Post on 05-Apr-2020
© 2018 ROHM Co.,Ltd.
LED Manual
Rev.003Jan. 9, 2018
PAGE ITEM
1 Characteristics data ①(Relative luminous intensity x IF, Relative luminous intensity x Ta,IF x VR, Derating)
2 Characteristics data ②(Max peak current-Pulse width characteristics)
3 Luminous intensity criteria sample
4 Location of Chip
5 Location of Chip, Viewing angle
6 About Luminous intensity and Luminous flux
7 Rth
8 LED operation circuit
9 Flow Temperature Profile
10 Reflow Temperature Profile
Page ITEM
11 Reliability Data(Blue ,White LED)
12 Sulfuration
13 Mechanical Strength
14 Failure of Pick-up
15 Cautions of Silicon Resin Sealed Products
16 Not Lighted on due to Moisture Absorption
17 Storage Conditions / Packing
18 RGB Chromaticity Classification of Mixed Lighting LED
P. 1© 2018 ROHM Co.,Ltd.
Characteristics data ①(Relative luminous intensity x IF, Relative luminous intensity x Ta, IF x VR, Derating)
Rohm LED specification includes following data<Relative luminous intensity x IF> <Relative luminous intensity x Ta>
<IF x VR> <Derating>
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15 20
RELATIV
E L
UM
INO
US
INTEN
SIT
Y
FORWARD CURRENT:IF(mA)
Ta=25℃
0.4
0.6
0.8
1
1.2
1.4
1.6
-40-30-20-10 0 10 20 30 40 50 60 70 80 90 100
RELATIV
E L
UM
INO
US
INTEN
SIT
Y
ATMOSPHERE TEMPERATURE:Ta(℃)
IF=20mA
1
10
100
1.0 1.5 2.0 2.5 3.0
FO
RW
AR
D C
UR
REN
T:
IF(m
A)
FORWARD VOLTAGE:VF(V)
Ta=25℃
0
10
20
30
-40-30-20-10 0 10 20 30 40 50 60 70 80 90 100
MAXIM
UM
FO
RW
AR
D
CU
RR
EN
T:
(mA)
AMBIENT TEMPERATURE:Ta(℃)
Diode characteristics
If temp. heating-up, re-united ratio of Electron & hole drops. Then, luminous intensity becomes weak.
Current value should drop with consideration of Tj and temperature
If Forward current(IF)is raised, luminous intensity becomes weak.
P. 2© 2018 ROHM Co.,Ltd.
LED lighting time :x (sec.)Frequency :y (Hz)Pulse cycle :z(sec.)Pulse Duty : A
①1÷y=z②x÷(1÷y)= A
1
10
1 10 100 1000 10000
IF M
ax(
Puls
e)
/IF
Max(D
C)
PULSE width : Tw(μs)
10
kH
z
2kH
z
1kH
z
20
0H
z
10
0H
z
5
Pulse width(x)
Pulse cycle(z)
IF Max(in case of Pulse duty10%) is 5 times bigger than IF Max(DC).
frequency:1/z
Pulse Duty :x/z
Depending on the Pulse frequency and Duty used, IF Max(DC) limit is changed.To prevent the LED lights flickering, we recommend to use over 100Hz.
★
(Ex.) LED lighting time :1000μsec.Frequency :100Hz
→ Pulse cycle=1/100=0.01sec.=10000μsec.Pulse Duty=1000/10000=1/10 (Chart 1 ★)
→IF Max(Pulse) is 5 times bigger than IF Max(DC).
Characteristics data ②(Max peak current-Pulse width characteristics)
<Max peak current–Pulse width characteristics>(Chart 1)
P. 3© 2018 ROHM Co.,Ltd.
Luminous intensity criteria sample (Current control luminous intensity sample)
Distribution of LED Luminous intensity rank is as Chart 1.Therefore, when check the criteria samples of upper and lower limits of luminous rank, we submit the current controlled samples. (You can have current controlled sample faster than actual limit sample.)
Ex.) See Chart 2 By using 80mcd@20mA, lower limit sample of rank R(56mcd) is available with IF=20mA x 0.7 times condition.
<Chart 1> <Chart 2>
0
20
40
60
80
100
0 2 4 6 8 10 12 14 16 18 20 22
Lu
min
ou
s in
ten
sit
y(m
cd
)
Current(mA)
56mcd
80mcd
0
10
20
30
40
50
60
0 20 40 60 80 100 120 140
Yie
ld r
ate
(%
)
Luminous intensity(mcd)
36 56 90 140
RankQ RankR RankS
P. 4© 2018 ROHM Co.,Ltd.
Location of Chip
• Because LED needs the space for DB and WB, chip won’t always at the center of PKG.
PICOLED®SML-P1* (R)series
EXCELED™SML-D1* series SML-E1* series
Side-view LEDSML-A1* series
(0.11m
m)
center
【E.g.】
(0.11m
m)
0.3mm
(0.1
1mm)
(0.2
45mm)
(0.3mm)
P. 5© 2018 ROHM Co.,Ltd.
Location of Chip, Viewing angle
[Location of Chip(Ex.)]
Location of Chip is at the center of PKG.
0 50 10090
80
70
60
50
40
30
2010010
20
30
40
50
60
70
80
90100 50
RELATIVE INTENSITY(%)
0 50 10090
80
70
60
50
40
30
2010010
20
30
40
50
60
70
80
90100 50
SCANNING ANGLE(deg)
RELATIVE INTENSITY(%)
SCANNING ANGLE(deg)X - Y
スキャン方向
(Scanning Direction)
X' - Y'
スキャン方向
(Scanning Direction)
(0.11m
m)
0 50 10090
80
70
60
50
40
30
2010010
20
30
40
50
60
70
80
90100 50
RELATIVE INTENSITY(%)
0 50 10090
80
70
60
50
40
30
2010010
20
30
40
50
60
70
80
90100 50
SCANNING ANGLE(deg)
RELATIVE INTENSITY(%)
SCANNING ANGLE(deg)X - Y
スキャン方向(Scanning Direction)
X' - Y'
スキャン方向(Scanning Direction)
• Because LED needs the space for DB and WB, chip won’t always at the center of PKG.
• If the optical properties are important, please check the Viewing angle.
[Viewing angle]
Luminous intensity near the chip is higher than other parts
EXCELED™SML-D1*seriesSML-E1*series
Location of Chip isn’t at the center of PKG.
P. 6© 2018 ROHM Co.,Ltd.
About Luminous intensity and Luminous flux
Luminous intensity :In photometry, a measure of the wavelength–weighted power emitted by a light source in a particular direction per unit solid angle. Unit is candela(cd).
Luminous flux : Brightness of whole light, emitted from light source. Unit is lumen(lm)
Ex. SMLK1/K2 series
0
5
10
15
20
0 1 2 3 4 5 6
Lu
min
ou
s f
lux(
lm)
Luminous intensity(cd)
P. 7© 2018 ROHM Co.,Ltd.
Rth (Thermal resistance)
2 kinds of Rth exist. Junction to case(terminal) : Rth.(j-C)
Junction to ambient : Rth.(j-a)
Heat-dissipation of surface mount deviceis thru PCB.Therefore, value of Rth(j-C) ismeasured Tl and calculated in Rohm PCB condition.
Terminal temperature is measured on LED mounted side.
Ex) SML-D1 series<PCB :FR4, single side PCB t=0.8mm, Cu thickness 0.035mm>
R1 = Rth(j-C)
R1+R2 = Rth(j-C)+Rth(c-a)
= Rth(j-a)
PCB size(mm)
Rth (j-a) (℃/W)
Rth (j-C) (℃/W)
Single Device 458 ―
10 × 10 209 101
15 × 15 151 74
20 × 20 121 57
40 × 40 83 51
50 × 50 70 500
100
200
300
400
500
0 100 225 400 1600
Rth
(℃
/W
)
PCB size(mm2)
Tj=Tc + Rth(j-C)×PRth(j-C) = Tj-Tc
P
[P=IF × VF = 20mA×2.0V]
Tl :Terminal temperature
Sub.R1
R2
P. 8© 2018 ROHM Co.,Ltd.
LED operation circuit
Therefore, 1 resistor per LED can reduce difference of current value to have uniform luminous intensity.
Non-uniform luminous intensity is created by difference of current value, caused by VF tolerance. This is often happed if LEDs are operated in parallel circuit.
0
5
10
15
20
25
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
IF(
mA
)
VF(V)
LED① LED②
LED①
LED②
20mA 2mA
LED①
LED②
20mA 20mA
R1 R22V 1.5V
P. 9© 2018 ROHM Co.,Ltd.
Flow Temperature Profile
According to reflow profile conditions, it may cause the breakage of die bonding for the LED of lead inserted type (Lamp LED) .
If the flow soldering condition is strict, it may cause the delamination of Ag-paste and frame due to over heat stress around the lead frame and die bonding. Make sure you use it in the following conditions: pre-heat in the temperature less than 100℃ within 60 sec.; Immerse in solder tank in the temperature less than 265℃ within 5 sec(double peaks means the time from the beginning of 1st time to the end of 2nd
time); Temperature difference of double peaks should be within 100℃.
Break of Die Bonding E.g.( Resin Decapsluated )
(Reflow Profile E.g.)
RecommendCondition
Pre-heating Condition
Temperature difference of double peaks
Temperature of solder tank/Immersion Time
Time [s]
Te
mp
era
ture
[℃
]
Sub.
lead
Temperaturemeasurement point
Rohm’sRecommendcondition
Bad condition
P. 10© 2018 ROHM Co.,Ltd.
Reflow Temperature Profile
According to reflow profile conditions, it may cause the breakage of die bonding.
If the peak temperature is too high (excessive), it may cause delamination between Ag paste and circuit board due to warpage of printed wiring circuit board or expansion of resin. And if the temperature gradient of temperature rising/falling is large, it can also cause delamination, so please use it in 1~3℃/sec.
Break of Die Bonding E.g.(X-ray)
(Reflow Profile E.g.)
RecommendCondition
Rapid Cooling Condition
Rapid Heating Condition
Rohm’sRecommendcondition
Competitor(F corp.)
Te
mp
era
ture
[℃
]
Time [s]
P. 11© 2018 ROHM Co.,Ltd.
Reliability Data (Blue ,White LED)
Fig.1 Reliability Data
■The Electro-optical Characteristics is recognized as Derating Data,which is not Reliability Relation. Please check Reliability Data.
■The Reliability Data is below(Fig.1).This Data is measured at our test condition, therefore please doReliability test yourselves at your using condition which are Assembly and Application.
Reliability Data is shifted to Red Arrow due to using condition (High Atmosphere temperature ,High Current condition) within the range of Derating.
FIG. Estimated Data of Residual rate of Luminous Intensity
Esti
mate
d D
ata
of
Resid
ual
rate
of
Lu
min
ou
s I
nte
nsit
y [
%]
Time [Hrs.]
P. 12© 2018 ROHM Co.,Ltd.
Sulfuration
Sulfur corrodes Ag and it may cause a failure.
The sulfuration and corrosion of used Ag will cause the delamination of wire, furtherly result in Not Lighted and Low Luminous Intensity due to Low Light Absorption.
Sulfuration E.g.
The Ag pattern in the LED case is corroded and color changed into black→wire delamination
The Ag of frame is corroded and its color changed into black→Low luminous intensity due to low light absorption
Resin Decapsulation
Acceleration Tested Device
Acceleration Tested Device
P. 13© 2018 ROHM Co.,Ltd.
Mechanical Strength
Comparison of the mechanical strength of LED and Transistor Diode.
We compared the mechanical strength of LED with transparent resin used and transistor diode with filer resin used, the LED is weak generally. So please do assess the mounting conditions.
LED Transistor Diode
LED Resin Tr・Di Resin
Specific Gravity
1.26 1.80
ScleroscopeHardness
90 81
Bending Strength[MPa]
112 151
Flexural Modulus[GPa]
3.1 15.0
Comparison of main physical characteristic value of resins
P. 14© 2018 ROHM Co.,Ltd.
Failure of Pick-up
We recommend use a magnet as the countermeasure for failure of pick-up especially for small products.
For super small products, it may paste on tape due to static electricity because of the operational environment. In the case, it can solve the problem by installing a magnet on the mounting machine.
Product pasted on tape due to static electricity.
Magnet (E.g.)
With Magnet
Magnet
LEDLEDTop tape
No Magnet
Magnet is used on the mounting machine for picking-up(E.g.)
P. 15© 2018 ROHM Co.,Ltd.
Cautions of Silicon Resin Sealed Products
As for high reliability products, the reflector type is sealed by silicon resin. Therefore the sealing part is soft, it will damage the internal wire if touch it directly.
When it is mounting, please have the adsorption collet touching with reflector.After it is mounted, please be care to handle with the part of sealing.
【 Mechanism of Wire Breakage due to Stress on Resin Parts】
Impact or Stress applied on Silicon
ResinAg Paste
Mounting PCB
Reflector
Au Wire Ag Frame
Solder
Chip
Silicon Resin Wire BreakageWire Deformation
P. 16© 2018 ROHM Co.,Ltd.
When the product is absorbing the moisture, the vaporized stream (by the heat of reflow)will go out, its stress will lift up the sealing resin from the bottom and result in breakage of wire bonding.
【Mechanism of Wire Bonding Breakage caused by Moisture Absorption of Product 】
Mounting
Heat
Stress
Sealing Resin Expanding due to Heat Stress + Moisture Absorption
Wire Breakage
Case Material(Reflector)
Au Wire
Au Pattern
Solder
Chip
Mounting PCB
Sealing Resin
Mounting PCB
DelaminationSubstrate absorbing moisture
Stress of Vaporization
Sealing Resin absorbing posture
Not Lighted on due to Moisture Absorption
P. 17© 2018 ROHM Co.,Ltd.
Storage Conditions / Packing
◇Storage Conditions(Sample)
◇About Packing
Classification Temperature Humidity Expiration Date Remark
①Before using 5~30℃ 30~70%RHWithin 1 year
from ReceivingStorage with waterproof package
②After opening package
5~30℃Below
70%RHWithin 168h
Please storing in the airtight container with our desiccant (silica gel)
Classification Temperature Humidity Expiration Date Remark
①Before using 5~30℃ 30~70%RHWithin 1 year
from ReceivingStorage with waterproof package
②After opening package
5~30℃Below
70%RHWithin 72h
Please storing in the airtight container with our desiccant (silica gel)
Temperature Time Humidity
60±3℃ 12~24h Below 20%RH
Remark
・Bake products in reel.・Reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it.
・Recommend bake once.
■Molding Package type
■Reflector Package type(Permeability of the water high, because sealing resin touches air)
■Bake the product in case of below:
①The expiration date is passed. ②The color of indicator (silica gel) turned from blue to colorless or from green to pink. (Even if the product is within the expiration date.)
Packing○○○pcs are packed in one reel.①One reel is packed in aluminum bag.②The size of aluminum bag is ○○○(a)×○○○(b)mm.③Aluminum bag is sealed by pressured for all directions.
b
a
※The details, please identify specifications
Into the aluminum pack, and sealed, prevent moisture absorption.
・Baking Conditions
P. 18© 2018 ROHM Co.,Ltd.
RGB Chromaticity Classification of Mixed Lighting LED
◇Chromaticity Classification of Mixed Lighting
When the RGB LED is white, in order to control the chromatic aberration of same set, we clarify the chromaticity when applied determined current for every product.
SMLVN6RGB R 12mA, G 15mA,B 12mAMSL0104RGB R 8mA, G 14mA, B 18mAMSL0402RGB R 20mA, G 20mA, B 10mA
Chromaticity sorting is the value of mixed lighting when applying determined current on products.The RGB LED is different from the white LED made by blue chip + fluorescent agent, it can change the color by applying by determined currents or time setting of pulse lighting on.
SMLVN6RGB MSL0104RGB MSL0402RGB
SMLVN6RGB Chromaticity Classification
© 2018 ROHM Co.,Ltd.