Post on 03-Mar-2019
PAGE 1 CML – pcbs from just around the corner
2018
Portfolio
&
Capabilities
PAGE 2 CML – pcbs from just around the corner
CML
Technical Capabilities
PAGE 3 CML – pcbs from just around the corner
◉ Standard Technology
Technical Capability
PAGE 4 CML – pcbs from just around the corner
Capabilities Rigid
Layer Count • 1 - 12 layer (above 12 layer see HDI)
Finished Board Thickness • 0.4 - 3.2 mm (> 3.2 mm on request)
• Tolerance: +/-10%
• Core thickness min 0.075 mm for inner layer
Max. Production Panel Size • 520 mm x 620 mm
Max. PCB size • 450 mm x 600mm
Bow & Twist • 0.7%
Min. Line Width/ Line Space • 0.075mm
Min. Hole Size (Finished)
• Mechanical
• Laser
• 0.2mm
• 0.1 mm
Laminate
Main Brands:
Shengyi, Kjngboard, Ventec, ITEQ,
Doosan
• CEM-1
• CEM-3
• CTI ≥600
• FR-4
• Maximum Tg 170
• Anti CAF
• Halogen free
• BT epoxy
• PTFE Ceramic
• High frequency materials
• Aluminum substrate
• Copper substrate
Solder Mask Color
Main brands:
Tamura, Taiyo, OTC, Huntsman
• Green (glossy | semi-matte | matte)
• Blue
• Black
• White
• Red
Surface Finish
• HAL (leadfree)
• Immersion Nickel Gold
• Galvanic Nickel Gold
• Immersion Tin
• Immersion Silver
• OSP
• Peelable solder mask
• Gold Finger
• Carbon Ink Print
Profiling • Routing | Depth Routing Tolerance:
• Punching
• V-scoring | Jump V-scoring
Additional Technology
• HDI boards (micro via, blind via, buried via)
• Resin plugging of via holes, copper plugging of micro via
• Silver Through Hole
• Press-fit hole
PAGE 5 CML – pcbs from just around the corner
Base Material
Type Description Application
CEM 1 • Hard paper core and
epoxy resin / glass fiber
• Single -layer PCB
CEM 3
• Epoxy resin / non woven
glass
• epoxy resin / glass fiber
• Single-layer and double layer PCB
• Plated through holes
FR4
FR5
• Epoxy resin / glass fiber
• FR5 = FR4 with high Tg
• Double-layer and Multilayer PCB
Aluminum Substrate • PCB with Aluminum
Substrate
• Single layer PCB with improved heat
dissipation
Copper Substrate • PCB with Copper
Substrate
• Single -, Double and Multilayer PCB with
improved heat dissipation
Possible FR4
characteristics
Tg (°C):
130 / 150 / 170
Low CTE
Halogen free
CAF Resistent
CTI:
>100 … >600
Tg: Glass Transition Temperature
CTE: Coefficient of thermal expansion
CAF: Conductive Anodic Filament
CTI: Comparative Tracking Index
PAGE 6 CML – pcbs from just around the corner
Copper Thickness in accordance IPC-A600
Double Side (DS) and Multilayer (ML) outer layer
Single Side (SS) and Multilayer (ML) inner layer Hole copper thickness
We suggest specifying the nominal copper thickness + min. plating. The final thickness will be
the result optional to the plating thickness.
Copper Thickness
Weight (Oz)
µm
nominal Cu min.
IPC 4562 (raw
material) "base
copper"
Absolut copper
min. (less 10%
reduction)
Plus minimum
plating +20µm
(equivalent to IPC
class 1 and 2)
Plus minimum
plating +25µm
(equivalent IPC
class 3)
Maximum variable
processing
allowance
reduction
Minimum surface conductor
thickness after processing (DS and
ML outer layer) "final thickness"
equivalent to IPC
class 1 und 2
equivalent to IPC
class 3
1/8 6 5,10 µm 4,59 µm 24,59 µm 29,59 µm 1,50 µm 23,1 µm 28,1 µm
1/4 9 8,50 µm 7,65 µm 27,65 µm 32,65 µm 1,50 µm 26,2 µm 31,2 µm
3/8 12 12,00 µm 10,80 µm 30,80 µm 35,80 µm 1,50 µm 29,3 µm 34,3 µm
1/2 18 17,10 µm 15,39 µm 35,39 µm 40,39 µm 2,00 µm 33,4 µm 38,4 µm
1 35 34,30 µm 30,87 µm 50,87 µm 55,87 µm 3,00 µm 47,9 µm 52,9 µm
2 70 68,60 µm 61,74 µm 81,74 µm 86,74 µm 3,00 µm 78,7 µm 83,7 µm
3 105 102,90 µm 92,61 µm 112,61 µm 117,61 µm 4,00 µm 108,6 µm 113,6 µm
4 140 137,20 µm 123,48 µm 143,48 µm 148,48 µm 4,00 µm 139,5 µm 144,5 µm
Weight (Oz) µm
nominal Cu
according IPC
4562 (raw
material)
Absolut copper
min. (less 10%
reduction)
Maximum
variable
processing
allowance
reduction
Minimum final
finish after
processing (SS +
ML inner layer)
1/8 6 5,10 µm 4,59 µm 1,50 µm 3,1 µm
1/4 9 8,50 µm 7,65 µm 1,50 µm 6,2 µm
3/8 12 12,00 µm 10,80 µm 1,50 µm 9,3 µm
1/2 18 17,10 µm 15,39 µm 4,00 µm 11,4 µm
1 35 34,30 µm 30,87 µm 6,00 µm 24,9 µm
2 70 68,60 µm 61,74 µm 6,00 µm 55,7 µm
3 105 102,90 µm 92,61 µm 6,00 µm 86,6 µm
4 140 137,20 µm 123,48 µm 6,00 µm 117,5 µm
Class 1 Class 2 Class 3
copper -
average
20 µm
average
20 µm
average
25 µm
average
Thin areas
(minimum) min. 18 µm min. 18 µm min. 20 µm
PAGE 7 CML – pcbs from just around the corner
Copper Thickness
Copper thickness in PTH:
25µm (IPC-6012B Class 3)
20µm (IPC-6012B Class 2)
Inner layer: Base copper is nominal thickness, the min. thickness after processing is Base copper minus 10% minus 3µ
Outer layer: Final copper is the min. thickness after plating according to IPC – 6012 Class 2
Final
copper
Class 2
Final
copper
Class 3
Outer layer
Line width Line space
33,4µm 38,4µm 100µm 100µm
47,9µm 52,9µm 120µm 120µm
78,7µm 83,7µm 180µm 180µm
108,6µm 113,6µm 250µm 250µm
Base
Copper
Inner layer
Line width Line space
½ oz (18µm) 80µm 80µm
1oz (35µm) 100µm 100µm
2oz (70µm) 150µm 150µm
3oz (105µm) 200µm 200µm
PAGE 8 CML – pcbs from just around the corner
Drilling
A
B
D
K
H
I
C F
G
Aspect ratio (A:T)
1:8 if T<2mm
1:6.5 if T>2mm
with T=LP thickness
No. Description Specification
A Plated hole diameter • Diameter: 0.2 – 6.5mm Tolerance: +0.08/ -0.07mm
B Non plated hole diameter • Diameter: 0.2 – 6.5mm Tolerance: +/-0.05mm
CD Distance hole to hole • Tolerance: +/-0.08mm Tolerance second drill: +/-0.125mm
FH Drilled slot width • Width: 0.6mm min.
FG Plated slot size • Tolerance: +/-0.08mm (F) +/-0.1mm (G)
HI Non plated slot size • Tolerance: +(-0.05mm (H) +/-0.08 (I)
K Hole to circuitry • Tolerance: +/-0.1mm
PAGE 9 CML – pcbs from just around the corner
Routing/ Scoring
C
D A
L
H
G
B
F
E
I
J
K
No. Description Specification
A Routing bit • Diameter: min 0.8mm
• Standard routing path 2mm or more
B Distance edge to edge routing • Tolerance: +/-0.10mm
I Distance edge to edge scoring • Tolerance: +/-0.1mm
CD Distance hole to edge • Tolerance: +/-0.10mm
JK Distance hole to edge scoring • Tolerance: +/-0.15mm
EG Milled slot width • Width: 0.8mm min.
EF Plated slot size • Tolerance: +/-0.13mm
GH Non plated slot size • Tolerance: +/-0.10mm
L Edge to circuitry • Tolerance: +/-0.15mm
PAGE 10 CML – pcbs from just around the corner
Finish Surface
Finish Surface thickness Solderability
OSP No direct thickness measurement • 6 months
HAL / HAL LF 1-40µm • 12 months
Chem. Ni/Au Ni 3.5-6µm / Au 0.025-0.075µm • 12 months
Electrolytic Ni/Au Ni >3µm Flash gold 0.025-0.075µm
Hard gold 0.05-2µm • 12 months
Chem. Sn Min. 1µm • 9 months
Chem. Ag 0.15-0.5µm • 6 months
PAGE 11 CML – pcbs from just around the corner
Impact of finishing on assembly
HASL
(SnPb)
HASL
(lead free) ENIG OSP
Immersion
Ag
Immersion
Sn
Electrolytic
(hard) Au
RoHs
Compliant
No Yes Yes Yes Yes Yes Yes
Fabrication
costs
+ Standard ++ - + + +++
Shelf life
12 month 12 month 12 month 6 month 6 month 9 month 12 month
Assembly
Cycles
Multiple Multiple Multiple Multiple Multiple Multiple No soldering
Rework
Yes Yes No Yes No Yes No
Co-
Planarity
Poor Poor Excellent Excellent Excellent Excellent Excellent
Solder
Joint
Integrity
Excellent Good Good Good Excellent Good No soldering
Final
surface
finishing
Yes Yes Yes No No No Yes
Low
resistance/
high speed
No No No N/A Yes No No
PAGE 12 CML – pcbs from just around the corner
Solder mask
A
B
No. Description Standard Special request
A Solder mask bridge • 100µm • On request
B Solder mask opening • 100µm (annular) • 50µm (annular)
C Solder mask offset • 100µm • 50µm
Based on green solder mask and surface HAL LF. In case of other solder mask colors / surfaces , the values could
be different.
C
PAGE 13 CML – pcbs from just around the corner
◉ IPC4761 III a:
Covered with UV cured solder mask after surface finishing.
Advantages: surface finishing in the vias; no chemical residue in the vias
Disadvantages: higher risk of residue on surface (depends on distance via to pad)
◉ IPC4761IV:
Plugged one side with solder mask wet in wet (filling rate min. 70%) and covered
with solder mask both sides.
Advantages: common process; no price impact
Disadvantages: restricted hole diameter (ideal 0.4mm)
◉ IPC4761 V/ VI:
Plugged with resin (filling rate 100%). Type VI covered with solder mask/ V without.
Advantages: no restricted hole diameter
Disadvantages: cost impact
◉ IPC4761 VII:
Plugged with resin and capped with copper
Advantages: no restricted hole diameter; via in pad application possible
Disadvantages: cost impact
Via plugging
CML:
PAGE 14 CML – pcbs from just around the corner
Process Flow Multilayer
Clean the core Laminate with photoresist Expose the photoresist Develop the photoresist
Laminate the panel
Cut the edges of the panel
X-Ray drilling of location holes
Strip the photoresist
Punch the inner layer
Oxidize the inner layer
Etch the copper
Drilling
Laser drilling
Clean the holes (desmear)
Chemical Cu + Panel Plating
Clean the outer layer
Laminate, expose and
develop the photoresist
Clean the outer layer
Print the Solder mask, dry, expose, develop
and cure it
Surface finishing, routing, cleaning, packaging
Strip the photoresist
Etch the copper and strip the tin
Pattern Plating (Cu + Sn)
PAGE 15 CML – pcbs from just around the corner
Process Flow Multilayer
Incoming
Inner D/F
Inner etching
Stripping D/F
Inner AOI
Oxide
Lamination Drillimg
QC checking
PTH
Panel Plating
QC checking
D/F
Quality Audit Pattern Plating
Stripping D/F
Etching
Tin-Lead stripping
QC checking
Redrilling
Solder mask Surface
Outline
E-Test
Entek/ Imm. Tin
FQC
Packing
Outgoing
PAGE 16 CML – pcbs from just around the corner
List of common abbreviations
A/C Automatic Controlled G/F Gold Finger Plating PPE Pre-production Engineering
AOI Automatic Optical Inspection HAL Hot Air Leveling Press Pressing
A/W Art Work IDF Inner Dry Film PROD Production Department
BC Board Cut IE Inner Etching PSM Peelable Solder mask
BO Black Oxidation IPA In-process Audit PTH Plating Trough Holes
Che.Lab Chemistry Laboratory IPQA In-process Quality Audit PUN Punching
CLE Clearing IPQC In-process Quality Check Purch Purchase Department
C/M Component Mark IQC Incoming Quality Control QA Quality Assurance
C/NK Carbon Ink Printing M/C Manual Controlled QC Quality Control
DEBUR Deburring ME Manufacturing Engineering ROUT Routing
DEAM Desmear MKT Market Department SLOT Key Slotting
D/F Dry Film MRB Material Review Board S/M Solder Mask
DFS Dry Film Stripping P&A Personal & Admin Department TLS Tin Lead Stripping
DRI Drilling PACK Packing V-CUT V-Cutting
EM Equipment Maintenance PHY Physical laboratory W/F Wet Film Solder Mask
ETCH Etching PLA Pattern Plate 2DRI 2nd
Drill
E-T E-Test PLUG Solder mask Plug Hole
F/E-T Final E-Test PMC Production Material Control
FQA Final Quality Audit PP Panel Plate
FQC Final Quality Check PPC Production Plan Control
PAGE 17 CML – pcbs from just around the corner
pcbs from just around the corner