Packaging of Integrated Photonic Devices;

Applications, User Foundry Services & Design Rules

Dr. Peter O’BrienHead of Photonics Packaging Group,Tyndall National Institute

Deputy Director, Science Foundation Ireland,Irish Photonics Integration Centre

Tyndall National Institute

• Photonics• Microsystems• Nanotechnology• Theory Modelling & Design

Ireland’s Largest Research Institute

Photonic Integration at Tyndall

Photonic Integration Laboratory

Monolithic Integration

Hybrid Integration

Photonic Integration

Single Mode Optical Fibre

Photonic Integrated Circuit

Electronic Integrated Circuit

Discrete Electronics

Ceramic Interposer

Temperature Control

Photonic Integration (Many Challenges)

Optical Integration (Fibre Coupling)

1. Edge Coupled

2. Grating Coupled

Challenge: Fibre couplingto sub-micron waveguides

Optical Integration (Fibre Coupling - Silicon)

10 mm

Optical Integration (Fibre Coupling)

Optical Integration (Fibre Coupling)

1dB ± 2 mm

Inser

tion

Loss

(dB)

Wavelength (nm)

“Packaging Process for Grating-Coupled Silicon Photonic Waveguides Using Angle-Polished Fibers”,B. Snyder and P O’Brien, IEEE Trans on Comps, Packaging and Manufacturing Tech., Vol. 3, No. 6, June 2013.

Optical Integration (Fibre Coupling - Silicon)

Fibre Array

Flipchip IC

Optical Integration (Fibre Coupling Arrays - Silicon)

electrical connections(flexible substrate)

ceramic substrate(active alignment)

pick & place collet

SOI waveguide

Alignment over waveguide grating(packaging equipment vision system)

Optical Integration (Sources - Lasers)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

-0.016 -0.012 -0.008 -0.004 -2.19E-16 0.004 0.008 0.012

Co

up

ling

Effi

cie

ncy

(%

)

Vertical Offset (mm)

Ball lens height toleranceto couple into SOI grating

0

0.1

0.2

0.3

0.4

0.5

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0.163 0.165 0.167 0.169 0.171 0.173 0.175 0.177 0.179 0.181

Co

up

ling

Effi

cie

ncy

(%

)

Laser to Lens Distance (mm)

Laser placement toleranceto couple into SOI grating

Manufacturing tolerancesdesigned using Zemax

Optical Integration (Sources - Lasers)

AuSn solder(laser pad)

Ball lens mounting

optical via

AlN ceramic submounts for laser integration on Silicon

1.4 mm

Optical Integration (Sources - Lasers)

fibre output

laser connection

device on Peltier

electrical input

tunable laserAlN substrate

“Hybrid integration of wavelength-tunable

laser with silicon photonic integrated circuit”,

B. Snyder, B. Corbett and P O’Brien, IEEE,

Journal of Lightwave Tech., Vol. 31, No. 24, Dec

2013.

Optical Integration (Sources - Lasers)

Electronic IC

Si Photonic IC

Grating Couplers

RF Input

Electronic IC

Si Photonic IC

20 mm Copper PillarSnAgCu Solder Cap

Flipchip Integrated Photonic-Electronic Sub-Assembly

DC Inputs

Electronic Integration (Drivers, Modulators, …)

Solder Sphere Jetting (50 mm Spheres)

Electronic Integration (Drivers, Modulators, …)

MSMP (RF) Connectors

Photonic Device

Temperature Control

Rogers-4350B Interposer(3 Layer PCB)

Electronic Integration (Drivers, Modulators, …)

MSMP (RF) Connectors

Si PIC

T ~ 15 CEIC

Thermal Effects

Photonics Integration (Medical Devices)

340 mm

guidewire

Fermoral artery

Blood Flow Analyser

- optical fibre in guidewire

- maintain guidewire diameter

- maintain guidewire flexibility

Photonics Integration (Vascular Guidewires)

optical sidefire

3m guidewire

Trials at CUH

Photonics Integration (Vascular Guidewires)

Design DeviceWafer Fab Packaging

European Integrated Photonics Foundries (Silicon)

Electronic Packaging

Fibre Packaging

Photonic Integration Design Rules (Design Kit)

We want to avoid this …

Photonic Integration Design Rules (Design Kit)

Summary

Research Commercialisationlevel of development

Re

sou

rce

sMPW Foundry Services