nCapsulate free-form: plastic encapsulation for

MEMS and Sensors

Delivering system benefits by embedding mechanical and electronic elements

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Mission

Our mission is to be world class competence center offering development and manufacturing of functional semiconductor assembly solutions.

– Focus on (MEM’s) sensor systems.

– Development from scratch to a manufacturing solution.

– Meeting quality demand of Automotive industry.

4

Facts & Figures

• Young company with a long history (since 1987)

• Development & production in the Netherlands

• Captive volume assembly in the Phillipines

• TS16949 & ISO 14001 certified

• > 100,000,000 sensor assemblies for automotive

• Move to Novio Tech Campus Nijmegen November-2015

5

Proposition

• Core business:

– Development of functional plasticencapsulation solutions.

– Volume manufacturing of functional packaging.

• Other services:

– Ceramic / plastic fast turn prototyping

– Product & process qualification

– Component supply management

– Wafer processing

Development for manufacturing

– From packaging idea to manufacturing solution.

– Design for manufacturing.

– Local industrialization assures manufacturable solution.

Transfer intomanufacturing

Packagedevelopment& prototyping

IndustrialisationConcept

engineering

SENCIO

Research institutes

Volume manufacturers

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Functional encapsulation solutions

Sensor types

Pressure Gas/fluid Optical Acceleration Magnetic

Overmolded

Premolded

Globtopovermolding

Exposed die molding

Glass on die

nCapsulate

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Key aspects for (MEMS) sensors

• Access of the environment to the (sensor) chip surface

– Chemicals

– Blood

– Others…

• Protection of sensitive electronics against this environment

– Interconnect; wired interface of Sensor (bond pads)

– data processing IC.

– Other active or passive components

Exposed die molding

Sensor types

Pressure Gas/fluid Optical Acceleration Magnetic

Overmolded

Premolded

Globtopovermolding

Exposed die molding

Glass on die

nCapsulate

Exposed die molding

Principal:– Overmolding with duroplast leaving only the sensor

area free of molding compound.

– Gold wires encapsulated, sensor area exposed.

Technologies:– Patented insert technology.

– FAM molding technology

Exposed die molding

Highlights:

– Interconnection reliability similar to standard plastic packaging

– Ideal solution for harsh environments

– Applicable for a wide range of plastic packages

– Cavity format & size can be tuned to the application, through hole has been achieved

– Can be applied with multi chip [sensor(s) + ASIC]

– Automotive application for temperatures up to 150°C

Insert or FAM technology

• Cavity Ø 900 µm.

400 µm

Soft-touchtm

technology

MICROCAVITY by SOFT TOUCH™

QFN package 4x4mm.

NEW

Soft touchtm & FAM

• Cavity Ø 400µm

• Cavity Ø 200µm (in development)

Oil pressure sensor package

Outline:• SOIC 24 wide body outline.

Advanced Technologies:• Integrated passive components

• Multichip module

• Exposed die overmoldng

• pressure sensor with only

pressure hole exposed.

Mission Profile notes:• Oil pressure measurement

• Lifetime immersed in motor oil.

• Temperature -40 to 150°C

Product developed by Hella Fahrzeugkomponenten GmbH

Package developed by Sencio.

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Functional encapsulation solutions

Sensor types

Pressure Gas/fluid Optical Acceleration Magnetic

Overmolded

Premolded

Globtopovermolding

Exposed die molding

Glass on die

nCapsulate

nCapsulate™

Adding an extra dimension to the encapsulation of your MEMS device /system

• Protection

• Additional functionality

Examples:

• Functional shapes.

• Combination of mechanics with electronics (mechatronics).

nCapsulate – functional shapes

Encapsulation shape adapted to the application.

• Accurate dimensional shape, stable over temperature

• Applications:

– Alignment features

– Mounting support

– Custom specific shape

Combination mechanics & electronics

Adding mechanical elements to encapsulated electronics

– Alignment features

– Supporting features

– …

Advantages:

– Improved alignment (measurement accuracy)

– Improved thermal contact

– Simplified design

– Improved efficiency

Integration of screw-thread

Improved alignment between nut & sensor/semiconductor

Integration of nut applications

Direct mounting of heat sink

Integration of nut applications

Mounting of tube access for sensor application

Integration of nut applications

Fixation of optical elements (lens, fiber..)

Integration of bearing

Improved alignment between bearing & semiconductor

Integration of bearing

Application examples:– Magnetic sensor (Hall, AMR) angle

measurement

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Example

Medical sensor application

Sensor types

Pressure Gas/fluid Optical Acceleration Magnetic

Overmolded

Premolded

Globtopovermolding

Exposed die molding

Medical sensor encapsulation

Glass on die

nCapsulate

Medical sensor encapsulation

• Compatibility encapsulation materials with the bio / life science - materials.

– Resistance of compound against the bio-materials

– Influence of the compound on the bio-materials

• Limited data available

– Very limited support from suppliers.

– Extensive testing needed.

MrCyte, Life-Science Project

• Magnetic flow cytometry

• Concentration measurement of (rare) cells in blood, by counting cells marked with magnetic nanoparticles.

– Cancer diagnostics.

– Blood analysis.

• Integration of sensor package in microfluidics unit.

MrCyte

MrCyte Packaging aspects

Exposed die molding

• Exposed magnetic sensor with small structures to guide nanoparticle flow.

• Integrated ASIC

nCapsulate

• Small micro structures on package to guide nano particle flow to sensor.

• Contact pins (no leads)

• Alignment holes for fixation

MrCyte pictures of the application

Integrated in microfluidic

Cartridge filled with blood

Read out equipment

Topics

• General company introduction

• Functional encapsulation solutions

• Exposed die molding

• nCapsulate

• (MEMS) sensor applications

• Summary & conclusion

Summary & Conclusion

• Packaging major contribution in the functionality of a sensor systems for (MEMS) sensor application.

• Exposed die molding proper technology to make sensor area accessible

• nCapsulate adding more functionality to the encapsulation

Sencio BVMicroweg 1-11 | 6545 CL NIJMEGEN | NetherlandsPhone: + 31 24 3714490 | Fax: + 31 24 8901799info@sencio.nl | www.sencio.nl

Protecting your technology with ours!