to)
RISC
-V
GPU
H26
4/H
265
Vide
o C
odec
14bi
t RF-
DAC
w/u
p to
10G
SPS
DUC
14bi
t RF-
ADC
w/u
p to
5G
SPS
DDC
RF in
put M
ax F
req.
(GH
z)
SD-F
EC
Dec
imat
ion/
Inte
rpol
atio
n
Xilinx
Virtex-5 QV 65 • • • • soft
Spartan 6 45 • • • • • • soft Gen1x1
Spartan 7 28 • • • • soft • •Artix 7 28 • • • • • • • soft Gen2x4 • •
Kintex 7 28 • • • • • • soft Gen2x8 • •Virtex 7 28 • • • • • soft Gen3x8 • •Kintex
Ultrascale 20 • • • • • soft • 150G Gen3x8 • •Virtex
Ultrascale 20 • • • • • soft • 150G Gen3x8 • •Kintex
Ultrascale + 16 • • • • • soft • 150G Gen3x16/Gen4x8 • •
Virtex Ultrascale + 16 • • • • • soft • 150G Gen3x16/
Gen4x8 • •Zynq 7000/S 28 • • • • • • • • Gen2x4/
Gen2x8 2x soft soft
Zynq Ultrascale + 16 • • • • • • • • • • 150G
Gen2x4/ Gen 3x16 / Gen4x8
4x 2x soft soft Mali 400MP2 •
RFSoC 16 • • • • • • 150G Gen2x4/ Gen 3x16 / Gen4x8
4x 2x soft softup to 16
up to 16
up to 6GHz
up to 8
up to
40x
Microchip
ProASIC3 130 • • • •IGLOO 130 • •
SmartFusion 2 65 • • • • • •(hard MAC) / 10G
Gen2x4 (EP) 1x
IGLOO2 65 • • • • • • •(soft IP) / 10G
Gen2x4 (EP) soft
PolarFire FPGA 28 • • • •(soft IP) / 10G
6.375G, 12.7G
Gen2x2 (RC/EP) soft
SX-A Antifuse 0.22µ • • •
Axcelerator Antifuse 0.15µ • • •
Use Cases
Secu
re B
oot M
CU
Secure Element ( SE)
Tran
spor
t Lay
er S
ecur
ity (T
LS)
Dat
agra
m T
rans
port
Lay
er S
ecur
ity (D
TLS)
Phys
ical
Unc
lone
able
Fun
ctio
n PU
F)
Cer
tifica
tion
Avai
labl
e
Key
Prov
isio
ning
by
Avne
t Sili
ca
Low
Pow
er
FPGA / SoC Anti-Tamper
With Operating System (OS) Without Operating System (OS) Passive Active
Bran
d Pr
otec
tion
Usag
e C
ontr
olSe
cure
FW
Upd
ate
Loca
l Net
wor
k (In
tran
et)
Exte
rnal
Net
wor
k (In
tern
et)
Java
Car
d O
STP
M O
SPr
opri
etar
y O
SSi
ngle
Aut
hent
icat
ion
Mut
ual A
uthe
ntic
atio
nSy
mm
etri
c En
cryp
tion
Asym
met
ric
Encr
yptio
nEC
CRS
APu
blic
Key
Infr
astr
uctu
re (P
KI)
Rem
ote
Key
Prov
isio
ning
Sing
le A
uthe
ntic
atio
nM
utua
l Aut
hent
icat
ion
Sym
met
ric
Encr
yptio
n As
ymm
etri
c En
cryp
tion
ECC
RSA
AES2
56 (B
BRAM
& e
FUSE
), Se
cure
Con
fig/
Bo
ot (P
L /
PS),
Har
dene
d Re
adba
ck D
isab
le,
Dec
rypt
then
Aut
hent
icat
e
SEU
Che
ckin
g, J
TAG
Dis
able
/Mon
itor (
BSC
AN),
Inte
rnal
Key
Cle
ar, I
nter
nal C
onfig
Mem
Cle
ar,
Uniq
ue Id
entifi
er D
evic
e (D
NA)
, On-
chip
Tem
p/Vo
lt M
onito
ring,
PRO
G_B
Inte
rcep
t, U
niqu
e Id
entifi
er (U
ser e
FUSE
)
Digi International • • • • • • • • • • • • • • • •Infineon • • • • • • • • • • • • • • • • • • • •
Intel • • • • • • • • • • • • • • • • • • • • • • • • •Marvell • • • • • • • • • • • • • • • • •
Maxim Integrated • • • • • • • • • • • • • • •Microchip • • • • • • • • • • • • • • • • • • • •
NXP • • • • • • • • • • • • • • • • • • • • • • • • • • •Renesas Electronics • • • • • • • • • • • • • • • • • • • • •STMicroelectronics • • • • • • • • • • • • • • • • • • • •
Trusted Objects • • • • • • • • • • • • • • • • • • •Xilinx (FPGA / SoC) • • • •
14 15
LEDs Low Power Mid Power High Power COBs Modules Light Engines Display/signage
CREE • • • • •Lumileds • • • • • •
Seoul Semiconductor • • • • • •
Lighting
Bender+Wirth •LEDIL •
HOLDERS
Mid Power High Power COBs High Voltage
0,3 - 0,9 W 1 - 4 W 4 - 10 W
Mechatronix • • • •
THERMALMANAGEMENT
Low Power Mid Power High Power COBs Modules
Gaggione • • • • •LEDiL • • • • • •
OPTICS
Diodes Elmos Infineon
ISSI Maxim Integrated NXP
ON Semiconductor STMicroelectronics
LED DRIVERS
LEDs Optics
COB Holders Power Thermal Management
LED Drivers
POWER Power Topology Indoor Outdoor Dimming Options Programmable Wireless
Delta Electronics 15-1500 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI Current, Clock, Constant Light •
Lifud 1-250 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI Current, Clock,Constant Light
Moons 12 - 320 W CV, CC, CP • • AC, 0-10V, R, PWM, DALI, DMX/RDM
Current, Clock, Constant Light •
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Saint Petersburg Phone: +7 812 245 1571 stpetersburg@avnet.eu
SLOVAKIABratislava Phone: +421 232 242 211 Fax: +421 232 242 210 bratislava@avnet.eu
SLOVENIA (BOSNIA AND HERZEGOVINA, CROATIA, MACEDONIA, MONTENEGRO, SERBIA)Ljubljana Phone: +386 156 097 50 Fax: +386 156 098 78 ljubljana@avnet.eu
SPAIN Barcelona Phone: +34 933 278 530 Fax: +34 934 250 544 barcelona@avnet.eu
Galdàcano. Vizcaya Phone: +34 944 572 777 Fax: +34 944 568 855 bilbao@avnet.eu
Las Matas Phone: +34 913 727 100 Fax: +34 916 369 788 madrid@avnet.eu
SWEDENSundbyberg Phone: +46 8 587 461 00 Fax: +46 8 587 461 01 stockholm@avnet.eu
SWITZERLANDRothrist Phone: +41 62 919 555 5 Fax: +41 62 919 550 0 rothrist@avnet.eu TURKEY (GREECE, EGYPT)Kadikoy Istanbul Phone: +90 216 528 834 0 Fax: +90 216 528 834 4 istanbul@avnet.eu
UNITED KINGDOM (IRELAND)Berkshire Phone: +44 1628 512 900 Fax: +44 1628 512 999 maidenhead@avnet.eu
Bolton Phone: +44 1204 547 170 Fax: +44 1204 547 171 bolton@avnet.eu
Bucks, Aylesbury Phone: +44 1296 678 920 Fax: +44 1296 678 939 aylesbury@avnet.eu
Stevenage, Herts, Meadway Phone: +44 1438 788 310 Fax: +44 1438 788 250 stevenage@avnet.eu
ISRAELTel-MondPhone: +972 (0)9 7780280Fax: +972 (0)3 760 1115avnet.israel@avnet.com
SOUTH AFRICACape Town Phone: +27 (0)21 689 4141 Fax: +27 (0)21 686 4709sales@avnet.co.za
DurbanPhone: +27 (0)31 266 8104 sales@avnet.co.za
JohannesburgPhone: +27 (0)11 319 8600 Fax: +27 (0)11 319 8650sales@avnet.co.za
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