Market Focus

ECOC 2013

Ed Murphy

Optical Integration for 100G Interfaces

© 2013 JDS Uniphase Corporation 2

Evolving 100G Component and Modules

Platform Technologies

10G – historical perspective

100G Line side

100G Client side

Topics

© 2013 JDS Uniphase Corporation 3

Optical Transmission Transition

• Once in a decade change

Evolution of optical technology

• 1-3 year evolution becoming clear

- LH, Metro: Line card (discrete component) solutions CFP, CFP2

- Client: CFP CFP2, CFP4, QSFP28

- iTLA/LN modulator monolithic InP devices

- Higher Baud rates

- Multi-component integration

Introductory remarks

© 2013 JDS Uniphase Corporation 4

Lithium Niobate

(LiNbO3)

Modulators

Gallium Arsenide

(GaAs)

VCSELS

Silica on Silicon

Passive Lightguide

Circuits (PLC) AWGs

Coherent Mixers

Pol Mux

Platforms for Photonic Integration

Indium Phosphide

(InP)

Lasers

Modulators

Receivers

4

© 2013 JDS Uniphase Corporation 5

Tunable XFP functional integration drives:

• 85% smaller size

• 75% less power consumption

• Cost reduction

JDSU T-XFP technology replaces:

• Fixed XFP’s in 2009

• Metro/Regional transponders in CQ3 2010

• Long Haul transponders in CQ1 2011

Shipped >>100,000 Tunable XFP’s

10G History

5

Tunable XFP 300 PIN MSA

Discrete Tunable Laser and Modulator

Before Now

ILMZ Chip

MZM

SGDBR laser

SOA

© 2013 JDS Uniphase Corporation 6

10G Tunable – Further transition

Smaller Size & Lower Power Dissipation

T-XFP

Zero chirp, PiN

• Tunable market consolidating on T-XFP in near term

• The smallest, lowest power dissipation (T-SFP+) will

be most widely adopted over longer term

T-XFP

High Power

Negative chirp, APD

T-XFP

Negative chirp, APD

T-SFP+ 2W

NC, APD, Limiting

T-SFP+ 2W

NC, APD, Linear

T-SFP+ 1.5W

NC, APD, Limiting

T-SFP+ 1.5W

NC, APD, Linear

T-SFP+ 2W E-temp

NC, APD, Limiting

Monolithic Integration for

100G Line Side Transmitters

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Monolithic Tunable Laser 100G Coherent Transmission

SGDBR Laser Design

• Benefits: cost, monolithic integration

• BUT: linewidth broadening due to current injection

Requirements for Coherent Systems

• Narrow Spectral Linewidth

- QPSK – < 500KHz

- 16QAM – < 300KHz

• High output power

- > +16dBm

• Low power dissipation

DP-QPSK 16-QAM

Front

Mirror Gain Phase

Rear

Mirror

SG-DBR Laser

Amplifier Modulator

© 2013 JDS Uniphase Corporation 9

• Thin-film micro-heaters for mirror and phase sections

• Thermal tuning eliminates tuning-induced loss which degrades

linewidth and power conversion efficiency

• Thermal isolation between thermally tuned sections and substrate for

reduced power dissipation

Thermally tuned SGDBR Laser

Front

Mirror Gain Phase Back

Mirror SOA

microheaters

InGaAsP

MQW active

regions

Q1.3 tuning

waveguide

Sampled

gratings Thermal

isolation

Light

output

InP substrate

© 2013 JDS Uniphase Corporation 10

Thermally Tuned Laser Efficiency

Significantly improved slope efficiency compared to previous generation current-injection device

0

5

10

15

20

25

0 20 40 60 80 100 120

Gain Current (mA)

SO

A R

eve

rse

Ph

oto

cu

rre

nt (m

A)

↑

Carrier injection

tuned SGDBR,

Thermally tuned SGDBR

© 2013 JDS Uniphase Corporation 11

0

0.1

0.2

0.3

0.4

0.5

0.6

191000 192000 193000 194000 195000 196000Optical Frequency (GHz)

Lin

ew

idth

(M

Hz).

25

30

35

40

45

50

55

Sid

em

od

e S

up

pre

ssio

n R

atio

(d

B).

Thermally Tuned Laser: Linewidth and SMSR

<300kHz worst case linewidth and >40dB SMSR

© 2013 JDS Uniphase Corporation 12

100G Integration for Size and Power reduction

Smaller size, lower power dissipation

CFP

ASIC inside

CFP2

ASIC outside

OIF Transponder

5” x 7”

100W

InP

Laser/Modulator Compact PLC Rx

© 2013 JDS Uniphase Corporation 13

Packaging options for InP I/Q modulators

TEC

TEC

TEC

C-band laser +SOA/VOA DP-IQ modulator

TEC

Micro

optics pol

MUX and

power

monitors

+ VOA

Locker &

power

monitor +

Coupling

optics

Micro optics

pol MUX

and power

monitors

Micro optics

pol MUX +

Locker +

Power

monitors

Locker &

power

monitor +

Coupling

optics

Performance, cost, power and size advantages

to monolithic integration

Separate

packages

Co-

packaging

Monolithic

© 2013 JDS Uniphase Corporation 14

InP MZ for 28Gb/s OOK, 100Gb/s DP-QPSK, 200Gb/s QAM

2D Normalized output power, dB 1.4 mm MZ

MZM = 1.4mm long; Vpp = 0.9V/arm

30Gb/s Electrical Input

Traveling wave electrode design; shallow ridge technology

Vpp = 1.8V/side for QPSK

© 2013 JDS Uniphase Corporation 15

Lithium Niobate Nested MZ Modulators are used in of the most 40G and 100G coherent systems today

• Pure Phase Modulation

• Highest Bandwidth Available

• Low voltage operation (< 3V)

Future

• Will continue to enable very high performance links

• Higher baud rates for 200G applications

- Lower Density constellations for improved OSNR (longer reach than QAM)

43 Gbaud 8PSK

64 Gbaud QPSK

Lithium Niobate Technology Evolution

Hybrid Integration for 100G

Client Side Interfaces

© 2013 JDS Uniphase Corporation 17

4 EML devices on carriers

AWG MUX with integrated taps

Integrated PD monitor array

4x25G PIN array bonded on

carrier with quad TIA

PLC de-multiplexer

• High ∆n AWG design

100G LR4 TOSA

100G LR4 ROSA

Hybrid Integration for client optics

Compact solution compatible with CFP2/CFP4/QSFP28

© 2013 JDS Uniphase Corporation 18

Meets LR4 and ER4 requirements

Driver power dissipation ~200 mW/channel

100G TOSA EML based TOSA performance

(a) (b)100G TOSA @ 28Gb/s PRBS 231-1

ER>5dB, MM>40%, Vpp=1.2V ER>9dB, MM>40%, Vpp=1.5V

© 2013 JDS Uniphase Corporation 19

Support line rates of 103.125 Gbps or 111.81 Gbps

Operating temperature range of up to -5ºC to 70ºC

Low power dissipation

MM> 15% at 27.9525Gbps/Channel

100G LR4 CFP2 Transceiver Module

© 2013 JDS Uniphase Corporation 20

Optical Integration has enabled cost, size, power savings for tunable 10G interfaces

We are beginning to see a migration to integrated solutions in 100G applications which are necessary to enable CFP, CFP2, CFP4, QSFP28

Optimized solutions require a mix of monolithic and hybrid integration

Summary