CALL FOR PAPERS DCS 17–21 APRIL...

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http://www.spie.org/Si110

17–21 APRIL 2016Baltimore Convention Center

Baltimore, Maryland, USA

DCSFORMERLY SPIE DSS

CALL FOR PAPERS

Submit Abstracts by 5 October 2015

Thermosense: Thermal Infrared Applications XXXVIII (SI110)Conference Chair: Joseph N. Zalameda, NASA Langley Research Ctr. (USA)

Conference Co-Chairs: Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

Program Committee: Andrea Acosta, Colbert Infrared Services (USA); Nicolas Avdelidis, National Technical Univ. of Athens (Greece); Jeff R. Brown, Embry-Riddle Aeronautical Univ. (USA); Douglas Burleigh, La Jolla Cove Consulting (USA); Fred P. Colbert, Colbert Infrared Services (USA); K. Elliott Cramer, NASA Langley Research Ctr. (USA); Jaap de Vries, FM Global (USA); Ralph B. Dinwiddie, Oak Ridge National Lab. (USA); Sheng-Jen (Tony) Hsieh, Texas A&M Univ. (USA); Herbert Kaplan, Honeyhill Technical Co. (USA); Timo T. Kauppinen, VTT Technical Research Ctr. of Finland (Finland); Dennis H. LeMieux, Siemens Power Generation, Inc. (USA); Monica Lopez Saenz, IRCAM GmbH (Germany); Gregory B. McIntosh, Teasdale Consultants Ltd. (Canada); Xavier P. V. Maldague, Univ. Laval (Canada); Junko Morikawa, Tokyo Institute of Technology (Japan); Gary L. Orlove, FLIR Systems, Inc. (USA); Beata Oswald-Tranta, Montan Univ. Leoben (Austria); G. Raymond Peacock, Temperatures.com, Inc. (USA); Piotr Pregowski, Pregowski Infrared Services (Poland); Ralph A. Rotolante, Vicon Enterprises Inc. (USA); Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina); Morteza Safai, The Boeing Co. (USA); Takahide Sakagami, Kobe Univ. (Japan); Steven M. Shepard, Thermal Wave Imaging, Inc. (USA); Sami Siikanen, VTT Technical Research Ctr. of Finland (Finland); Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (USA); Vladimir P. Vavilov, Tomsk Polytechnic Univ. (Russian Federation)

Steering Committee Emeritus Members: Robert Madding, RPM Energy Associates (USA); John R. Snell, Snell Infrared (USA).

Thermosense In Memoriam Honorary Committee Members: Lee R. Allen, Allen Applied Infrared Technology (USA); Ermanno G. Grinzato, Consiglio Nazionale delle Ricerche (Italy); Sven-Åke Ljingberg, Univ. of Gäyle (Sweden).

BEST PAPER AWARDSTh e Confe rence Cha i r s a n d Program Committee of the oldest and largest technical conference focused on thermal infrared appli-cations are pleased to announce the addition of a Best Paper Award and Best Student Paper Award. Please see the Best Paper Awards page spie.org/siawards for complete award eligibility requirements.

Thermosense is the oldest and largest international technical conference focused on scientific, industrial and general uses of infrared imaging, in-frared temperature measurements, and image analysis. Its regular printed proceedings are found in most scientific and engineering libraries, providing an unequaled depth and breadth of technical information and reference data. Further information regarding Thermosense can be found at: www.thermosense.org .

The Thermosense conference promotes worldwide exchange of information about research, uses and applications of infrared (IR) imaging technology. This includes infrared thermography and thermal infrared sensing (MWIR/LWIR), as well as NIR, SWIR imaging and measuring instruments. Thermosense encompasses technical papers, work-shops and short-courses. Over the past 38 years, these activities have included topics from the fundamentals of infra-red imaging and calibration to virtually all infrared research and applications. Special emphasis has been on problem solving and turning new developments into standard practices. This year, we would like to have special sessions on (1) monitoring of additive manufac-turing (AM) processes; and (2) signal processing and nondestructive testing.

Thermal/infrared related papers are solicited in the areas listed below, and are also welcome in other areas.

AEROSPACE APPLICATIONS• aircraft NDT• process monitoring• corrosion/FOD/fatigue• aging aircraft• spacecraft and satellites.

MANUFACTURING AND PROCESSING INDUSTRIES• composites industry• additive manufacturing• glass and ceramics• metals processing• petrochemical• plastics• pulp and paper• semiconductors and microelectronics• quality control and predictive

maintenance applications.

MATERIALS EVALUATION AND NDT• fatigue analysis• sonic IR• thermal properties of materials• thermal stress analysis (TSA).

MEDICAL• health screening and diagnostics• veterinary applications.

NDT (NONDESTRUCTIVE TESTING)• composite materials and structures

(e.g. wind turbine, aircraft)• subsurface flaws• metallic structures• underground anomalies• electronic components• thermal combined with other

inspections (ultrasound, X-ray,terahertz, visual, etc.).

POWER GENERATION AND DISTRIBUTION• nuclear, wind, and solar power plants• field measurement issues• power plant heat-rate efficiency• electrical and mechanical P/PM.

RESEARCH AND DEVELOPMENT• Terahertz imaging (THz)• multi-spectral/high-spectral imaging• enhanced spatial resolution• enhanced time resolution• image interpretation• microscopy• thermal modeling, CFD and FEA.

REMOTE SENSING AND SECURITY• disease screening• search and rescue (fire, snow, etc.)• law enforcement• UAV Drones• Internet of Things (IoT)• maritime guidance.

In case of multiple submissions, the Pro-gram Committee reserves the right to allow only one oral presentation per author group while transferring the others to the poster session. During the Symposium, authors are expected to attend their respective sessions to enable interaction with the audience.

Selected papers will be recommended for publication in related SPIE journals such as Optical Engineering and Journal of Electronic Imaging. In addition, one paper will be selected for a Best Paper award and student-authored papers will be eligible for a Best Student Paper award.

The Best Paper award sponsor is FLIR.

The Best Student Paper award sponsor is IRCameras.

In addition, limited funds are available to sup-port student attendance at the conference.

EXHIBITOR VENDOR SESSIONS What’s New in Infrared Imag-ing Hardware and Software? (Presentations by equipment and service vendors)

This session is now in its 12th year and has become very popular. This venue provides an early opportunity for exhib-itors to showcase their latest technology and products to the Thermosense and IR community, prior to the opening of the exhibits. This also enables the tech-nical conference attendees to better prioritize their activities when visiting the exhibits. It is a casual meeting with ample time for questions and answers. Your company must be an exhibitor at Defense + Commercial Sensing Expo 2016 to be part of this event.

Moderators: Herbert Kaplan, Honeyhill Technical Company; Andres E. Rozlosnik, SI Termografía Infrarroja

If you are interested in participating, or have more questions, please contact:

Herbert Kaplan, hkaplan@earthlink.net or Andres Rozlosnik, aer@termografia.com

AUTOMOTIVE INDUSTRY• predictive maintenance - electrical• predictive maintenance - mechanical• automotive NDT• process monitoring - automation• testing, measurement QA, R&R and

validation• driver vision enhancement.

BUILDING APPLICATIONS• energy conservation and energy

efficiency• construction quality control• roof moisture surveying• weatherization.

CALIBRATION• standards• sources• instruments traceability.

DETECTION OF GAS AND OTHER LEAKS• pipelines, oil fields, offshore platforms,

refineries• gas pumping stations, gasoline

stations• UXO: unexploded ordinance.

ENVIRONMENTAL AND AGRICULTURAL MONITORING• agriculture and water conservation• fish and wildlife migration• geology• pollution and storm water monitoring• seawater sensing.

FIBER OPTICS FOR INFRARED• Detection of hazardous chemicals• Remote sensing in high temperature

and corrosive environments• Medical applications.

FIRE ANALYSIS AND DETECTION• Wildfire• Home• Building and Industrial.

FOOD PROCESSING AND HANDLING• quality control monitoring• temperatures of animals at slaughter• foreign object detection and

characterization.

INFRASTRUCTURE• transportation – roads, bridges,

airports, harbors, reservoirs, and dams• energy – nuclear, wind, solar, fossil

fuels power plants.

IR IMAGE FUSION APPLICATIONS• biological and medical• field security• process monitoring• hyperspectral• structural analysis.

http://www.spie.org/Si110

SPIE DSS is now SPIE DCSSPIE Defense + Commercial Sensing (DCS), the world’s leading technical conferences and exhibition on sensors, optics, imaging, lasers, and related areas for defense, security, industry, and the environment. The new SPIE DCS name reflects the broad array of uses of these technologies and an expanded focus on commercial applications.

DEFENSE+COMMERCIAL SENSING EXPO AND CONFERENCE

17–21 APRIL 2016Baltimore Convention Center

Baltimore, Maryland, USA

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AbstractDue Date5 October

2015

DCSFORMERLY SPIE DSS

CALL FOR PAPERS

By submitting an abstract, I agree to the following conditions:

AN AUTHOR OR COAUTHOR (INCLUDING KEYNOTE, INVITED, ORAL, AND POSTER PRESENTERS) WILL:• Register at the reduced author registration rate (current SPIE Members

receive an additional discount on the registration fee).• Attend the meeting.• Make the presentation as scheduled in the program.• Submit a manuscript (6 pages minimum) for publication in the Proceedings

of SPIE in the SPIE Digital Library.• Obtain funding for registration fees, travel, and accommodations, indepen-

dent of SPIE, through their sponsoring organizations.• Ensure that all clearances, including government and company clearance,

have been obtained to present and publish. If you are a DoD contractor in the USA, allow at least 60 days for clearance.

Submit an abstract and summary online at http://www.spie.org/Si110• Abstracts should contain enough detail to clearly convey the approach and

the results of the research. Accepted abstracts will be published and made available at the meeting. Please submit a 250-word abstract for review.

• Please also submit a 100-word text summary suitable for early release. If accepted, this summary text will be published prior to the meeting in the online or printed programs promoting the conference.

• Only original material should be submitted.• Abstracts should contain enough detail to clearly convey the approach and

the results of the research.• Commercial papers, papers with no new research/development content, and

papers where supporting data or a technical description cannot be given for proprietary reasons will not be accepted for presentation in this conference.

• Please do not submit the same, or similar, abstracts to multiple conferences.

REVIEW, NOTIFICATION, AND PROGRAM PLACEMENT INFORMATION• To ensure a high-quality conference, all submissions will be assessed by the

Conference Chair/Editor for technical merit and suitability of content.• Conference Chair/Editors reserve the right to reject for presentation any

paper that does not meet content or presentation expectations. • The contact author will receive notification of acceptance and presentation

details by e-mail no later than 15 December 2015.• Final placement in an oral or poster session is subject to the Chairs’ discretion.

PROCEEDINGS OF SPIE IN THE SPIE DIGITAL LIBRARY INFORMATION• Manuscript instructions are available from the “For Authors/Presenters”

link on the conference website. • Conference Chair/Editors may require manuscript revision before approving

publication and reserve the right to reject for publication any paper that does not meet acceptable standards for a scientific publication. Conference Chair/Editors’ decisions on whether to allow publication of a manuscript is final.

• Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license.

• Only papers presented at the conference and received according to publica-tion guidelines and timelines will be published in the conference Proceedings of SPIE in the SPIE Digital Library.

• Published papers are indexed in leading scientific databases including Astrophysical Data System (ADS), Chemical Abstracts (relevant content), Compendex, CrossRef, Current Contents, DeepDyve, Google Scholar, Inspec, Portico, Scopus, SPIN, and Web of Science Conference Proceedings Citation Index, and are searchable in the SPIE Digital Library. Full manuscripts are available to SPIE Digital Library subscribers worldwide.