Post on 16-Dec-2015
IWS3E Advanced ProgramsTechnology Insertion
CAPT Sheila Patterson, USNPEO-IWS 3E
NDIA Guns & Ammunition / Missiles & Rockets Conference
14 April 2004
Slide 2NDIA Conf 14 April 2004
IWS3E Advanced ProgramsTechnology Insertion
IWS3E Advanced ProgramsTechnology Insertion
Presentation Agenda Program Office Challenges Technology Insertion Cycle Tech Cycle Products Tech Insertion Activities Tech Insertion Way Ahead
STANDARD MISSILE
Technology Areas Sensors & Signal Processing Guidance, Navigation & Control Command, Telemetry & Data
Handling Ordnance & Propulsion Airframes and Divert Systems Power Systems Manufacturing/Test Equipment
Slide 3NDIA Conf 14 April 2004
IWS3E Advanced ProgramsIWS3E Advanced Programs
Dr. Sullins3TD
Tech DirIPA
Dr. Sullins3TD
Tech DirIPA
VACANT3TR
TECHREPO-5
VACANT3TR
TECHREPO-5
CAPT S. Patterson3E
Sys EngO-6
CAPT S. Patterson3E
Sys EngO-6
VACANT3P
Bus. OpsGS-15/O-6
VACANT3P
Bus. OpsGS-15/O-6
Joyce Woodward3I
INTERNATIONALGS-15
Joyce Woodward3I
INTERNATIONALGS-15
CAPT Murdoch3C
NSFSO-6
CAPT Murdoch3C
NSFSO-6
CAPT Lang3B
RAM/PHALANXO-6
CAPT Lang3B
RAM/PHALANXO-6
Clay Crapps3A
STD MSLGS-15
Clay Crapps3A
STD MSLGS-15
Frank TavennerClay Crapps (acting)
3LSLS
GS-15
Frank TavennerClay Crapps (acting)
3LSLS
GS-15
PEO IWS
CAPT Cramp3D
NSSPOO-6
CAPT Cramp3D
NSSPOO-6
Steering Committee Issues
Steering Committee Issues
Melissa KirkendallIWS 3DEP
Deputy (Acting)SES
Melissa KirkendallIWS 3DEP
Deputy (Acting)SES
CAPT OuttenIWS 3.0
O-6
CAPT OuttenIWS 3.0
O-6
Slide 4NDIA Conf 14 April 2004
IWS3E Advanced ProgramsTechnology Insertion CycleIWS3E Advanced ProgramsTechnology Insertion Cycle
USER-BASEDASSESSMENT
SystemsRequirements
TechnologyNeeds
NewTechnology
ProductImprovements
Real WorldPerformance
•User Community•TD/TDA•“Way Ahead”•Requirements Flow
•R&D/S&T•Industry•Government•Academia
•Program Office•Industry
•Industry•Fleet
TECHNOLOGYTRANSITION
TECHNOLOGYDEVELOPMENT
PROGRAMDESIGN & EVAL
PRODUCTIONAND USE
Slide 5NDIA Conf 14 April 2004
IWS3E Advanced Programs Technology Insertion Products
IWS3E Advanced Programs Technology Insertion Products
CYCLE STAGE PRODUCT ACTIVITIES
User-Based Assessment
Review & Comment
Continuous
Program Design & Evaluation
Review & Direct Special Analyses
Continuous
Technology Development
Focus Navy-Industry S&T Funding; Coord Joint Developments
SBIR, MANTECH, DACP, FNC, Planning & Coordination
Technology Transition
Develop & Direct Transition Projects
Planning for SBIR Transition
Production & Use Review & Assess Tech Benefits
Various Usage
Slide 6NDIA Conf 14 April 2004
IWS3E Advanced Programs Technology Insertion Activities
IWS3E Advanced Programs Technology Insertion Activities
Manufacturing & Production Five Year Plan
ManTech Issues Input & Coordination
SBIR Topic Input, Phase I Kick Off, Phase II Review & Support, And Phase III Planning
OSD Defense Acquisition Challenge Proposal Development And Support
FNC Project Planning
Technology Road Map Planning
PEO IWS “Way Ahead” Planning
Slide 7NDIA Conf 14 April 2004
IWS3E Advanced ProgramsManufacturing and Producibility
IWS3E Advanced ProgramsManufacturing and Producibility
• Radome Manufacturing
Process
• Common Control
Actuation System (CAS)
• Microstrip Circuit-Based
Impatt Transmitter
• Common Processor
• Lead-Free Technology
for Missile/Military
Application
• Manufacturable
Security Coating
• RF MEMS Manufacturing
• Moduless Design and
Manufacturing
• Rapid Prototyping of
MMIC’s
• S/A Devices
5
This overall manufacturing process development will end with the capability to provide radomes for production missiles. High surface finished closed graphite dies in vacuum molding can produce a near net shape radome that requires little to no finalfinishing for utilization as a radome. A ceramic composite withimproved performance properties produced to near net shape results in a radome more cost effective radome.
The Development Of A Manufacturing Process To Produce Ceramic Composite Radomes
Anticipated Process Improvement:
Pyroceram has been the ceramic radome material of choice for most missile systems for more than a decade. However, the manufacture of pyroceram is being phased out and within two years will no longer be available. It is critical to develop a new ceramic radome material that is ready for implementation within two years as well as meeting the property requirements for advanced missile systems.
The objective is to develop and demonstrate manufacturing processing to produce full size ceramic composite radomes. In a separate program, ceramic composites such as silicon nitride reinforced glassy/ nanocrystalline ceramic matrix composites are to be developed. This program objective is to develop and demonstrate a manufacturing process to produce radomes with the required surface finish and mounting methodology.
PROBLEM/ OBJECTIVE
ACCOMPLISHMENTS/ PAYOFF
In a team effort with Raytheon and MER Corporation, a processing methodology will be developed to produce ceramic composite radomes such as silicon nitride reinforced glassy/ nanocrystalline ceramic matrix. Pyroceram is produced in billets and expensively machined to shape. In this case, methodology that produces near net shape radomes will be developed which requires minimal surface finish for utilization.The manufacturing methodology will emphasize resin transfer type processing to produce the ceramic composite. Mounting methodology that accounts for the difference in coefficient of thermal expansion of the ceramic composite radome and metal missile body will also be developed.
Implementation and Technology Transfer:
The loss of pyroceram necessitates the requirement to produce radomes from new materials, which has a certainty to consist of a ceramic composite. Composites are readily manufactured by transferring a liquid matrix precursor into a reinforcement array. In this case, a liquid glass/ nanocrystalline ceramic will be melted and vacuum closed die molded to near net shape into radome configurations. The developed manufacturing process will be utilized to production produce radomes for production missile systems.
TIMELINE/ MILESTONE
FUNDING
Start Date: October 2003
End Date: September 2003
SBIR 0.4 M
Navy ManTech 2.6 M
PARTICIPANTS
Raytheon
MER Corporation
8
High Performance Common CAS
Anticipated Process Improvement:
Design a Common Control Actuation System (CAS) for several Air Intercept Missiles (AMRAAM, AIM-9X, ESSM).
PROBLEM/OBJECTIVE
ACCOMPLISHMENTS/PAYOFF
Evolves the BOM adding a common, cost efficient hardware solution while establishing the internal design capability in a key market area.
Implementation and Technology Transfer:
Exercise the Control Systems Development process;
Establish a consolidated set of performance, interface, and environment requirements;
Validate high risk areas early with common form factor;
Leverage tech demo CAS mechanism effort;
Develop common controller electronics.
Expected Benefits:
Commonality achieved in circuit design, circuit cards, motors, gear train, BIT philosophy, actuator motors, controller components.
TIMELINE/MILESTONE
Start date: TBD
End date: 30 Months ARO
FUNDING
Navy ManTech: $1.2M
Program Design / Qual Funds: $6-10M
PARTICIPANTS
Raytheon, Government Missile Programs
NAVSEA, NAVAIR
AFRL
11
Microstrip Circuit BasedI MPATT Transmitter
Anticipated Process I mprovement:
I MPATT diode based Solid State Transmitters (SST) that produce peak powers of over 1 KW have been demonstrated for use in missile seekers. These multi-stage transmitters use Raytheon’s combiner plate technology and precision machined cavity circuits to combine the power from several hundred individually packaged I MPATT diodes. A Raytheon I R&D program has developed a diamond substrate microstrip circuit that matches a single I MPATT chip. This planar circuit operates as an oscillator and provides RF performance equal to a cavity circuit.
The objective is to extend this single diode oscillator circuit to multiple diodes and to retune the circuit for amplifier operation. A Proof of Design (POD) transmitter w ill be constructed using these newly developed microstrip circuits. This POD transmitter w ill have reduced size, weight and production cost compared to a cavity based transmitter of equal performance.
PROBLEM/ OBJ ECTI VE
ACCOMPLI SHMENTS/ PAYOFF
This program will extend the single diode microstrip circuit to multiple diodes and to amplifier circuits. Since the microstripcircuits use photolithography rather than machining and mechanical tuning, critical tolerances are much tighter and lessassembly labor w ill be required for each combiner circuit. The microstrip circuit w ill also be smaller and lighter than a machined cavity. The program will design, fabricate and test a Proof of Design model of a high power I MPATT transmitter. This POD unit w ill be available for testing in prototype radar systems.
I mplementation and Technology Transfer:
Navy active seekers program and two-way links
Start Date: October 2002End Date: March 2004
TI MELI NE/ MI LESTONE
FUNDI NG
Navy ManTech: $2.8 M (SST POD unit)
PARTI CI PANTSRaytheon
Expected Benefits:
Both size and weight of the transmitter w ill be reduced by approximately a factor of 2.
The SST replaces the traditional TWT/ High Voltage Power Supply transmitter and TWT replacement at the end of its shelf life is eliminated thus providing life cycle cost savings.
1 KW I MPATT Transmitter using Cavity Combiner Circuits
Slide 8NDIA Conf 14 April 2004
IWS3E Advanced ProgramsSBIR Activities
IWS3E Advanced ProgramsSBIR Activities
Name Description Status
Plasma Drag Reduction for Missiles and Projectiles
Develop and demonstrate a prototype missile/projectile with on-board plasma drag reduction system
Phase II nearing completion, flight test planned
Advanced Tactical Telemetry Transmitter
Implement FM, SOQPSK, and multi-h CPM with FEC in 6 cu. In., >5 Watt unit
Phase II nearing completion. Option planned. Transition to SM-6 BLK I
Nondestructive Inspection of Thermal Batteries
X-ray and automated image analysis. Allows inspection prior to sealing.
Completing Phase I, Transfer to MDA for Phase II
Nondestructive Test for Missile Batteries
Impedance spectroscopy technique allowing in-situ measurement of SOH
Completing Phase I, Phase II approved
Slide 9NDIA Conf 14 April 2004
IWS3E Advanced ProgramsSBIR Activities
IWS3E Advanced ProgramsSBIR Activities
Name Description Status
Thermal Batteries Fabrication Automation
Assists assembly of 500 pellet batteries for high voltage applications. Will demo at EP through FY05.
Phase I complete, MDA to award Phase II
Development of RBSN Based Materials for Next Generation Tactical Missile Radomes
Fabricate and test of silicone nitride material for high speed radome application
Phase I award approved
Cerablak Matrix CMCs for Next Generation Radomes
Fabricate and test of phosphate matrix CMCs for high speed radome application
Phase I award approved
Fiber Reinforced Ceramic Radome Material with Improved Resistance to Thermal Shock, High Temperature, and Erosion
Fabricate and test of green fiber CMCs for high speed radome application
Phase I award approved
Slide 10NDIA Conf 14 April 2004
IWS3E Advanced ProgramsSBIR Activities
IWS3E Advanced ProgramsSBIR Activities
Name Description Status
Fiber Reinforced Ceramic Radomes for Next Generation Missiles
Fabricate and test of multiple ceramics and CMCs using gel-casting for high speed radome application
Phase I award approved
Radome Materials & Process for Long Flight Duration-High Speed Missiles
Fabricate and test of silcone matrix/silica fiber for high speed radome application
Phase I award approved
High Speed Multi-Axis Fiber Optic Sensor
Develop a multi-axis fiber optic strain sensor and high speed multiplexing system
Phase I nearing completion, transition to Phase II planned
Slide 11NDIA Conf 14 April 2004
IWS3E Advanced ProgramsDACP Activities
IWS3E Advanced ProgramsDACP Activities
Proposal Name Description Funding Requested Transition
Enhanced Optical System - RAM
Replaces window and other parts of optical assy
DACP Cost = $1.4M Cost Sharing = $4.6M
Transition is immediate to RAM P3I program
Ceramic Gel-casting Process for Tactical Missile Radome Fabrication
Process provide potential alternative to Pyroceram
DACP Cost = $1.8M Primary Acquisition Sponsor is AMRAAM
CAESAR - Condition And Environmental Sensing And Reporting System
Prototype system capable of optical measurement and storage of VLS environment
DACP Cost = $0.9M Primary Acquisition Program Is AEGIS BMD (SM-3)
Integrated Missile Harness-Fairing Assembly
Elect. Interconnect assy and fairing are fab'd as integrated unit
DACP COST = $1.63M Primary Acquisition Program is AMRAAM
Slide 12NDIA Conf 14 April 2004
Area Near Term(FY + 5)
Mid Term(FY + 10)
Far Term(FY + 20)
Sensors & SignalProcessing
Guidance, Navigation & Control
Command, Telemetry & Data Handling
Ordnance & Propulsion
Airframes & Divert Systems
Power Systems
Manufacturing & Test Equipment
CostReliability
- Aging InventoriesSafety
- IM Compliant- IFF
Producibility- International Standards- Parts Obsolescence- Increased Complexity
Performance- Reduced Target RCS- Advanced Target Countermeasures- Background/Clutter- Maneuvering Targets- Multiple Targets- Improved Lethality- Expanding Target Set- Increased Range & Velocity- Longer Flight Times
Interoperability- Joint Operations- Missile Link- DDX/SPY-X- Foreign Sales
Performance- All of Near-Term Plus:- Hypersonic Maneuvering Targets- Increased/Variable Range and Speed (Time to Target, Expanded Mission Areas)- Increased Peak Power
Interoperability- All of Near-Term Plus:- Battle Damage Assessment- Open Architecture- FORCEnet/GIG
Performance- All of Near & Mid-Term Plus:- Variable/Adaptive Signature Targets
Interoperability- All of Near & Mid-Term Plus:- Changing System Interfaces (Launcher, C4I, OA, etc)- Increased Autonomy and Adaptability (Reduced Warfighter Workload)
Continues Through Mid and Far-Term
IWS3E Advanced ProgramsRoadmap - Missile Technology Drivers
IWS3E Advanced ProgramsRoadmap - Missile Technology Drivers
Slide 13NDIA Conf 14 April 2004
Area Near Term(FY + 5)
Mid Term(FY + 10)
Far Term(FY + 20)
Sensors & SignalProcessing
Guidance, Navigation & Control
Command, Telemetry & Data Handling
Ordnance & Propulsion
Airframes & Divert Systems
Power Systems
Manufacturing & Test Equipment
Cost- Automated/Common Design, Manufacturing & Test- Manufacturing Yield Improvements
Reliability- Technology Refresh- Design for Obsolescence
Safety- MEMS S&A- IM Compliant Motors
Producibility- Battery Manufacturing & Test Improvements- Radome Manufacturing- Rapid Prototyping- Built in Test- Titanium Mirror Fabrication
Performance- Gimbaled Active/Semi-Active Seeker- Increased RCS Sensitivity- Increased G Airframe/AP- Improved Rear Receiver- Advanced ECM- RAM Uplink- Integrated Guidance & Control- Onboard Multi-Sensor Track Correlation- Enhanced IR Optical System- MEMS Fuze- Thin Celled Thermal Battery
Cost- Automated/Common Design, Manufacturing & Test- Common Distributed Architectures (Power & Data/Processing)- Open Architecture
Reliability- Technology Refresh- Design for Obsolescence
Safety- IM Compliant Motors
Producibility- Lead Free Manufacturing- Anti-tamper Coatings
Performance- GPS/INS w/Anti-Jam- Improved ICG&F- Low Cost Ladar Fuze/TDD- Increase RCS Sensitivity- Advanced Radome- Improved ECCM- Very Thin Celled Thermal Battery
Interoperability- Tactical Telemetry- Link-16 Type Comm Link- Integrated Fire Control
Cost- Automated/Common Design, Manufacturing & Test- Common Distributed Architectures (Power & Data/Processing)- Open Architecture
Reliability- Technology Refresh- Design for Obsolescence
Safety- IM Compliant Motors
Performance- Improved Algorithms for Adv ECM- Onboard Multi-Sensor Track Correlation and SIAP Data Fusion- Improved Lethality- Jet Reaction Control- Composite Airframe- High Thrust Divert System- Variable Thrust Motor- MEMS Airflow Shaping- Non Rigid Form Factor Energy Storage
Interoperability- Advanced Sensor-to-Weapon Link
IWS3E Advanced Programs Roadmap - Missile Technology
Evolution
IWS3E Advanced Programs Roadmap - Missile Technology
Evolution
Slide 14NDIA Conf 14 April 2004
IWS3E Advanced ProgramsTechnology Insertion Way
Ahead
IWS3E Advanced ProgramsTechnology Insertion Way
Ahead
Goal - Provide Advanced Tech Insertion Reqd to Meet Critical
Needs
Strengthen Foundation Improve Needs and Tech Base Assessment Capability
Increase Resources Available For Technology Transition Projects
Increase Access To Technology Information
Increase Technology Needs Outreach Efforts
Build On Success Broaden Participation In And Frequency Of Technology
Coordination Activities
Increase Cross-Program Communication And Project Coordination
Capability
Get Buy-in Via Joint Technology Investment Reviews
Increase Focus On Technology Transition