The 5G revolution is here. We arecurrently seeing uptake of the technologyled by the Sub-6GHz frequency rangeapplication. Qualcomm, one of the majorplayers in this segment, has claimed over230 design wins in development oralready launched on the market. Only asmall fraction of these smartphones is 5Gmillimeter wavelength (mmWave) rangecompatible, mainly represented bySamsung. Last year, Samsung released itsmmWave version of its flagship Galaxy S105G in America in partnership withQualcomm, which supplies the completechipset. This year, Samsung renewed thepartnership and is offering the latestgeneration of Qualcomm’s 5G mmWaveChipset in its Galaxy S20 Ultra 5G.

Like the previous generation, thecomplete solution has been especiallydesigned for smartphone applications,starting with Samsung and expected tospread to others designs. The module inthe Samsung Galaxy S20 Ultra 5G comeswith five systems spread throughout thesmartphone. The first System-in-Package(SiP) is the baseband processor, whichuses standard Ball Grid Array (BGA) SiPPackaging. The second is the 5G mmWavereceive/transmit (Rx/Tx) which usesstandard flip-chip ball grid array (FCBGA)packaging. The other systems arecombined in the antenna-on-package(AoP) module, which is spread around thecorner of the smartphone in order toprovide spherical coverage without anyhand-blocking constraints.

Two versions of the antenna modules areintegrated into the flagship. The firstversion comes with a dipole antennacoupled with a patch antenna system. Thepatch antenna system is designed toprovide wide-band polarized radiation.Among the innovations in the antennadesign, Qualcomm seems to integrate twotypes of antenna patch in the same formfactor. One is a Coupled Feed Antenna,and one is a Dual-Polarized and Dual BandPatch Antenna. Moreover, the design inthe routing, in the filtering and in thetransceiver has led to a better stability interms of power emission.

This report includes a full investigation ofthe system, featuring a detailed study ofthe SiPs, including die analyses, processesand board cross-sections. It contains acomplete cost analysis and a selling priceestimation of the system. Finally, itfeatures a technical and cost comparisonwith the structure of the first generationof 5G mmWave chipset from Qualcomm.

COMPLETE TEARDOWN WITH

• Detailed photos and cross-sections

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• Comparison with first generation of Qualcomm’s 5G mmWave chipset

A study of the complete second generation of the 5G millimeter-wave chipset forhandset applications, including the baseband modem SDX55M, the transceiverSMR526 and Antenna-on-Package QTM525.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Qualcomm’s Second Generation 5G mmWaveChipset, from Modem to Antenna

Pages: 216

Date: May 2020

Format: PDF & Excel file

Price: EUR 3,990

Reference: SP20517

Qualcomm’s Second Generation 5G mmWaveChipset, from Modem to Antenna

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

TABLE OF CONTENTS

Overview/Introduction

Company Profile and 5G Technology

Samsung Galaxy S20 Ultra 5G Teardown

Market Analysis

Physical Analysis

• Physical Analysis - Methodology• Module analysis Module view: Dimensions,

marking, integration and block diagram

• Baseband processor and Rx/TxPackage analysis

Package view and dimensions, opening and bill of material, cross-section: PCB, dimensions and process analysis

• Antenna SiP analysis: V1 and V2 Package view and dimensions,

opening and bill of material,

cross-section: PCB, dimensions and process analysis

Package X-Ray: overall view, PCB routing, antenna structure, cross-sections

• Die Analysis: Baseband processor, Rx/Tx, transceiver, PMIC

Die view and dimensions, delayering and main block IDs, cross-section and process

• Physical analysis comparison Qualcomm’s first vs. second

generation of 5G mmWavechipsets

Manufacturing Process Flow

• Die fabrication unit: Baseband processor, Rx/Tx, transceiver, PMIC

• SiP packaging fabrication unit• PCB & AoP fabrication process

flow

Cost Analysis

• Overview of the cost analysis• Supply chain description• Yield hypotheses• Die cost analyses: Baseband

Processor, Rx/Tx, Transceiver, PMIC

Front-End (FE) cost Wafer and die cost

• Baseband, Rx/Tx and Antenna Package Cost Analysis

Packaging assembly cost Packaging cost by process step

• Final test cost and assembly• Component cost• Cost analysis comparison Qualcomm’s first vs. second

generation of 5G mmWavechipsets

Estimated Price Analysis

AUTHORS

QUALCOMM’S SECOND GENERATION 5G MMWAVE CHIPSET, FROM MODEM TO ANTENNA

RELATED REPORTS

Stéphane Elisabeth, PhD has joined System Plus Consulting's team in 2016. Stéphane is Expert Cost Analyst in RF, Sensors and Advanced Packaging. He has a deep knowledge of materials characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.

Dr. Youssef El Gmili has joined System Plus Consulting's team in 2019 after ten years passed on high level research and development on microelectronics. He has a deep knowledge in the study and analysis of semiconductors Materials. He holds a Master Degree in Microelectronics, and a Phd in Physics/Materials Science.

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset for handset applications.September 2019 - EUR 3,990*

Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar ChipsetWorld’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.April 2020 - EUR 3,990*

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture RecognitionDeep dive into the first Human Machine Interaction (HMI) system with Infineon’s 60 GHz Radar On-Chip AoP BGT60TR13C and Knowles’ DSP IA8508.April 2020 - EUR 3,990*

Nicolas Radufe is in charge of physical analysis at System Plus Consulting. He has a deep knowledge in chemical and physical analyses. He previously worked in microelectronics R&D for CEA/LETI in Grenoble and for STMicroelectronics in Crolles.

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