Post on 12-Jan-2016
description
ECAL Monitoring System
Ivan Korolko (ITEP Moscow)
PRR, September 2004
Outline
Finalized light splitter
Fiber bundles configuration
Light distribution boxes
LED drivers and PIN diode boards
Planning
Light splitters
1) Very simple construction
2) Good uniformity of light yield for all fibers
3) Good reproducibility
4) High light yield
Produced and tested this summer
Light splitters uniformity
● central fiber
● 1st circle
● 2nd circle
● 1.2 mm fibers
Light splitters – LED housing
Fiber bundles
Fibers in bundle have different length to lighten the connection to optical contacts. (max ~50cm)
Corresponding number of fibers is grouped in bundle and molded with epoxy resin.
High temperature bending of fibers – technology optimization
• requires quite some man power (now)
• dangerous to break a fiber
• HERA-B experience (curved fibers forming bundle)
Fiber bundles configuration (1)
3.01 3.02 3.03 3.04
3.05 3.06 3.07 3.08
3.09 3.11
3.12 3.143.13
3.15 3.16 3.17 3.18
3.19 3.20 3.21 3.22
2.01 2.02 2.03 2.04
2.05 2.06
2.07 2.08
2.09 2.10
2.11 2.12 2.13 2.14
1.02 1.03 1.04
1.08 1.09
1.13
1.16 1.17
1.20 1.21
1.25 1.26 1.27
1.01
1.05
1.06
1.10
1.07
1.11
1.14 1.15
1.18 1.19
1.22
1.24
1.28
1.23
1.12
3.10
Outer and Middle sections:
Splitters 1 → 16+3
Inner section:
Splitters 1 → 9+3
Fiber bundles configuration (2)
Inner section:
reduced number of LEDs (factor 1.5)
3.01 3.02 3.03 3.04
3.05 3.06 3.07 3.08
3.09 3.11
3.12 3.143.13
3.15 3.16 3.17 3.18
3.19 3.20 3.21 3.22
3.10
Components of monitoring system
LEDs PiN diodes Trigger signals
Outer 84 28 84
Middle 56 14 56
Inner 88 22 88
Routing of bundles (1)
25 mm trays for inner ECAL section
1) 8-inner 2-middle bundles
2) 6-inner 4-outer bundles
3) 6-inner 2-middle bundles
4) 6-inner bundles
5) 6-inner 2-middle bundles
6) 6-inner 4-outer bundles
7) 6-inner 2-middle bundles
1st LDB (lower and upper)
Routing of bundles (2)
37 mm trays for middle ECAL section
1) 10-middle bundles
2) 8-outer bundles
3) 10-middle bundles
5) 10-middle bundles
6) 8-outer bundles
7) 10-middle bundles
2nd LDB (lower)
Routing of bundles (3)
45 mm trays for outer ECAL section
2) 13-outer bundles
6) 13-outer bundles
3rd and 4th LDB (lower)
Light distribution boxes (1)
Light distribution boxes (2)
1st lower box60 LEDs17 PiNs
2nd lower box56 LEDs16 PiNs
3rd lower box26 LEDs7 PiNs
4th lower box26 LEDs7 PiNs
LDBs for one half of ECAL
XYZ size # of LEDs # of PiNs
Upper box 720x880x120 60 17
lower box 1 720x880x120 60 17
lower box 2 720x880x120 56 16
lower box 3 624x500x120 26 7
lower box 4 624x500x120 26 7
Light distribution box (fragment)
LED driverLEDSplitterPiN diodePiN diode board
LED-PiN fiber
Bundles
1st lower box
3.15.1
3.15.2
3.15.3
3.15.4
3.16.1
3.16.2
3.16.3
3.16.4
2.11.1
2.11.2
2.11.3
2.11.4
2.12.1
2.12.2
2.12.3
2.12.4
1.18.1
1.18.2
3.12.1
3.12.2
3.12.3
3.12.4
3.13.1
3.13.2
3.13.3
3.13.4
3.14.1
3.14.2
3.14.3
3.14.4
3.19.1
3.19.2
3.19.3
3.19.4
1.22.1
1.22.2
3.20.1
3.20.2
2.20.3
2.20.4
1.24.1
1.24.2
3.17.1
3.17.2
3.17.3
3.17.4
1.28.1
1.28.2
3.18.1
3.18.2
3.18.3
3.18.4
3.21.1
3.21.2
3.21.3
3.21.4
3.22.1
3.22.2
3.22.3
3.22.4
Box size 720x880x120
Led driver 15x100 mm2
PIN diode board 40x100 mm2
Power for LEDs +5V, +25V
Power for PINs +/-6V, +25V
Trigger signals
LED amplitude control voltages
LED drivers (1)
Several LED drivers produced and tested during this summer beam tests
Dedicated ECAL version of LED driver (produced in IHEP)
LED drivers (2)
DS0026 became obsolete (still available from distributors)
PCB design and prototypes exist for:
pin-to-pin compatible EL7212, ICL7667
EL7104
SN75372
DC isolation of the triggering signals requires individual triggering for each LED driver.
PIN diode boards (1)
Dedicated ECAL version of PIN diode board (produced in IHEP)
PIN diode boards produced and tested during this summer beam tests
PIN diode boards (2)
Charge gain ~300
ENC ~5000 electrons
δ function response ~10 ns.
Dynamic range 12 bits
The same clipping line as for PMTs is used
Amplifiers are based on LMH6624 or EL5133
Planning (1)
Many changes during last months
ECAL installation should be finished on 31 of July
The whole planning is quite tense
Planning (2)
Production of bundles starting on 04/10/2004
special “long” room with shelves is ready
Cutting of bundles starting on 25/10/2004
need to prepare cutting tools
Should be finished in March
Installation of bundles : 15/04/2005 – 15/05/2005
Planning (3)
Detailed design of LDBs : 15/12/2004
meeting in Moscow or at CERN (Stas)
Production of LDBs starting on 15/01/2005
Installation of LDBs starting on 15/05/2005
Final connection of all components
01/06/2005 – 01/07/2005
Planning (4) Production of LED housings 01/11/2004 – 1/03/2005
should be delivered to CERN in March
LED drivers and PIN diode boards
purchase of components – ASAP
mass production 01/01/2005 – 01/03/2005
should be delivered to CERN in March
temporary readout system to check the work of LEDs and PMTs
??? Seems to be useful ???