Post on 12-Apr-2017
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IMPROVING YOUR WAVE SOLDERING
S-DS300 Automatic dip soldering machineS-DS300 Automatic dip soldering machine
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6 Basic Steps of Wave/Selective Soldering
• Component preparation• Insert components• Apply Flux• Preheat PCB• Soldering• Cool down
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Preforming THT components
• Cost saving• Higher production output• Quality
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The effect of hole sizes
• Hole size less than 1.5 times lead thickness – bend of slightly less than 90º
• A dimple is formed on the lead for hole size more than 1.5 times lead thickness
• Raised from PCB to allow for cleaning or heat dissipation
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Selective Pallets
• Stable support platform for PCB• Eliminate masking by hand• Eliminate glue dotting for SMD’s• Reduce solder defects such as skips and bridging• Pockets and channels promotes solder flow • Standardize conveyor width – reduce setup time• Multiple PCB’s on a pallet – higher throughput
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Wave Soldering Process
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Fluxing
Why do we need flux?
• Prevents oxidation• Acts as a wetting agent
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Fluxing – Wave SolderTwo common types of fluxing methodsin wave soldering:
Foam fluxing Spray fluxing
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Foam fluxing – Wave Solder
• Flux control required• Ideal contact area = 20mm• Ideal flux stone pore size =
3um - 10um• Air pressure 2 - 3bar• Raise or lower the whole flux
station to achieve the right contact
• Never use a foam fluxer without an air knife
• Not suitable for water based fluxes
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Flux Control (foam fluxer)
Critical parameters:
• Flux density (solid content)• Water content• Temperature• Contamination from PCB or
compressed air• Replace flux in foam fluxers
completely every 40 hours• Cleaning of foam pipe
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Spray fluxing - Wave Solder
• Single side PCB requires 100 Micro Gram per Cm2 of PCB surface (Check Flux Data Sheet)
• PTH PCB’s will require 20% more• Check the spray pattern by wrapping a
piece of photo sensitive fax paper around a bare PCB and let it run through the fluxer
• Combination of airflow, flux flow, moving speed, distance of nozzle to PCB
• Paper must be evenly gray from flux, not wet and certainly not dripping
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Advantages of Spray fluxing
• Quantifiable application of the flux deposit (SPC)
• No in-process QC of the flux• No thinner consumption• Direct application from can • Reduced flux consumption• No flux drippings over the
preheat zone
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Conversion to Spray flux
• The ‘Plug ’n Spray’ spray-fluxer
• Stand alone fluxer
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Incorrect Flux Volume
• Too little flux can cause soldering defects such as bridging and skips
• Excessive flux can lead to solder balling and unwanted and uncured residue left on the PCB
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Flux Classification - IPC-J-STD-004
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Flux Types
Alcohol based (100% VOC)
• Long history of reliability & process know how • Modest in preheat requirements • Can be applied by spray or foam• High residue safety and wide process window
• Hazardous & flammable material • Contributing to the "green-house" effect
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Flux Types
Low-VOC (40% water / 60% alcohol)
• Modest in preheat requirements• Safer to the environment
• Can be applied by spray or foam • High residue safety and wide process window
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Flux Types
Water based (100% VOC-free)
• More soldering power• Environmentally safe • Non-flammable
• Requires more preheat • Spray fluxing only • Some process adjustments required• Risk for corrosion if flux is not properly polymerized by
the heat of the wave (flux under pallets, on topside or just too much flux applied)
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Preheat
• Evaporation of the solvent in the flux • Activating the flux • Minimizing the Delta T between the PCB and the solder wave
Functions of Preheating
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Preheat
Types of Preheating
Infra Red elements
Quartz elements
Forced Convection
Pictures courtesy of Seho
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Preheat Profile
• Preheat temperature is measured on the top side of the PCB• Typical max. preheat temperature Sn/Pb = 90ºC - 120ºC• Typical max. preheat temperature Pb-Free = 100ºC - 130ºC
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Measuring Preheat Temperature
Temperature Profiler /Thermocouples Adhesive
Temperature Strips
Infrared Thermometer
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Measuring Preheat Temperature
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Incorrect Preheat
• Preheat too high or too long may break down the flux activation system and cause shorts / icicles
• Preheat too low may cause problems such as skips or unwanted residues left on the PCB
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Soldering Phase
• Wetting Phase• Wicking Phase• Drain Phase
Wetting
Wicking
Draining
PCB ------ >>
Wav
e
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Soldering Phase• Nominal angle = 7º• Contact Width = 20 to 40mm wide for Delta Wave • Contact Width = 15mm wide for Chip Wave• Dwell time Tin/Lead = 3.5 sec @ 235ºC solder pot temperature• Dwell time Tin/Lead = 2.5 sec @ 250ºC solder pot temperature• Dwell time Pb-Free = 2 to 5 seconds @ 260-270ºC solder pot temperature,
depending on the application• Conveyor speed = 0.8 – 1.5 m/min• Conveyor speed (m/min) = Contact width (cm) x Dwell time (sec)• Wave height = 1/3 – 2/3 of PCB thickness • High temperature glass plate is used to measure contact width and parallelism
to the wave
7ºContact width
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Wave Nozzle Configuration
Delta Nozzle
• Standard Nozzle for through hole components• Fast moving solder moving in the opposite
direction of PCB for wetting action• Small volume of solder moving along with the PCB
for wicking action
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Wave Nozzle ConfigurationChip Nozzle
• Turbulent wave• Can be added in addition to the Delta Nozzle• High Kinetic Energy• Avoids shadowing
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Wave Nozzle ConfigurationDual Wave
• Turbulent chip wave combined with a slow moving horizontal wave overcomes the limitations of other wave types
• Solution for overcoming the shadow effect on SMT components not aligned to the wave
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Wave Nozzle Configuration
Other Nozzles
• For components requiring high wave pressure or high flow dynamics
• For PCB’s with high thermal mass• To optimize contact time
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Solder Alloy
Lead Containing Alloy Sn/Pb
• Contains Tin / Lead• Sn63/Pb37• Melting point of 183ºC• Solder pot temperatures from 235 - 250ºC• Eutectic alloy – melts and solidifies at the same temperature• Low surface tension – good wetting• Low viscosity – great hole fill and top side fillet forming
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Solder Alloy
4 Popular choices for Lead-Free
• SAC (Tin/Silver/Copper)• SAC + X (Tin/Silver/Copper + X)• SnCu (Tin/Copper)• SnCuNi (Tin / Copper / Nickel)
Your choice of alloy will be dependant on yourspecific requirements
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Solder Alloy
SAC
• Tin / Silver / Copper• Typical: Sn96.5/Ag3.0/Cu0.5• Melting point of 217 - 221ºC• Solder pot temperature 260ºC
• High silver content• Solder joints looks different than Tin-Lead• Dull joints due to shrinkage
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Solder Alloy
SAC + X
• Tin / Silver / Copper + X• X = Co, Fe, Bi, Si, Ti, Cr, Mn, Ni, Ge, and Zn• Typical: Sn98.3 Ag0.3 Cu0.7Bi0.7• Melting point of 216 - 225ºC• Solder pot temperature 265ºC• Lower material costs vs higher silver SAC alloys• Performance and appearance similar to higher silver SAC
alloys
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Solder Alloy
SnCu
• Tin / Copper• Sn99.3/Cu0.7• Melting point of 227ºC (Eutectic alloy)• No silver content - lowers alloy cost• Lower tendency to leach copper - less loss of
conductive copper in tracks and pads• Poor fluidity at typical lead free temperatures • Poor through-hole filling and forming of solder bridges
between components
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Solder AlloySnCuNi
• Tin / Copper / Nickel• Sn99.25/Cu0.7/Ni0.05• Melting point of 227ºC• Eutectic alloy – free of shrinkage• Solder pot temperatures from 265ºC • Does not contain silver - running costs are low • Small addition of nickel in to the SnCu alloy improves fluidity• Good fluidity – less bridges and better hole –filling• Dross rate equal or lower than tin-lead solder• Lower aggressiveness towards stainless steel• Bright smooth solder joints
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Solder Bath Analysis
• For Tin-Lead, every 3 to 6 months• For Lead-Free, every 4 – 6 weeks after initial fill during the first 6
months, thereafter every 3 to 6 months is recommended
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Transition to Lead Free Alloys
• Higher preheat temperatures required
• Corrosion of metal parts
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Solutions for Lead-Free
• Pause the PCB in the preheater
• Coated parts available, pumps, solder nozzles and solder pot
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Cooling Phase
• Forced cooling or not?• No improvement in joint quality• To speed up production
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Nitrogen or Not?
• Displaces oxygen• Reduced dross formation• Increase surface tension• Improved flow of solder• Better wetting
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Most common causes of problems
XComponent leads too long
XXSolder wave height too low
XXSolder mask properties
XXXFlux density too high
XXSolder wave height too high
XSolder temperature too high
XXXXXConveyor speed too high
XXXXPreheat temperature too high
XXXXSolder temperature too low
XXSolder is contaminated
XXMoisture trapped in PCB
Conveyor speed too low
X
X
X
Blowholes
XXXXUneven or erratic solder wave
XXXXPreheat temperature too low
XXConveyor angle too small
X
X
Solder Balls
XXXPoor solderability of the PCB or component
XXFlux density too low
Excessive flux
XXXInsufficient flux
Insufficient Hole Fill
BridgesSkips
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Shenzhen Southern Machinery Sales and Service Co., Ltd
Add:Room 1806 Block 3 Jinyun COFCO, Qianjin 2nd Road, Xixiang, Baoan District, Shenzhen ,China
S-DS300 Automatic dip soldering machineS-DS300 Automatic dip soldering machine
Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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* Help you in Long lead insertion welding
* contrast high wave soldering energy saving operation cost nearly 28000USD a year
* contrast double wave soldering save running cost 16000USD each year
Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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7 inch touch screen + PLC intelligent control and temperature control system Intelligent precision step by step +Imported wire rod system Tracking step type automatic spray system 85 kg small capacity lead-free tin
furnace Maintenance free spray system + automatic welding supply system Three sections of transmission system + manual adjustable width Pure tin slag function automatically Tin stove liquid level automatic detection technology New type of far infrared heating technology, high efficiency and energy
saving heating Ductile cast iron heating plate (Energy saving 40%) Strong wind cooling device Automatic into the PCB Tin furnace overtemperature protection +Preheating overtemperature
protection
Product features Product features ::
Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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Far infrared heating technology (more rapid heating rate + hot
air heating system) High quality control
Details of some parts:
Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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Step tracking precision spray system
Precision welding system .The users can control at will, suitable for all kinds of welding length of foot
Shenzhen Southern Machinery Sales and Service Co., LtdShenzhen Southern Machinery Sales and Service Co., LtdAdd:Add:Room 1806 Block 3 Jinyun COFCO,Qianjin 2nd RoadRoom 1806 Block 3 Jinyun COFCO,Qianjin 2nd Road,, Xixiang, Baoan District, Shenzhen ,China Xixiang, Baoan District, Shenzhen ,China
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Welcome inquiry
1,Please visit : www.smthelp.com
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3, Know more our team: https://cn.linkedin.com/in/smtsupplier
4, Welcome to our factory in Shenzhen China
5, Looking forward to your email: jasonwu@smthelp.com