How Engineering Supports Manufacturing

How Engineering Supports Manufacturing

Larry E. HandLarry E. Hand

Peavey ElectronicsMarch 28, 2000

IntroductionIntroduction

Senior Design Senior Design Larry E. Hand, MEE PE MCSELarry E. Hand, MEE PE MCSE

Master Electrical Engineering, Auburn Master Electrical Engineering, Auburn University 1977University 1977

Harris Corporation, Melbourne Fl. 1977-83Harris Corporation, Melbourne Fl. 1977-83 Peavey Electronics, 1983-PresentPeavey Electronics, 1983-Present

Proof of Concept..Proof of Concept..

After Proof of Concept, What Next?After Proof of Concept, What Next? VacationVacation Big BonusBig Bonus Two AttaboysTwo Attaboys Another ProjectAnother Project Physical Design and Transition to Physical Design and Transition to

ManufacturingManufacturing

Life After PrototypingLife After Prototyping

Physical Design and PC LayoutPhysical Design and PC Layout Parts ProcurementParts Procurement CostingCosting Agency ApprovalsAgency Approvals Documentation, Literature and ManualsDocumentation, Literature and Manuals

More things to considerMore things to consider

Mechanical Design and PackagingMechanical Design and Packaging Manufacturing DeliverablesManufacturing Deliverables Murphy’s Law- ECN’s and reworkMurphy’s Law- ECN’s and rework It’s Always yours..It’s Always yours..

Printed Circuit Board DesignPrinted Circuit Board Design

Component PlacementComponent Placement Input/Output locationsInput/Output locations Mounting ConsiderationsMounting Considerations Technology SelectionTechnology Selection Restricted areasRestricted areas Minimize crossing countMinimize crossing count Thermal ManagementThermal Management

Printed Circuit Board DesignPrinted Circuit Board Design

Electrical ConsiderationsElectrical Considerations High Impedance NodesHigh Impedance Nodes Differential signal pairingDifferential signal pairing Shielding for Magnetic and Capacitive CouplingShielding for Magnetic and Capacitive Coupling Transmission Line Effects- OverShoot and Transmission Line Effects- OverShoot and

RingingRinging EMI/EMCEMI/EMC Ground is NOT Ground......Ground is NOT Ground......

Printed Circuit Board DesignPrinted Circuit Board Design

Manufacturing ConsiderationsManufacturing Considerations Component SpacingComponent Spacing OrientationsOrientations Hole SizesHole Sizes Insertion Tooling RestrictionsInsertion Tooling Restrictions Tooling HolesTooling Holes PanelizationPanelization

Parts Approval and ProcurementParts Approval and Procurement

Standard PartsStandard Parts Multiple SourcedMultiple Sourced

Cost EffectiveCost Effective Minimal Specifications requiredMinimal Specifications required Improved response to demand changesImproved response to demand changes Note: Not all parts are created equal....Note: Not all parts are created equal....

Single SourcedSingle Sourced Unique or Patented Technical AdvantageUnique or Patented Technical Advantage An Act of Nature could shut you down!An Act of Nature could shut you down! Know Who You’re Dealing WithKnow Who You’re Dealing With

Parts Approval and ProcurementParts Approval and Procurement

Custom PartsCustom Parts Product DifferentiationProduct Differentiation Protect Trade Secrets and Intellectual PropertyProtect Trade Secrets and Intellectual Property Extensive Specifications/DocumentationExtensive Specifications/Documentation If you change your mind, They’re still yoursIf you change your mind, They’re still yours Requires Accurate ForecastingRequires Accurate Forecasting

Parts Approval and ProcurementParts Approval and Procurement

Approved Vendor List (AVL)Approved Vendor List (AVL) Lead TimesLead Times Minimum QuantitiesMinimum Quantities Packaging/Delivery OptionsPackaging/Delivery Options

BulkBulk Tape and ReelTape and Reel Tape and AmmoTape and Ammo Trays or TubesTrays or Tubes

How is Cost DeterminedHow is Cost Determined

Material CostMaterial Cost Labor CostLabor Cost Manufacturing BurdenManufacturing Burden SG&ASG&A

How Much does it CostHow Much does it Cost

Material Cost---52% of Total CostMaterial Cost---52% of Total Cost Unit Price * Quantity for all BOM itemsUnit Price * Quantity for all BOM items

Labor Cost --- 8% of Total CostLabor Cost --- 8% of Total Cost Direct labor or value added labor required to Direct labor or value added labor required to

manufacture the productmanufacture the product

How Much Does it CostHow Much Does it Cost

Manufacturing Burden --- 17% of CostManufacturing Burden --- 17% of Cost Indirect Labor Indirect Labor UtilitiesUtilities FacilitiesFacilities Employee BenefitsEmployee Benefits Depreciation, rent, etc..Depreciation, rent, etc..

How Much Does it CostHow Much Does it Cost

Sales/General and Administrative -- 23% Sales/General and Administrative -- 23% Cost of Selling the ProductCost of Selling the Product Sales commissionSales commission AdvertisingAdvertising Service and WarrantyService and Warranty Corporate ManagementCorporate Management Research and DevelopmentResearch and Development IS, Bad Debt, etc..IS, Bad Debt, etc..

Agency ApprovalsAgency Approvals

ULUL CSACSA FCCFCC NOMNOM CECE NEMKONEMKO DEMKODEMKO

VDEVDE IRAMIRAM SASOSASO SANZSANZ SAASAA JISJIS and more.....and more.....

Documentation Documentation

User ManualUser Manual Technical SpecificationsTechnical Specifications Service ManualService Manual Assembly DirectionsAssembly Directions Marketing SupportMarketing Support Advertising CopyAdvertising Copy

PackagingPackaging

Protect Unit During ShipmentProtect Unit During Shipment Attractive at Point of SaleAttractive at Point of Sale AdvertisingAdvertising OEM or Consumer packagingOEM or Consumer packaging

PCB Manufacturing FlowPCB Manufacturing Flow

Top Side SMTTop Side SMT DIP IC’s and SocketsDIP IC’s and Sockets Axial leaded Axial leaded

componentscomponents Bottom side SMTBottom side SMT Radial leaded Radial leaded

componentscomponents

Hand AssemblyHand Assembly Wave SolderWave Solder Touchup and InspectTouchup and Inspect PrecheckPrecheck

Manufacturing DeliverablesManufacturing Deliverables

Programs for Automated Assembly Programs for Automated Assembly EquipmentEquipment Axial Sequencer and InsertionAxial Sequencer and Insertion Radial InsertionRadial Insertion DIP Socket and IC insertionDIP Socket and IC insertion Surface Mount Chips, IC’s, Odd Shaped Surface Mount Chips, IC’s, Odd Shaped

ComponentsComponents GenRad Automated TestGenRad Automated Test

Manufacturing DeliverablesManufacturing Deliverables

PCB Assembly DrawingsPCB Assembly Drawings Gerber FilesGerber Files Mechanical Fabrication DrawingsMechanical Fabrication Drawings Functional Test ProcedureFunctional Test Procedure Technical SpecificationsTechnical Specifications Trouble Shooting proceduresTrouble Shooting procedures Your Experience and KnowledgeYour Experience and Knowledge

Oops....Oops....

TolerancesTolerances Incomplete Beta TestingIncomplete Beta Testing Parts AvailabilityParts Availability Poor Manufacturing YieldPoor Manufacturing Yield Poor ReliabilityPoor Reliability Marketing Redirection/Feature AdditionMarketing Redirection/Feature Addition

Engineering Change OrdersEngineering Change Orders

ECO’s document a change that ECO’s document a change that manufacturing will implementmanufacturing will implement

Disposition of existing inventoryDisposition of existing inventory Disposition of Work In ProcessDisposition of Work In Process Reason for ChangeReason for Change Cost/Performance/Schedule ImpactsCost/Performance/Schedule Impacts

Engineering Change OrdersEngineering Change Orders

Safety - LiabilitySafety - Liability Recall, Disposition of units already soldRecall, Disposition of units already sold Obsolete inventoryObsolete inventory

Sustaining EngineeringSustaining Engineering

If you birth it, It’s always your babyIf you birth it, It’s always your baby Customer complaintsCustomer complaints Obsolete PartsObsolete Parts Unique PartsUnique Parts Warranty claims and Field FailuresWarranty claims and Field Failures Specification changes in standard Specification changes in standard

componentscomponents