Post on 27-Mar-2015
Slide 1
2006 Interconnect Update
– Mandeep Bamal– Christopher Case– Alexis Farcy– Robert Geffken– Dirk Gravesteijn– Harold Hosack
– Mauro Kobrinsky
– Tomoji Nakamura
– Eric Ou-Yang– Michele Stucchi– Detlef Weber– Osamu
Yamazaki
Slide 2
2006 IRC Feedback and Errata
• Should Printable Electronics be addressed?
• Table and figure numbering errors (multiple)
• Missing reference to reference• Error in keff Long Term 2014
Slide 3
Dynamic Power• Increasing concern about rising dynamic
power in the interconnect stack• Influence of number of functions (N),
activity (A) and frequency (F)• Potential new performance metric • Impacts effective k roadmap
– Drives reduction in parasitic capacitance
P = (NAF)CV2
Slide 4
Multi-core impact on interconnect• Need to consider splitting metrics into:
– In-core (intra-tile)– Inter-core (inter-tile)
• New bandwidth requirements
• Wiring lengths change– Critical path reduced (in core)– Mechanical integrity challenges will change– Jmax changes– Hierarchical structure may no longer be necessary
• Converge to more fine pitch local/intermediate wires
• Power and ground delivered through grid– Global delay challenge relaxed– 3D may include multi-core