Post on 09-Apr-2018
8/8/2019 FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly
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8/8/2019 FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly
http://slidepdf.com/reader/full/fab2asm-efficient-and-precise-3d-integration-of-heterogeneous-microsystems 2/4
3D integration is a rapidly emerging technology that vertically stacks and interconnects multiple materials,
technologies, and unctional components to orm highly integrated micro- and nanosystems or cross-sec-
torial applications such as medical implantable devices, intelligent sensors, fash memory, computer me-
mory, camera chips, and radio requency devices in mobile phones. 3D integration is a very promising
area o technological development and shows huge economic potential;
The state-o-the-art technology or 3D integration relies on robotic pick-and-place machines and machine
vision, which cannot be simultaneously very ast and very accurate. I high precision e.g. a micrometer
is needed, the cycle time o the integration can be very long, rom e.g. over ten seconds to minutes, or
even not achievable.
Concept o sel alignment :
Self alignment will contribute to fastand accurate 3D integration. Theinaccuracy of a fast pick and placeprocess is compensated by a liquidlayer that generates the driving forcefor accurate alignment.
ContExt
Component and interace design are important items in FAB2ASM enabling sel alignment. Essential or
3D integration is stacking o chips including electrical connection by through silicon via’s.
Main step or 3D Integration
sELF ALiGnmEnt For 3D intEGrAtion
MEMS RF AnalogLogic
DRAM
Component and interace design
Ultraast robotic coarse placing
High precision sel-alignment
Fixing and Bonding
3D Integration
8/8/2019 FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly
http://slidepdf.com/reader/full/fab2asm-efficient-and-precise-3d-integration-of-heterogeneous-microsystems 3/4
Applied research
WP2: Componentsand Interaces (IMEC)
WP3: High Precision Assembly (UFC)
WP4: Bondingand Joining (EMPA)
Industrialdevelopment
WP5: Integrationand Reliability (AALTO)
Demonstration
WP6: Demonstrations(NXP)
WP1: Specifcations and roadmapping
WP7: Dissemination, training and exploitation (UT)
WP8: Management ( AALTO)
ProJECt struCturE
FAB2ASM will develop a new manuacturing technology or 3D integration o mi-
croelectronics and microsystems which is simultaneously very ast and very accurate
– which currently is the bottle neck limiting industry take-up.
FAB2ASM will overcome the current confict between speed and accuracy by joining
the traditional robotic tools with the physics o sel-alignment – where tiny chips will
align due to surace tension o liquid or other physical orces acting at the microscale.
FAB2ASM will develop a highly industry relevant technology that not only reuses most
o the industrial process steps, but also improves the perormance o the integration
process in terms o precision and eciency.
FAB2ASM will allow handling o small (100 µm) and/or thin dies (20 µm) and ultra
high speed assembly (40,000 unit per hour), while ensuring industry proven relia-
bility. Three industry-led demonstrators will validate the achievements in the elds o
manuacturing equipment, photonic IC and microelectronics.
obJECtivEs
Robotics
Surace chemistry
Microabrication Microelectronics
Optoelectronics
Nanomaterials
8/8/2019 FAB2ASM : Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly
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Industrial partners
Beam Express, Switzerland
NXP, The Netherlands
Management consulting
ALMA Consulting Group, France
Research partners
AALTO University, Finland (coordinator)
University o Twente, The Netherlands
University o Franche-Comté, FranceEMPA, Switzerland
IMEC, Belgium
Supported by the European commission through the 7th Framework Programme or Research and deve-lopment with up to 4.7 Mio € out o a total budget o 7.1 Mio €
This 3 year project will run rom 1st May 2010 to 30th April 2013.
Project Coordinator:
Aalto University
Dr. Tech., Adjunct Proessor Quan Zhou, +358 9 470 25241
quan.zhou@tkk.
With the support o:
ALMA Consulting Group
Emmanuelle Bur, +33 (0)4 72 35 88 27
ebur@almacg.com
www.ab2asm.eu
Consortium
ACKnoWLEDGmEnt