Microelectronics(in)

Manufacturing

Dr. T-H. Joubert

NSTF Discussion Forum on AM and Automation: 11 September 2019

Carl and Emily Fuchs Institute for MicroelectronicsDepartment of Electrical, Electronic and Computer Engineering

University of Pretoria

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Microelectronics in Memory

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The transistor was invented at Bell Labs in 1947

1956 Nobel Prize in Physics toBardeen, Brattain and Shockley

wired.comcomputerhistory.org

Best Christmas present changed the course of history…

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Microelectronics in Memory

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Invention of the integrated circuit in 1958

Texas Instruments oscillator with five components.

2000 Nobel Prize in Physics to Jack Kilby

wired.com ti.com

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Microelectronics in Memory

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Planar integrated circuit in 1959

Fairchild produces ICs using a planar chip technology

Robert Noyce “Statesman of Silicon Valley”

intel.comedn.com

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Microelectronics in Memory

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IC Processing

intel.comedn.com©2013 John Wiley & Sons, Inc. M P Groover, Principles of Modern Manufacturing 5/e

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Microelectronics in Memory

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Moore’s Law

In 1965 Gordon Moore, Director of R&D at Fairchild "Cramming more components onto integrated circuits".

Gordon Moore in 2006

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Microelectronics in Memory

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Some enabling factors and for Moore’s Law

• 1963, CMOS process, Frank Wanlass

• 1967, DRAM, Robert Dennard (IBM)

• 1982, UV excimer laser photolithography, Kanti Jain, IBM

• 2006, Deep UV excimer laser photolithography, IBM

• 2008, Memristor, HP Labs

• 2010, SiGe supercooled transistor, IBM, GeorgiaTech

• 2010, Nanowire transistor, Tyndall National Institute

• 2012, Single-atom transistor, University of New South Wales

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Microelectronics in Memory

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The other side of Moore’s Law

16/14 nm 12/11 nm

?

?

? ?

TSMC

Globalfoundries

STMicroelectronics

Intel

Samsung22/20 nm

after IHS iSuppli 2011

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Microelectronics in Memory

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More OF Moore technology nodes » nanoelectronics…

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Integrated Circuit Trends

“CMOS became the dominant fabrication technology for the VLSI era, with billions –

probably trillions – of chips produced using it. But most of these have been processors. Now, we are on the verge of a new CMOS era, but one in which

CMOS ICs are increasingly being developed for something quite different – sensing.”

[David Boothroyd, “CMOS technology is set to enable a new range of sensor devices,”

http://www.newelectronics.co.uk, 13 January 2015]

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Integrated Circuit Trends

“Heterogeneous components are devices that do not necessarily scale according to “Moore's Law,”

and provide additional functionalities, such as sensing and actuating ….. our prior ITRS roadmaps

have focused on MEMS in mobile devices ……. However, looking into the future, the greatest application growth areas are expected to be in

wearable devices, medical diagnostic devices, and the Internet of Things (IoT).”

[Extract form ITRS 2014 -White Paper on Heterogeneous Components]

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Appropriate technology

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Applications give technology relevanceCEFIM

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Challenges / Opportunities

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Microelectronics?

http://mfeldstein.com/ Phil Hill

• Technology scale· nm → µm → mm → cm → m

• Interdisciplinary· electronics → chemistry → materials → biology

• Innovation· research → development → commercialization

Technology PUSHDemand PULL

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Founded in 1972: Institute for MicrostructuresSince 1982: Carl and Emily Fuchs Institute for Microelectronics

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Microelectronics in memory

Research focus areas:

• mixed signal integrated circuit design• novel electronic devices• RF microelectronics• micro electrical mechanical systems (MEMS)• silicon photonics and optoelectronics.

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More THAN Moore research focus areas:

• mixed signal integrated circuit design• novel electronic devices• micro/millimetre wave microelectronics• micro electrical mechanical systems (MEMS)• integrated microelectronics sensor systems• silicon photonics and optoelectronics.

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Microelectronics in this moment

350nm

CMOS

(Europe)

130nm

SiGe BiCMOS

(USA)

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Moore Plus microelectronics in this moment

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Optoelectronic device (Germany)Bolometric IR Sensor (SA)

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Microwave microelectronics in this moment

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CommunicationsRadiometryCloud RADARAutomotive RADAR Airport security screeningRadio astronomySynthetic Aperture RADAR ImagingSeeker headsNaval fire control

• Point-of-need sensor systems:

- Portability

- Flexible

- Size

- Fast response

- Low power

- Stability

- Durability

- Refreshable

• Smart, simple, low-cost, green

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Printed microelectronics in this moment

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CSIR

CSIR

CEFIM/CSIR

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Meeting the future: Microelectronics in the Mind

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CEFIM / MMM

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National Association

DSI SARIR : Nano and MicroManufacturing Facility (NMMF)

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Concluding recommendations

• “More THAN Moore” to use “More OF Moore” nanoelectronics

• Design solutions to local problems with global relevance

• Manufacture in decreasing number of global fabs

• Invest in research, development, and skilled workforce

• Additive manufacturing is becoming microelectronics

• Printed electronics

• Heterogeneous integration

• Small-scale and low-cost automated fabrication facility

• Rigorous design and process modelling

• Geographically close to grassroots communities

Microelectronics (in) manufacturing

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“Prediction is very difficult – especially if it is about the future.”

Niels Bohr

Thank you!

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Discussion:Enabling Ecosystemfor Manufacturing

Dr. T-H. Joubert

NSTF Discussion Forum on AM and Automation: 11 September 2019

Carl and Emily Fuchs Institute for MicroelectronicsDepartment of Electrical, Electronic and Computer Engineering

University of Pretoria

24CEFIM

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Microelectronics in Memory

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Moore’s Law

In 1965 Gordon Moore, Director of R&D at Fairchild "Cramming more components onto integrated circuits".

Gordon Moore in 2006

26

Microelectronics in Memory

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The other side of Moore’s Law

16/14 nm 12/11 nm

?

?

? ?

TSMC

Globalfoundries

STMicroelectronics

Intel

Samsung22/20 nm

after IHS iSuppli 2011

27

Applications2012/pretoria-news-squatters-live-among-rich

Plastic View, Moreleta Park

Medicinal residue in drinking waterAcid mining drainage, Tweelopies River

http://www.alfalaval.com//mg.co.za/article/2015-07-30 http://www.infrastructurene.ws

Waste water

Jukskei River

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Microwave microelectronics in this moment

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CommunicationsRadiometryCloud RADARAutomotive RADAR Airport security screeningRadio astronomySynthetic Aperture RADAR ImagingSeeker headsNaval fire control

• Point-of-need sensor systems:

- Portability

- Flexible

- Size

- Fast response

- Low power

- Stability

- Durability

- Refreshable

• Smart, simple, low-cost, green

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Printed microelectronics in this moment

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CSIR

CSIR

CEFIM/CSIR

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Concluding recommendations

• “More THAN Moore” to use “More OF Moore” nanoelectronics

• Design solutions to local problems with global relevance

• Manufacture in decreasing number of global fabs

• Invest in research, development, and skilled workforce

• Additive manufacturing is becoming microelectronics

• Printed electronics

• Heterogeneous integration

• Small-scale and low-cost automated fabrication facility

• Rigorous design and process modelling

• Geographically close to grassroots communities

Microelectronics (in) manufacturing

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Additive Manufacturing

Point-of-need sensor systems & m/mm Wave Communications

Alignment:• Global goals: data in smart cities, energy, water, minerals

and beneficiation

• DST / NRF Objectives – SARIR, SKA, SALT, Nano

• TIA Portfolio – advanced manufacturing, agriculture, energy, health, ICT, natural resources

• AU STISA

• International Roadmap for Devices and Systems

• UN / WHO SDGs

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DSI SARIR : NMMF

Planning hub-and-nodes model