Imec presentation

IMECAT A GLANCEAT A GLANCE

HISTORY

▸ Established by state

HISTORY

▸ Established by state government of Flanders in 1984

▸ Independent non-profit organization

▸ Worldwide reach

▸ Initial investment: 62M€

▸ Initial staff: ~70

MISSION

▸ W ld l di h i

MISSION

▸ World-leading research in nano-electronics

▸ Scientific knowledge with Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energyhealthcare and energy

▸ Industry-relevant technology solutionstechnology solutions

▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a

sustainable society

FULL ECO SYSTEMFULL ECO SYSTEM

Universities

GovernmentEurope IMEC

Industryy

FACTS & FIGURES

▸ Total revenue in 2011 of

FACTS & FIGURES

▸ Total revenue in 2011 of 300M€, a growth of 5%

▸ 1 773 publications R&D 1,773 publications R&D related in 2011

▸ 132 patents awarded & p133 patents submitted in 2011

▸ Collaboration with 600 companies & 208 universities

▸ 600 residents

Top 5 foreign employees1 The Netherlands (# HEADCOUNT 1. The Netherlands (#

159)2. China (# 87)3. France (# 86)4. India (# 76)May 2012:

HEADCOUNT

4. India (# 76)5. Japan (# 61)▸ 1,077 Belgians

▸ 72 foreign nationalities 159

87 8676

1 1 3 1 2 27 7 5

1 1 1 4 4

1 1 2 1

1 1 2 5 81 3 1 1 1 4 1 4

8 5 61 2

IMEC IN THE WORLDIMEC IN THE WORLD

BelgiumBelgium

The NetherlandsThe Netherlands

office Japanoffice Japanoffice USoffice USChinaChina

TaiwanTaiwanIndiaIndia

Silicon Organic solar cell

NERF 200mm pilot line

Silicon solar cell

lineline NERF

300mm pilot line

Nano biolabs

450mm 450mm ready

STATE-OF-THE-ART RESEARCH FACILITIESRESEARCH FACILITIES

300mm PILOT LINE300mm PILOT LINE

IMEC TOWER

‣ Expansion of 14 208 m2‣ Expansion of 14,208 m

‣ 16 floors – capacity of 450 people & lab space

RESEARCH PROGRAMS FOR FULL ECO SYSTEM

Green RadioLow power

wireless communication

ImagingImage sensors

& vision systems

EnergyPhotovoltaicsPower devices

Sensor systems for industrial applications

BANLife Sciences

Human++

communication

OrganicCMORE

LEDsapplications

Core CMOSelectronicsMEMS, Sensor

PhotonicsLithography Devices Interconnects

SCALINGSCALING

‣ 1965: 1965: Lithography enabled scaling

‣ 2002-2003: ~ 90 nm2002 2003: 90 nmMaterials enabled scaling

‣ ~ 14 nm:‣ 14 nm:3D enabled scaling

FINFETFINFET

‣ 22nm – 14nm22nm 14nm

‣ FinFET introduction at 22nm for high-end 22nm for high end applications

‣ 14nm for foundry ‣ 14nm for foundry processes

LOGICLOGIC

‣ High mobility channelHigh mobility channel

‣ 10 nm – 7nm

LOGICLOGIC

‣ High mobility channelHigh mobility channel

‣ 10nm – 7nm

InGaAs

LOGICLOGIC

‣ New device concepts

Tunnel FET

New device concepts

‣ Tunnel FETPinch-off FET

‣ Pinch-off FET

‣ 7nm – 5nm

ReRAMReRAM

‣ Resistive RAMResistive RAM

‣ Integration in a vertical conceptconcept

‣ In 2011: world’s smallest, fully-functional HfO2-based fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm²

DRAMDRAM

‣ STT RAM as stand alone STT RAM as stand alone and for embedded memory

3D INTEGRATION3D INTEGRATION

‣ Reducing floor space –Reducing floor space small form factor

‣ 3D stacking of memory on 3D stacking of memory on logic or RF on interposer

OPTICAL I/OOPTICAL I/O

‣ Extreme high bandwidth Extreme high bandwidth I/O in high performance computing

‣ Imec world-first sub-100nm photonics components on 300mm Si technology with optical li h hlithography

EUVEUV

‣ ASML preproduction ASML preproduction scanner NXE:3100 for extreme UV lithography

LITHO POWERLITHO POWER

‣ 16nm half pitch16nm half pitch

‣ Phenomenal lithographic power can be achievedpower can be achieved

DIRECTED SELF DIRECTED SELF ASSEMBLY

‣ Extending optical g plithography beyond its current limits

‣ Alternative patterning enabling frequency multiplication through use p gof block copolymers

INSITEINSITE

‣ Technology insights for gy gproduct roadmapsSYSTEM DESIGN

(Fabless - Fablite)

INSITE

PROCESS TECHNOLOGY(Foundry)

INSITEINSITE

‣ Linking process technology

Technology Option

selection g p gy& system design

Path-findingTechnology-

designTest chips

Design & gco-exploration build

ModelMeasure &

Measure & characterize

‣ Investment > 1B$$

‣ Unique lithography cluster centered around ASML equipment

‣ Advanced equipment and preproduction toolspreproduction tools

‣ Ballroom type of cleanroom

4 800 ² l 1 000 ‣ 4,800m² class 1,000 area

300mm PILOT LINE:

‣ Silicon pilot line for (sub-)22nm‣ Silicon pilot line for (sub-)22nm

‣ Semi-industrial operation - 24/7, process monitoring, short cycle time

PREPARING 450mmPREPARING 450mm

‣ Funding Flemish gGovernment

‣ Towards Europe’s innovation engine

GLOBAL NETWORK

SYSTEM COMPANIES

MEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS

EQUIPMENT SUPPLIERS

MATERIAL SUPPLIERS

SOFTWARE SUPPLIERS

GLOBAL NETWORK

Foundries Fablite FablessLogic IDMMemory IDM

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CORE CMOS PARTNERS

LamRESEARCH

& vision systems

BANLife Sciences

Human++

communication

OrganicCMORE

LEDsapplications

BODY AREA NETWORKSNETWORKS

BODY AREA internetdoctor BODY AREA

NETWORKShospital

W bl h l h d ▸ Wearable health and comfort monitoring

HEALTH PATCHHEALTH PATCH

M l i ▸ Multi parameter: - heartbeat - skin temperature- skin conductance- sweat analysis - chemical sensingg

HEALTH PATCHECG PATCHECG PATCH

Ul l ECG ▸ Ultra-low power ECG patch

▸ Bluetooth low energygy▸ Embedded algorithm▸ 30 days autonomy

WIRELESS EEGWIRELESS EEG

A li iApplications:▸ Improving traffic safety

through drowsiness gmonitoring

▸ Games that adapt to the player’s cognitive stateplayer s cognitive state

▸ E-learning that adapts to the user’s concentration

▸ Accurate EEG monitoring at home, e.g. epilepsy patients

patients

ULTRA LOW ULTRA LOW ENERGY DESIGN

Di i l d i f ▸ Digital system design for battery operated and harvested devices with 10-100 times less power consumption

▸ Reliable near-threshold Reliable near threshold design

▸ Ultra energy efficient bi di l ibiomedical processing

MOBILE MOBILE DIAGNOSTICS

Aff d bl ▸ Affordable ▸ Health monitoring to rural

environments in developing countries

4D RT imaging

C i i Mi hi d

4D RT imaging

▸ Capacitive MicromachinedUltrasonic Transducers technology

▸ Towards mobile real-time 4D ultrasound

▸ More precise & faster

Mock up

▸ More precise & faster ultrasound scans

CMUT: BASED ON CMUT: BASED ON SiGe MEMS

SiG MEMS f ▸ SiGe MEMS on top of CMOS

▸ Membranes integrated gwith electronics

▸ More compact, faster, more sensitive increasing more sensitive, increasing pixel density

LIFE SCIENCES:EARLY DIAGNOSTICSEARLY DIAGNOSTICS

EARLYEARLYDETECTION

E l d i f ▸ Early detection of cancer cells

▸ Secondary tumors are ymain cause of most cancer deaths

▸ Challenge: detecting one ▸ Challenge: detecting one in 5 billion cells

INSPECTION INSPECTION CIRCUITS

Chi i h h d f ▸ Chip with thousands of parallel inspection circuits

▸ Each containing gelectronics, microfluidics & imaging hardware

▸ Goal: inspect 20 million ▸ Goal: inspect 20 million cells per second with high reliability

LIFE SCIENCES:PERSONALIZED THERAPYPERSONALIZED THERAPY

STEM CELLSSTEM CELLS

T di b i b ▸ Treat diabetes patients by replacing faulty pancreas cells with new pancreas cells

▸ Reprogrammed on the basis of own stem cellsbasis of own stem cells

STEM CELL STEM CELL BIOREACTOR

G i ll & i ▸ Growing cells & tissues on chips

▸ Two-way communication ybetween electronics & cells

▸ Expertise in electrode ▸ Expertise in electrode arrays on active CMOS for cell recording of

& di llneurons & cardiac cells

PRECISE PRECISE REPROGRAMMING

Ch ll l f f ▸ Challenge: a platform for precise reprogramming and growth of stem cells

▸ Built on expertise in advanced semiconductor equipment & advanced equipment & advanced metrology

NERF LABNERF LAB

▸ I & VIB & KU L▸ Imec & VIB & KU Leuven▸ Unraveling the human

▸ Research interests: - sensory integration &

i i h processing in the zebrafish brain

- neural circuits &behavior

- functional assembly of l i it

neural circuits

HUMAN++ PROGRAM PARTNERSHUMAN++ PROGRAM PARTNERS

& vision systems

BANLife Sciences

Human++ Green RadioLow power

OrganicCMORE

LEDsapplications

Core CMOS

communication

electronicsMEMS, Sensor Photonics

Lithography Devices Interconnects

WIRLESS SENSORSWIRLESS SENSORS

▸ Improving connectedness▸ Improving connectedness

▸ Smarter world: - smart healthcare- smart buildings - smart phone

smart display- smart display

WIRELESS WIRELESS COMMUNICATION

▸ Innovative solutions for ▸ Innovative solutions for tomorrow’s wireless communication

▸ By combining advanced IC technology with innovative design strategies & smart design strategies & smart software techniques

▸ Fully-integrated energy-efficient solutions with more performance & flexibility

RECONFIGURABLE RECONFIGURABLE RADIOS

▸ Towards low cost & low▸ Towards low-cost & low-power reconfigurable radios

▸ Enabling future 4G networks and digital video broadcasting

▸ Reconfigurable analog front-Reconfigurable analog frontend

▸ Reconfigurable digital b b dbaseband

▸ Spectrum sensing▸ Record breaking ADCs

▸ Record breaking ADCs

mmWAVEmmWAVESOLUTIONS

‣ Wireless solutions that ‣ Wireless solutions that exploit the bandwidth capacity available at 60GH f h t 60GHz for short-range Gigabit/s communication

‣ Radar & backhaul Radar & backhaul applications emerging

ULTRA-LOW ULTRA LOW POWER RADIOS

‣ Radios for battery & ‣ Radios for battery & energy harvested devices with power consumption th t i 10 100 ti l that is 10-100 times lower than conventional low-power systems

PARTNERS WIRELESS TECHNOLOGYS W SS C O OG

BANLife Sciences

Human++ ImagingImage sensors

& vision systemscommunication

OrganicCMORE

LEDsapplications

TARGET MARKETSTARGET MARKETS

▸ Spacep▸ Instrumentation▸ Machine vision▸ Medical▸ Biology

SPECIALIZED SPECIALIZED IMAGING

▸ Ultra fast ▸ Non-visible light▸ Enhanced performance▸ Hyperspectral▸ Lensless

ULTRA FAST ULTRA FAST IMAGING

Challengeg▸ Fast readout at low

power consumption▸ Towards million

frames/sec

Building on imec expertise:▸ High speed ADCs▸ Embedded CCD

IMAGING NON IMAGING NON VISIBLE LIGHT

▸ Fully qualified EUV sensors y qinstalled in customer’s product: ASML/3100 lithography toollithography tool

- EUV Energy sensor to monitor EUV dosemonitor EUV dose

- 2 EUV position sensors to calibrate, align and focus lens systems

ENHANCED ENHANCED PERFORMANCE

▸ Backside illumination for:- High quantum

efficiencyBroad spectral range - Broad spectral range from 193nm to 1μm

HYPERSPECTRALHYPERSPECTRALIMAGING

Advantages: g▸ More spectral

information (than RGB)▸ Extreme miniaturization▸ Low cost▸ High speed▸ High speed▸ Wafer-level filter

integration

LENSLESSLENSLESS

Microscopic imaging over a p g glarge area

Biomedical applications:▸ Cell sorting & monitoring

(flow cytometry)▸ Molecular diagnostics Molecular diagnostics

(biomarkers assays)▸ DNA sequencing150 µm

& vision systems

BANLife Sciences

Human++ Sensor systems for industrial applicationscommunication

OrganicCMORE

Core CMOS

applications

APPLICATIONSAPPLICATIONS

‣ Smart buildingsg

‣ Preventive maintenance

‣ LogisticsLogistics

‣ Automotive

‣ Monitoring environmental ‣ Monitoring environmental parameters

SENSOR SYSTEMSSENSOR SYSTEMS

‣ Long-time autonomy g y

‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y

MEMSMEMSHARVERSTER

‣ Piezoelectric harvesters

‣ MEMS harvester to power intelligent tire

‣ Record output of 489µW

ETHYLENEETHYLENESENSOR

‣ Sensor in one single chipg p

‣ Monitor fruit ripening

‣ Low detection limits low Low detection limits, low cost, low power consumption

2.3/2.4 GHZ 2.3/2.4 GHZ TRANSMITTER

‣ Multi-standard transceiver for sensor networks

‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards

‣ 3 to 5 times more power efficient than state-of-the-

Bl h LE art Bluetooth LE

& vision systems

BANLife Sciences

Human++ EnergyPhotovoltaicsPower devices

LEDscommunication

OrganicCMORE

applications

Core CMOS

ENERGY ENERGY STRATEGY

▸ Solar energy generationSolar energy generation

▸ Switching energy

▸ Storing energy▸ Storing energy

▸ Saving energy

SILICONPVPV

COMBININGCOMBININGEXPERTISE

▸ Process steps▸ Process steps▸ Materials ▸ Device/module conceptsp

Towards world record performance

SILVER SILVER REPLACEMENT

▸ 7% of all silver used in PV▸ 7% of all silver used in PV▸ A major part of PV cell cost

is silver▸ Replacing silver by copper

Cu-PLATED Cu PLATED Si SOLAR CELL

▸ Copper electroplating▸ Copper electroplating▸ >21% efficiency

INTERDIGITATEDINTERDIGITATEDBACK-CONTACT SiSOLAR CELL

▸ > 23% efficiency

SOLAR CELL

▸ > 23% efficiency

I-MODULEI MODULE

▸ Cell integration of ultra▸ Cell integration of ultra-thin wafers onto module glass

▸ Integrating additional electronics to module for power conversion & load poptimization

Si-PV IIAP PARTNERS

ORGANIC CELLSORGANIC CELLS

▸ Towards: - 10% efficiency

10 years lifetime- 10 years lifetime

INVERTED INVERTED POLYMER CELL

▸ World record efficiency 8,3%

COMBINING COMBINING EXPERTISE

▸ Materials and cell architectures

▸ Collaboration between ▸ Collaboration between world-class chemical companies, innovative d l developers & imec

GaN-on-Si LEDsGaN on Si LEDs

▸ LED on 200mm GaN-on-Si wafers

▸ To make LEDs cheaper▸ To make LEDs cheaper

GaN-on-Si LEDsGaN on Si LEDs

▸ Process flow fully compatible with 200mm CMOS processing lineCMOS processing line

GaN-ON-Si power GaN ON Si power devices

▸ GaN power devices on 200mm Si substrates

OLEDOLED

▸ New flexible OLED lighting program

▸ Economically scalable ▸ Economically scalable route to high-volume manufacturing

▸ Low power consumption, high resolution, large area, outdoor readability, outdoor readability, flexibility & light weight

GaN PARTNERS

25 year solar25 year solar cell research

& vision systems

BANLife Sciences

Human++

communication

Organic

LEDsapplications

Core CMOS CMOREelectronicsLithography Devices Interconnects MEMS, Sensor

Photonics

MEMS NANO-PHOTONICS

‣ Turn your silicon concept y pinto a product

SENSORS POWER-HIGH V-HBT

BIO-INTERFACE GaN

STEP 1 STEP 4

‣ Turn your silicon concept

- CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC

IN y pinto a product

STEP 2

- PROCESS DEVELOPMENT

AT IMEC

STEP 5

TRANSFERLOP

- PROCESS DEVELOPMENT - PACKAGING - TESTING - RELIABILITY

- TRANSFER

STEP 3

- PRODUCT QUALIFICATION

STEP 6

- HIGH-VOLUME MANUFACTURING

QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER

EUV SENSORSEUV SENSORS

‣ High-quality EUV sensors g q yfor ASML’s next-generation lithography tools

‣ Main requirements:- superior lifetime - sensitivity to direct and yhigh doses of EUV irradiation

N i‣ Next generation:- NXE:3100- NXE: 3300

BIOSENSORSBIOSENSORS

‣ Biosensor chips for pGenalyte diagnostic & molecular detection equipmentequipment

‣ CMORE service making use of imec’s silicon photonic ptechnology

CMORE PARTNERS

& vision systems

BANLife Sciences

Human++

communication

LEDsapplications

Core CMOS OrganicMEMS, Sensor

PhotonicsLithography Devices Interconnects electronics

SYSTEM ON FOILSYSTEM ON FOIL

Thin-film electronics on flexible plastic foils

Applications:Applications:

▸ rollable displays for tablet computers or phonesp p

▸ electronics printed on objects

▸ intelligent food packaging, or paper with integrated electronics

electronics

MICROPROCESSOMICROPROCESSOR

▸ First microprocessorp

IMECWHAT WE OFFERWHAT WE OFFER

BUSINESS MODELBUSINESS MODEL

Services TrainingServices Training

Spin-offs Transfer & licenses

Joint Joint R&D

OPEN OPEN INNOVATION

Ri kRi kIP

CostCostRiskRisk

Services Training

TalentTalent Spin-offs

Transfer & licensesoffs licenses

Accelerated, ff R&D

Joint R&D

cost-effective R&D

OPEN OPEN INNOVATIONPartner

Partner B

Partner E

ProgramBE

Services Training

Partner C

Partner D

Spin-offs

I i d t i l ffili ti

Joint R&D

Imec industrial affiliation programCustomized programs

RESEARCH RESEARCH PROGRAMS

System

Fabless

System

Services Training

FablessFablite

Logic IDM

Memory IDMSpin-offs

Transfer & licensesFoundries

Suppliers

offs licenses

Joint SuppliersEquipmentSuppliers

MaterialSuppliers

EDA SAT

Joint R&D

RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEMFOR FULL INDUSTRY ECO SYSTEM

Foundries Fablite FablessLogic IDMMemory IDM

SERVICES

▸ ASIC services:

SERVICES

- Design- Prototyping to low-volume

▸ CMORE platform:- Design- Process techn.

Services Training

development- Prototyping to low-volume

Spin-offs

Transfer & licenses

▸ CAMS:- A unique set of reliability and Joint

offs licenses

q ycharacterization services

Joint R&D

TRAINING

▸ Imec Academy

TRAINING

▸ Training for industry & academia on advanced concepts and technologies

▸ Advanced training programs on IC technology and design and related Services Training

▸ E-learning and web-based training

▸ On-line knowledge exchange Spin-offs

Transfer & licenses

offs licenses

Joint R&D

www.imec-academy.be

SPIN-OFFSSPIN OFFS

Services Training

Spin-offs

Joint Integrated in Cypress Integrated in Agilent T h l i

Integrated in Synopsis Inc. Joint R&D

g ypTechnologies

Integrated in ARM Belgium Integrated in Huawei

Alphabit & UCB Electronics integrated in Agilent TechnologiesCobrain integrated in Matrix Integrated Systems, Inc.

TRANSFER & TRANSFER & LICENSES

▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform

Services Training▸ IP blocks:- ADCs

Spin-offs

Transfer & licenses

ADCs- Software-defined radio- Reconfigurable processor- offs licenses

Joint R&D

IMECIN FLANDERSIN FLANDERS

LEVERAGE TO FLANDERS

With a dedicated team stimulating, initiating &

coordinating cooperation with Flemish companies & with Flemish companies &

innovation actors

Exploration, transfer & consolidation in Flanders

Worldwide industrial networkof top companies

Build up of technology portfolio in generic R&D ProgramsBuild-up of technology portfolio in generic R&D Programs

COOPERATION WITH LOCAL COMPANIES / ACTORSLOCAL COMPANIES / ACTORS

Timely insight and inputs for LT research

Participation in LT/MT/ST

Sharing technological

LT research research

Application of Application of 1 few

Focussed added valuetechnological know-how

ppresearch results

Cooperation with local

Informing about technological

Support for development of

d local companies/actors

technological opportunities new products

and processesnew products and processes

1 manyLow threshold

1 1High thresholdLow threshold

Generic added valueHigh thresholdSpecific added value

EXPANSION MODEL: MICROELECTRONICS FOR BENEFIT OF OTHER SECTORSMICROELECTRONICS FOR BENEFIT OF OTHER SECTORS

AutomotiveTextile

FoodBiomedical

Construction Health & WellnessElectronic Design

IMEC’S IMPACT ON THE LOCAL INDUSTRYEVOLUTION COLLABORATION LOCAL COMPANIESEVOLUTION COLLABORATION LOCAL COMPANIES

464486500

1984 2001: 142 local companies

350381

411447

5002002 2011: 344 extra local companies, >60% SME’s!

102 110127

142166

26 32 45 5774 86

102 110

01992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011

OUR PARTNERS

1066 4

Hasselt8 24

102 68

PARTNERS SPREAD OUT OVER FLANDERS

A SAMPLE OF THE FLEMISH PARTNERS

COOPERATION IN DIFFERENT SECTORS 2011WITH LOCAL COMPANIES WITH LOCAL COMPANIES

Non-ICTMicroelectronics

TextileAutomotive

Medical

FoodGraphicsWellness

18% Electronic prod.

ICT (others)

HealthChemical

ConstructionDomotics

Imec presentation

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