Post on 03-Jan-2016
description
Muon trigger upgrades, missing since not aimed towards DOE funding
PHENIX upgrades: view presented to DOE
R&D $3.5MConstruction $16.6M
Au-Au p-p 200 Si-Si ++ p-p 500 Au-Au
PHENIXD M Lee 6-17-2003
ID Task Name Duration
39 Endcap Assembly 715 days
40 Sensors 550 days
41 design ministrips layout 8 wks
42 procure prototype sensor 20 wks
43 test prototype sensor 8 wks
44 bump bond PHX 12 wks
45 test PHX sensor assembly 16 wks
46 procure sensors 20 wks
47 bump bond 20 wks
48 Ministrip electronics 440 days
49 develop specifications 12 wks
50 design PHX chip 28 wks
51 submit prototype PHX 14 wks
52 test prototype PHX 10 wks
53 redesign 4 wks
54 engineering run 8 wks
55 kapton cabling design 8 wks
56 procure kapton cable 12 wks
57 Mechanical-ladders 515 days
58 design ministrip ladder 8 wks
59 prototype ministrip ladder 12 wks
60 test ministrip ladder 4 wks
61 final ministrip ladder design 4 wks
62 procure ladders 20 wks
63 assemble ladders 20 wks
64 test ladders 20 wks
M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J2003 2004 2005 2006
PHENIXD M Lee 6-17-2003
ID Task Name Duration
1 Silicon Vertex Detector Upgrade 846 days?
2 Detector Assembly 65 days
3 Assemble Barrel 12 wks
4 Assemble Endcaps 12 wks
5 Mechanical Support Structure 611 days
6 design Barrel Support Structure 10 wks
7 prototype barrel structure 20 wks
8 procure barrel support structure 20 wks
9 design Endcap Support Structure 20 wks
10 procure endcap support structure 20 wks
11 Integration into magnet 30 wks
12 cooling system design 4 wks
13 Barrel Assembly 781 days?
14 Sensors 521 days
15 pixel sensors 50 wks
16 strip sensors 521 days
17 Pixel Electronics 400 days
18 define heat load 1 day
19 pixel bus 360 days
20 pixel hybrid 280 days
21 pixel system test 8 wks
22 Strip Electronics 1 day
23 define heat load 1 day
24 Mechanical-ladders 1 day?
27 Design pixel ladder 8 wks
28 prototype pixel ladder 12 wks
29 test pixel ladder 4 wks
30 final pixel ladder design 4 wks
31 procure ladder 8 wks
32 assemble ladder 40 wks
J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M2003 2004 2005 2006
PHENIXInstitutional Responsibilities
D M Lee 6-17-2003
task institution
mechanical support, cooling HYTEC/LANL
integration, infrastructure BNL
pixel hybrids, sensor/readout LANL
pixel pilot ISU
pixel assembly, ladder bus LANL
pixel fem SUNY-S/B
DCM’s Columbia
•Simulations Tasks endcap
• • Implementation of new geometry in PISA • Continual update of geometry with evolving mechanical design • Ministrip size determination -• Detailed simulation of pp capability • Detailed simulation of Au-Au capability • Vertex tracking code • Detailed track matching • Integration with barrel and HPD/TPC • Overall coordination -• •UNM, Doug Fields has expressed an interest in helping with the simulation and has a student. He hasn’t defined the level of effort yet. The simulations to date for the end caps have been done by Pat McGaughey and Dave Lee and the new geometry has been done by Hua Pei. Some interest in simulations has been expressed by Pat,Gerd, and Dave.•
•Mechanical Tasks endcap and barrel• • Overall coordinaton Lee• Ladder prototyping cooling test HYTEC• Overall structure prototype HYTEC• Production liason Lee, HYTEC• Ladder assembly -• Combined endcap/barrel assembly - • Cooling system production • Integration with PHENIX/HBD/TPC - •
•Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap. They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support. •
D M Lee 6-17-2003
•Sensor Tasks endcap• Overall coordination -• Ministrip Design • Prototyping -• Testing • Testing with bump bonded frontend chip • Bump bonding -• Production liason •
•Electronics endcap• • Overall coordination Kunde?• Frontend ministrip chip design Kunde• Prototype Frontend chip fermilab• Testing frontend chip Kunde, fermilab• Production frontend chip Kunde, fermilab• Supporting chip design, pilot chip/chips • Test supporting chip • Slow control • HV design - • Readout cable design • Power plant • DCM liason to Chi • •Gerd Kunde has established a collaboration with Ray Yarema of FERMILAB to design the frontend chip to bump bond to the sensors. In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc.• •Construction where ?• Coordinator • •Integration electrical and mechanical who?•
D M Lee 6-17-2003
FermiLab Electronics Cost Estimate
•Chip design/testing – 2 man-years - $275K (includes all overhead costs)•Prototype chip fabrication- $40K (small chip), or $80K (large chip)•Test board $5K•Engineering run (10-12 wafers) $200K•9 Extra wafers using same masks - $45K•Production wafer level testing –engineering, tech time, circuit board, probe card - $60K•Contingency??
PHENIXBeginning cost basis
D M Lee 6-17-2003
Fermilab Electronics Schedule Estimate
•Design specifications completed 10/03•Start design 12/03•Submit prototype 7/04•Prototype testing completed 12/04•Redesign completed for engineering run 1/05•Engineering run back 3/05
PHENIXD M Lee 6-17-2003
PHENIXD M Lee 6-17-2003
Physicist- mechanical liason, electronic liason, simulation – 3 FTE
Electronic Engineer – Fermilab – construction Budget – 2 FTE
Electronic Integration Engineer – construction Budget - 0.5 FTE
Tech – construction budget – 2 FTE
Lab space, Q/A,Assembly
Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL
InstitutionalsLANL, ISU,Columbia,UofCol,UNM,NMSU?,Ecole Poly?, Saclay?, SUNY-SB,
PHENIXLANL Manpower Estimate
D M Lee 6-17-2003
Construction Project 2 – EndCaps DOE (k$)
Mechanical support and cooling (2 endcaps) 195
Hybrid pixel layers (2 encaps) 4766
Management 100
Total 5061
Overhead on DOE contribution 1257
50% contingency 2458
Total 8849
PHENIXInitial endcap cost estimate
D M Lee 6-17-2003
Physicist Physics Analysis Silicon Upgrade
•Barnes 20 20•Brooks 75 25•Burward-Hoy 100•Kunde 40 40 •Lee 25 50•Leitch 100 •Liu 75 25•McGaughey 50 50•Moss 20•Silvermyr 100•Sullivan 40 vanHecke 50 50
PHENIXPhysicist Manpower Estimate
D M Lee 6-17-2003