PTW Asia & Epicrew PresentsASM EPI Systems Upgrade

( XE2 )

2021

Target Equipment: ASM Epsilon(1 or 2) / E2000(+)

Background Information

Current Tool Design:

• Expensive / Obsolete OEM parts• Throughput & Particle performance cannot be improved• Software Limitations

• Lack of Process Control• Eg: No real-time monitoring through FDC

• Hardware Limitations• Does not allow narrow boundary layers (limited growth rate)

To improve upkeep and extend equipment life with

low Cost Of Ownership (COO) by:

1. Replacement to more robust hardware

• New models (non-obsolete)

2. Replacement of controller with new software• New features

3. Achieve better Process performance• Throughput• Particle

Our Upgrade Focus

XE2 Upgrade Items Summary

• New WHC (Transfer chamber) design• New Robot selection: JEL (CE Approved)• New Wafer blade design• New slit valve selection: VTEX (Japanese)• New Single cooldown station inside WHC• New Rotation modification• Improved Process kit design• New Controller with software• New Software screen design and function• Eliminated Foxboro and manage in software• SMIF control design for CHAD model• SECS communication function• WHC auto leak check function

XE2 Upgrade

*Finished first customer evaluation in Japan

XE2

Throughput Improvement

Throughput Improvement - CoolDown (CD) Station

ASM & XE2 Comparison – Wafer Cooling

Throughput Improvement (CD Station)

Recipe on XE2 System: ~9850 seconds to run 25 wafers (With Cooldown Station)

*Scheduler Information for Every Wafer Etch

25/10/2020 16:54 Information Job Scheduler.exe Scheduler Lot 'Left Lot #1' Started

25/10/2020 19:38 Information Recipe Scheduler.exe Scheduler Wafer completed SLOT recipe (CYCLE TEST STD) completed for Cassette 1/Slot 26 at wand

About 6% Improvement with Cooldown Station

Recipe on ASM System: ~10450 seconds to run 25 wafers

Quality Improvement

Quality Improvement - Backside Handling for Particle Reduction

Backside Wafer Handling◆ Cost reduction for

eliminate N2 Gas◆ Reduce particle

Side View: XE2 Wand (Backside Handling)

Wafer

Wand

<- N2

Wafer

Wand

Side View: ASM Bernoulli Wand (Frontside Handling)

ASM Bernoulli Wand

Damaged N2 Holes

Designs with Particle Reduction Focus

New type Gate Valve ◆ Reduce particle◆ Roll cam L-motion

Cooldown Station◆ Low particle impact from LLC

Bellows due to high positioning during cool down

Particle Performance Improvement<Particle Test>Tool Model : SP1Spec : ≦30 (≧0.2µm)

Result :1st wafer : 02nd wafer : 13rd wafer : 04th wafer : 2

<Slip>Tool Model : SP1Spec : ≦1000 line, length≦10,000mm

Particle count on old system at other customer site: ~20-30 counts.

Particle Performance: ~90% Improvement!

New Controller

New Controller Upgrade

Before AfterVS

1. EPIC controller is confirmed by OEM2. Replacement for the obsoleted Gespac-based legacy control system for the ASM Epsilon E2000 & E2000plus (E3200 is possible with additional development)3. Able to replace from Gespaccontroller space (No need for additional space)

Gespac-Based EPIC Controller

Software UpgradeNew Added Features◆ EPIC eliminates the use of Foxboro cards◆ Direct TC input◆ Drives the E2000 SCR directly◆ Changeable SCR ratio each step in the recipe◆ Easy setting SCR power – Adjustable without adjustment of PCB potentiometer◆ Visible all SCR power on the one screen◆ Easy trouble shooting by defect zone determination◆ I/O charting and plotting – Datalogging and SECSGEM / HSMS◆ Enables Multi-Dep / 1 Etch sequence

Multiple Dep 1 Etch Capability

Scheduler Information for 2 Dep 1 Etch

cassette 1:20) doing step 1 (START) with 1 s duration

cassette 1:20) doing step 2 (HTNLC) with 32 s duration

cassette 1:20) doing step 3 (PREETCH) with 25 s duration

cassette 1:20) doing step 4 (PURGE) with 3 s duration

cassette 1:20) doing step 5 (COOL1) with 12 s duration

cassette 1:20) doing step 6 (COOL2) with 10 s duration

cassette 1:20) doing step 7 (HOMSUS) with 12 s duration

cassette 1:20) doing step 8 (TCHECK) with 100 ms duration

cassette 1:20) doing step 9 (END) with 1 s duration

Etch

Depo

Throughput can be further improved by testing shorter Etch timeNeeds to be co-developed with customer

Upkeep Cost Improvement

Lower Upkeep Costs

No more need for:◆ Foxboro Boards / repair◆CompuMotors Driver repair◆Bernoulli Wand repair

Upkeep Cost Improvement

More Robust and New Parts:◆New WHC design◆ JEL Robot (CE Approved)◆New Rotation Assy design◆New Susceptor design◆New SMART motors

Wafer Handling Chamber (WHC)

SMART Motor – Built-in Driver Susceptor

Rotation Unit

JEL Robot

Thank YouFor Enquiries Please Contact:

Name: Torsten Seifried (Managing Director)

Telephone: +65 90261590

Email: torsten@ptwsingapore.com

Name: Don Yeoh (S.E.A. Sales Manager)

Telephone: +65 91784446

Email: don.yeoh@ptwsingapore.com

PTW Asia Pte. Ltd.