Post on 19-Mar-2020
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Manufacturing Case Studies:Manufacturing Case Studies:
Copy Exactly (CE!) and the Copy Exactly (CE!) and the twotwo--year cycle at Intelyear cycle at Intel
Paolo A. GarginiPaolo A. GarginiDirector Technology StrategyDirector Technology Strategy
Intel FellowIntel Fellow
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AgendaAgenda
•• 22--year cycleyear cycle•• Copy ExactlyCopy Exactly•• ConclusionsConclusions
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With respect to the factor contributed by Device and Circuit Cleverness, however, the situation is different. We are approaching a limit that must slow the rate of progress
I see no reason to expect the rate of progressIn the use of smaller dimensions in complexCircuits to decrease in the near future.
Gordon Moore, IEDM 1975
The new slope might approximate a doubling Every two years…….
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…….but Cost of Equipment Continues to Raise.but Cost of Equipment Continues to Raise(ISMT Exposure Tool Cost Survey Results)(ISMT Exposure Tool Cost Survey Results)
Source: ISMT EUV CoO Analysis Update, 1st International EUVL Symposium, October 15th 2002Source: ISMT EUV CoO Analysis Update, 1st International EUVL Symposium, October 15th 2002
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Industry ChallengeIndustry Challenge
•• Introduction of new products into the Introduction of new products into the market place requires very costly market place requires very costly investments in research, development and investments in research, development and manufacturing. manufacturing.
•• How can an IC company optimize the above How can an IC company optimize the above phases and obtain maximum return on phases and obtain maximum return on investment in the shortest time?investment in the shortest time?
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Intel Semiconductor RoadmapIntel Semiconductor Roadmap
“Moore’s Law” is driving semiconductor technology“Moore’s Law” is driving semiconductor technology~ 30% reduction in transistor size with each new technology e~ 30% reduction in transistor size with each new technology every 2 yearsvery 2 years~ 2X more chips per wafer with each new process technology~ 2X more chips per wafer with each new process technology~ 2X improvement in the product price/performance ratio~ 2X improvement in the product price/performance ratio
15nm
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Intel’s Core Competencies Drive Intel’s Core Competencies Drive Processor PerformanceProcessor Performance
Silicon ProcessSilicon ProcessTechnologyTechnology 0.8µ0.8µ 0.6µ0.6µ 0.35µ0.35µ 0.25µ0.25µ 0.18µ0.18µ 0.13µ0.13µ
TransistorsTransistors(Millions)(Millions)
PentiumPentium®®
ProcessorProcessor
PentiumPentium®® IIIIProcessorProcessor
PentiumPentium®® IIIIIIProcessorProcessor
PentiumPentium®® 44ProcessorProcessor
ItaniumItanium®®
ProcessorProcessor
3.33.3
7.57.5
9.5 9.5 -- 2525
4242++
4040+ +
Inte
l Bra
nd
60MHz60MHz
2GHz+2GHz+
MadisonMadisonDeerfieldDeerfield
NorthwoodNorthwood
Process transitions enable:Process transitions enable:2x die per wafer, ½ transistor cost, 2x microprocessor speed2x die per wafer, ½ transistor cost, 2x microprocessor speed
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0.35µm0.35µm 0.25µm0.25µm 0.18µm0.18µm 0.13µm0.13µm
200mm200mm0.13µm0.13µm300mm300mm
Moderate Cost Increase from Moderate Cost Increase from Generation to Generation and Generation to Generation and ……300mm Rolls Cost Back……300mm Rolls Cost Back
Capital costCapital costper unit per unit
wafer areawafer area
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>60X Transistor Cost Drop from 350nm to 90nm Node (Source: Intel ‘03)
>60X Transistor Cost Drop from 350nm >60X Transistor Cost Drop from 350nm to 90nm Nodeto 90nm Node (Source: Intel ‘03)(Source: Intel ‘03)
Cost/Transistor Normalized to 130nm NodeCost/Transistor Normalized to 130nm NodeCost/Transistor Normalized to 130nm Node
20032001199919971995
0.1
1.0
10.0
100.0
350nm 250nm 180nm 130nm 90nm
Technology Node/Introduction Year
Nor
mal
ized
Cos
t/Tra
nsis
tor Cost per Total Trans
25% Savings/Year35% Savings/Year40% Savings/Year
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Transistor Manufacturing Costs Falling (Source: Sematech ‘02)
Transistor Manufacturing Costs FallingTransistor Manufacturing Costs Falling (Source: (Source: Sematech ‘02)Sematech ‘02)
Accelerated
- 32 % CAGR
Strategic
- 26 % CAGR
Historic
- 26 % CAGR
Wafer Size Blend
125/150mm –200mm
Wafer Size Blend
200mm – 300mm
Source: Goodall,Randall, et.al., “Long-Term Productivity Mechanisms of the Semiconductor Industry,” 9th International Symposium on Semiconductor Silicon 2002, sponsored by ECS, International Sematech
Source: Goodall,Randall, et.al., “Source: Goodall,Randall, et.al., “LongLong--Term Productivity Mechanisms of the Semiconductor Industry,Term Productivity Mechanisms of the Semiconductor Industry,”” 9th 9th International Symposium on Semiconductor Silicon 2002, sponsoredInternational Symposium on Semiconductor Silicon 2002, sponsored by ECS, International Sematechby ECS, International Sematech
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15 years of 15 years of Copy Exactly!
• Copy Exactly! Is a technology transfer methodology pioneered by Intel
• The method ensures consistent yield and quality at any Intel factory making the same products
• The result is highly predictable output from our factories
• Whether this methodology is suitable for other companies or other industries depends on many factors
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• Research Activities are de-centralized• Multiple sites, consortia, universities, etc
• Central Technology Development groups• Logic: Hillsboro, Oregon• Memory: Santa Clara, California• Packaging: Chandler, Arizona
• Copy Exactly! from Development into Manufacturing• Fastest and Highest Volume Manufacturing
Ramp
Intel Research, Development Intel Research, Development and Manufacturingand Manufacturing
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IrelandIrelandFab 14/24Fab 14/24
IsraelIsraelFab 8/18Fab 8/18
OregonOregonDev D1C/D1DDev D1C/D1D
Fab 15/20Fab 15/20CaliforniaCaliforniaDev D2Dev D2
ColoradoColoradoFab 23Fab 23
ArizonaArizonaFab12/22Fab12/22
New MexicoNew MexicoFab 11/11XFab 11/11X
Mass.Mass.Fab 17Fab 17
Costa RicaCosta RicaSan Jose A/TSan Jose A/T
A/T DevA/T Dev MalaysiaMalaysiaPenang A/TPenang A/TKulim A/TKulim A/T
ChinaChinaPudong A/TPudong A/T
PhilippinesPhilippinesManila A/TManila A/TCavite A/TCavite A/T
WashingtonWashingtonSystems Mfg.Systems Mfg.
Board Mfg.Board Mfg.
Kulim Board/Module Mfg.Kulim Board/Module Mfg.BrazilBrazil
SubSub--con Mfg.con Mfg.
ThailandThailandSubSub--con Mfg.con Mfg.
SubSub--con Mfg.con Mfg.
TaiwanTaiwanSubSub--con Mfg.con Mfg.SubSub--con Mfg.con Mfg.
SubSub--con Mfg.con Mfg.
Intel’s High Volume Manufacturing SitesIntel’s High Volume Manufacturing Sites
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Technology Focus: LogicTechnology Focus: LogicActual Forecast
Process Name P858 Px60 P1262 P1264 P1266 P1268 P1270
1st Production 1999 2001 2003 2005 2007 2009 2011
Lithography Node 180 130 90 65 45 32 22nm
Gate Length 130 70 50 30 20 15 10nm
Fab Development Research
Copy Exactly! Pathfinding
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Huge cumulative investments as Huge cumulative investments as volume manufacturing beginsvolume manufacturing begins
Year 1 65432 7 98
Research Development Manufacture
1x
10x
100x
1000x
Engineers
InternalBudget
Wafers/Wk
ExternalBudget
Copy Exactly!Yield EnhancementsYield Enhancements
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DevelopmentDevelopmentCE! FabCE! Fab2nd Fab2nd Fab3rd Fab3rd Fab
First Generation First Generation Copy Copy ExactlyExactly! Results! Results
MonthsMonths
Equi
vale
nt Y
ield
Equi
vale
nt Y
ield