der in the openings of the bask and over the plating base metalli- zation; removing the mask; re- moving the exposed plating base metallization; and reflowing the solder to form the solder bumps on the semiconductor device.

PAINT ~ COATING IIIBNO1/IUI U.S. Patent 6,162,776. Dee. 19, 2000 E.T. Marquis and R.E. Baldwin, assignors to Huntsman Petrochemical Corp., Austin, Texas

A composition useful as a paint remover comprising dialkyl car- bonate, hydrogen peroxide, and water, wherein 10 to 90% by weight dialkyl carbonate, 0.1 to 20% by weight hydrogen peroxide, and 0.1 to 30% water are present in the composition.

¢m.D cUmml lmS COMPOSIT ION U.S. Patent 6,162,779. Dec. 19, 2000 P. Miehaud and J-J. Martin, assignors to Elf Atochem, S.A., Paris

A nonaqueous composition for cleaning under cold conditions, consisting of, on a weight bases, 70-99% of at least one alkane or at least one cycloalkane end of 1-30% of at least one organic com- pound comprising at least oz~e ke- tone function.

CY4NI IM l - lmml | L E C l l t O P E A l l M G BAI l l l U.S. Patent 6,165,342. Dec. 26, 2000 W. Kuhn and W. Zilske, assignors to Degussa Hu

A cyanide-free electroplating bath for the deposition of gold and gold alloy coatings comprising 0.5 to

30 g/L of gold in the form of a complex of gold and sulfur-con- taining compound; 0 5 to 50 g/L of an alloy metal consisting of silver, copper, indium, cadmium, zinc, tin, bismuth, arsenic, antimony, or mixture thereof; 1 to 200 g/L of a free su l fur -conta in ing com- pound; and 0 to 200 g/L of a con- ductive and buffer salt.

I ItEMOVAL OF N E A W METALS U.S. Patent 6,165,427. Dec. 26, 2000 J.H. Vera et al., assignors to The Royal Institution for the Advancement of Learning (McGill University), Montreal

A method for the removal of solu- ble metaI species consisting of lead, cadmium, zinc, and mix- tures thereof comprising contact-

• - ° . . . . . . . . . . .

• Precious Metal Recovery • Heavy Metal Recovery • Metal recovery from Acidic Solutions • Deionization, Dealkalization, Softening

loft Excha~~c!e C:artridge~-,

• Inexpensive cartridges for quick determination of application feasibility.

For complete information on these and other products conlact us at:

S y b r o n C h e m i c a l s I n c . Purification Through Innovation Birmingham Rd., Birmingham, NJ 08011 Phone: 609-893-1100 f 800-678-0020 Fax: 609-894-8641 Web: www.sybronchemicals.com

Circle 078 on reader card or go to www.thru.to/webconn~--t

The only one-component, non-toxic powdered immer- sion nickel strippers on the market. They remove nickel from steel, copper, brass and zinc die-cast.

5 FORMULATIONS

• S-9" For removal of nickel from steel

= B-929: For copper, brass and zinc die-east base metals

• B-? PLUS: The all-pur- pose ' job shop' formula for multiple ~ubstrates

• B-913: For removal of nickel from aluminum with no etching and no hydrogen embrittlement

• B-9 Ni-Fe: For removal of nickel-iron alloy coatings

A M O R P H A . B TiN-NICKEL STRIPPER

A low voltage electrical strip- per which removes tin-nickel, tin-cobalt and other amor- phous coatings from electrolyt- ic nickel base coatings.

CUFIX-E COPPER STRIPPER

A low voltage electrical copper stripper ,or removal of copper from steel or aluminum withno attack. One-component pow- der. No ammonia, no cyanide, and no nitrates. Waste disposal problems eliminated. Plate out the copper end keep on strip- ping. This could be the last copper stripper bath you will ever have to buy.

For more information contact us at:

M E T A L X , I N C . 2600 Rob',/Martin Rd, • Lenoir, NC 2[$645

1-828-758-4997 • I-ax 828-758-5033 ° E-maih coifey@(:onninc.cnm

Circle 112 on reader card or go to www.thru,to/webconnect

106 Metal Finishing