Post on 16-Oct-2021
BTS6201UWideband high linearity pre-driver amplifierRev. 4 — 3 February 2021 Product data sheet
1 General description
The BTS6201U is a wideband, high linearity, pre-driver amplifier for 5G massiveMIMO infrastructure applications, with fast on-off switching to support TDD systems.The amplifier is designed to operate between 2.3 GHz and 4.2 GHz. It is housed in a3 mm x 3 mm x 0.85 mm 16-terminal HVQFN package. The amplifier is ESD protectedon all terminals.
2 Features and benefits
• High saturated output power Po(sat) = 28 dBm• High power-gain Gp = 30.5 dB• High linearity performance ACLR = -46 dBc• Unconditionally stable• Programmable bias current (via external resistor)• Fast switching to support TDD systems• 5 V single supply, quiescent current 78 mA• Small 16-terminal leadless package 3 mm x 3 mm x 0.85 mm• ESD protection on all terminals• Moisture sensitivity level 1
3 Applications
• Wireless infrastructure 5G NR mMIMO• High linearity pre-driver• TDD systems
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
4 Quick reference data
f = 3.5 GHz; VCC = 5 V; Tcase = 25 °C; input and output 50 Ω; RSET = 1.2 kΩ; unless otherwise specified. Values under Min/Max in boldface font are guaranteed by test; Values in lightface font are based on simulation or characterization.
Symbol Parameter Conditions Min Typ Max Unit
ON state, Po = 15 dBm - 95 115 mA
ON state, quiescent - 78 90 mA
ICC supply current
OFF state - 1 1.5 mA
ON state 29.5 30.5 31.5 dBGp power gain
OFF state - -48 - dB
Po(sat) saturated output power 27.5 28 - dBm
ACLR adjacent channelleakage ratio
CP-OFDM with 100 MHz channel BW,QPSK modulation, and 60 kHz SCS, fully allocated,Po = 15 dBm
- -46 -44.5 dBc
Table 1. Quick reference data
5 Ordering information
PackageType number Orderable partnumber Name Description Version
BTS6201U BTS6201UJ HVQFN16 3 mm x 3 mm x 0.85 mm, 16 terminals no leads SOT758-1
Table 2. Ordering information
6 Marking
Type number Marking code
BTS6201U 21U
Table 3. Marking
7 Functional diagram
aaa-036467
DC BIAS
AMP AMP
16 15 Iset
13 VCC2
11 RFout
10 RFout
Ven
4VCC1
2RFin
3, 5, 7, 8, 14n.c.
1, 6, 9, 12, 17GND
Figure 1. Functional diagram
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20212 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
8 Pinning information
8.1 Pinning
aaa-036468
17GND
Transparent top view
VCC1 GND
n.c. RFout
RFin RFout
GND GND
n.c.
GN
D
n.c.
n.c.
V en
I set
n.c.
V CC
2
4 9
3 10
2 11
1 12
5 6 7 8
16 15 14 13
terminal 1index area
Figure 2. Pin configuration
8.2 Pin description
Symbol Pin Description
GND 1, 6, 9, 12 and 17 PCB ground
RFin 2 RF input
n.c. [1] 3 PCB ground, or connect to RFin
n.c. [1] 5, 7, 8 and 14 PCB ground
RFout 10 and 11 RF output; connect both to the same track
VCC1 4 supply voltage
VCC2 13 supply voltage
Iset 15 current set; connect to external resistor
Ven 16 voltage enable; LOW = OFF state; HIGH = ON state
Table 4. Pin description
[1] n.c. means that pin is not connected inside package
9 Functional description
Ven voltage applied at pin Ven[1] State Condition
LOW 0 < V (Ven) < VIL(max) OFF bias active, amplifier not active
HIGH VIH(min) < V (Ven) < VI(max) ON bias active, amplifier active
Table 5. Shutdown control
[1] Ven can only be made HIGH, after supply voltage has been applied to pin VCC1
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20213 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
10 Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage -0.3 6 V
Ven enable voltage -0.3 4 V
VI(set) current set voltage -0.3 4 V
Pi(RF)CW continuous waveform RF input power ON state, OFF state - 10 dBm
Tstg storage temperature -40 150 °C
Tj junction temperature - 150 °C
P power dissipation Tcase ≤ 105 °C [1] - 900 mW
Human Body Model (HBM) According toANSI/ESDA/JEDEC standard JS-001
- +/-2 kVVESD electrostatic discharge voltage
Charged Device Model (CDM); According toANSI/ESDA/JEDEC standard JS-002
- +/-1 kV
Table 6. Limiting values
[1] Case is ground solder pad.
11 Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage [1] 4.75 5 5.25 V
VIL LOW-level input voltage 0 - 0.6 V
VIH HIGH-level input voltage 1.2 - 3.6 V
VI(max) maximum input voltage - - 3.6 V
Z0 characteristic impedance - 50 - Ω
Tcase case temperature -40 - 105 °C
Table 7. Recommended operating conditions
[1] VCC must be applied to pin VCC1 before, or at the same time as applying VCC to pin VCC2
12 Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-case) junction to case thermal resistance [1] [2] 50 K/W
Table 8. Thermal characteristics
[1] Case is ground solder pad.[2] Thermal resistance determined with device mounted, and device bottom case kept at constant temperature.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20214 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
13 Characteristics
f = 3.5 GHz; VCC = 5 V; Tcase = 25 °C; input and output 50 Ω; Rbias = 1.2 kΩ; unless otherwise specified. Values under Min/Max in boldface font are guaranteed by test; Values in lightface font are based on simulation or characterization.
Symbol Parameter Conditions Min Typ Max Unit
ON state, Po = 15 dBm - 95 115 mA
ON state, quiescent - 78 90 mA
ICC supply current
OFF state - 1 1.5 mA
ON state 29.5 30.5 31.5 dBGp power gain
OFF state - -48 - dB
2.3 GHz to 2.7 GHz - 0.7 - dBGflat gain flatness
3.3 GHz to 3.8 GHz - 1 - dB
2.3 GHz to 2.7 GHz - 0.3 - nstd(grp) group delaytime 3.3 GHz to 3.8 GHz - 0.3 - ns
Po(sat) saturatedoutput power
3 dB gain compression [1] 27.5 28 - dBm
PL(1dB) output powerat1 dB gaincompression
26.5 27 - dBm
IP3o output third-order interceptpoint
2-tone; tone spacing = 100 MHz; Po = 15 dBm 34 35 - dBm
RLi input return loss - 17 - dB
RLo output returnloss
- 12 - dB
ISLr reverseisolation
- 45 - dB
NF noise figure [1] - 3.4 3.5 dB
ts(pon) power-onsettling time
Ven from LOW to HIGH to output power reaching 90 % offinal power
- 0.18 - µs
ts(poff) power-offsettling time
Ven from HIGH to LOW to output power reaching 10 %below initial power
- 0.1 - µs
K Rollett stabilityfactor
1 MHz to 15 GHz 2 - -
ACLR adjacentchannelleakage ratio
CP-OFDM with 100 MHz channel BW, QPSK modulation,and 60 kHz SCS, fully allocated, Po = 15 dBm
- -46 -44.5 dBc
Table 9. Characteristics
[1] Connector and Printed-Circuit Board (PCB) losses have been de-embedded.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20215 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
14 Application information
aaa-036474
BTS6201
V CC
2
GNDGND
supply
supply
enableC22
CoutCin
Rset
C21
C11C12
RF output50 Ω
RF input50 Ω
RFin
n.c.
VCC1
RFout
RFout
GND
12
11
10
9
1
2
3
4
17
16 15 14 13
5 6 7 8
n.c.
GN
D
n.c.
n.c.
GND
V en
I set
n.c.
See Table 10 for a list of components.Figure 3. Schematic of application board
See figure 16 for schematics.
Component Description Value Remarks
Cin capacitor 18 pF in a 50 Ω PCB track
Cout capacitor 18 pF in a 50 Ω PCB track
C11, and C21 capacitor 10 nF
C12, and C22 [1] capacitor 1 μF
RSET resistor 1.2 KΩ default
Table 10. List of components
[1] placement of C12, and C22 is optional
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20216 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
15 Graphics
aaa-040340
1.5 2 2.5 3 3.5 4 4.5 5 5.525
27
29
31
33
35
f (GHz)
GpGp(dB)(dB)
(1)(1)(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 4. Gp versus frequency overtemperature
aaa-040341
1.5 2 2.5 3 3.5 4 4.5 5 5.5-56
-54
-52
-50
-48
-46
-44
f (GHz)
ISLISL(dB)(dB) (1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 5. ISLr S12 versus frequency overtemperature
aaa-040342
1.5 2 2.5 3 3.5 4 4.5 5 5.5-20
-18
-16
-14
-12
f (GHz)
RLiRLi(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 6. RLi S11 versus frequency overtemperature
aaa-040343
1.5 2 2.5 3 3.5 4 4.5 5 5.5-35
-30
-25
-20
-15
-10
f (GHz)
RLoRLo(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 7. RLo S22 versus frequency overtemperature
Table 11.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20217 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
aaa-040344
5 10 15 20 25 3020
24
28
32
36
Po (dBm)
GpGp(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 8. Gp versus Po at 2.6 GHz overtemperature
aaa-040345
5 10 15 20 25 3020
24
28
32
36
Po (dBm)
GpGp(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 9. Gp versus Po at 3.5 GHz overtemperature
aaa-040510
5 10 15 20 25 3022
24
26
28
30
32
Po (dBm)
GpGp(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 10. Gp versus Po at 4.2 GHz overtemperature
aaa-040511
10 12 14 16 18 2075
85
95
105
115
125
135
Po (dBm)
ICCICC(mA)(mA)
(1)(1)
(2)(2)
(3)(3)
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 11. ICC versus Po at 3.5 GHz overtemperature
Table 11. ...continued
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20218 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
aaa-040513
10 11 12 13 14 15 16 17 1833
33.5
34
34.5
35
35.5
36
Po (dBm)
IP3oIP3o(dBm)(dBm)
(1)(1)(2)(2)
(3)(3)
tone spacing = 100 MHz; VCC = 5 V(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 12. IP3o versus P0 at 3.5 GHz overtemperature
aaa-040514
2 2.5 3 3.5 4 4.5 530
31
32
33
34
35
36
f (GHz)
IP3oIP3o(dBm)(dBm)
(1)(1) (2)(2) (3)(3)
tone spacing = 100 MHz; Po = 15 dBm;VCC = 5 V
(1) Tcase = -40 °C(2) Tcase = 25 °C(3) Tcase = 105 °C
Figure 13. IP3o versus frequency overtemperature
Table 11. ...continued
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 20219 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
16 Package outline
terminal 1 index area
0.5 1
A1 Eh b UNIT y e
0.2
c
REFERENCES OUTLINE VERSION
EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1 2.9
Dh
1.75 1.45
y1
3.1 2.9
1.75 1.45
e1
1.5
e2
1.5 0.30 0.18
0.05 0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT758-1 MO-220 - - - - - -
0.5 0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT758-1 HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm
A(1) max.
A A1
c
detail X
y y1 C e
L
Eh
Dh
e
e1
b
5 8
16 13
12
9 4
1
X
D
E
C
B A
e2
02-03-25 02-10-21
terminal 1 index area
1/2 e
1/2 e
A C C
B v M
w M
E (1)
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D (1)
Figure 14. Package outline SOT758-1 (HVQFN16)
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 202110 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
16.1 Footprint and solder information
SOT758-1Footprint information for reflow soldering of HVQFN16 package
Dimensions in mm
Ax Ay Bx By D SLx SLy SPx SPy Gx Gy Hx Hy
4.00 4.00 2.20 2.20
P
0.50 0.24
C
0.90 1.50 1.50 0.30
SPy tot
0.90
SPx tot
0.90 0.30 3.30 3.30 4.25 4.25
nSPx nSPy
2 2
sot758-1_fr
occupied area
solder land plus solder paste
solder land
solder paste deposit
Issue date 12-03-0712-03-08
AyBySLy
Ax
Bx
SLx
Gx
Hx
D
GyHy
(0.105)
SPx
C
P 0.025
0.025
SPy
SPx tot
SPy
tot
nSPx
nSPy
Figure 15. Footprint information
17 Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observeprecautions for handling electrostatic sensitive devices.Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5,JESD625-A or equivalent standards.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 202111 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
18 Abbreviations
Acronym Description
5G NR 5th generation new radio
ACLR adjacent channel leakage ratio
CP-OFDM cyclic prefix orthogonal frequency division multiplexing
ESD electrostatic discharge
mMIMO massive multiple-input multiple-output
PA power amplifier
RF radio frequency
TDD time-division duplexing
Table 12. Abbreviations
19 Revision history
Document ID Release date Data sheet status Changenotice
Supersedes
BTS6201UV.4 20210203 Product data sheet - BTS6201UV.3
modification • changed security status to Public
BTS6201UV.3 20210129 Product data sheet - BTS6201UV.2.1
modification • changed Min, Typ, and Max values on some parameters• added remark: Values under Min/Max in boldface font are guaranteed by test; Values in lightface
font are based on simulation or characterization. to the description at the tables on Quickreference, and characteristics
• removed VRFin, and VRFout from Limiting values table• added graphics• changed remark, and footnote for C12, and C22 in list of components table• changed status to Product data sheet
BTS6201UV.2.1 20201012 Preliminary data sheet - BTS6201UV.2
modification • added marking
BTS6201UV.2 20201002 Preliminary data sheet - BTS6201UV.1.1
modification • changed status to Preliminary• added footprint and solder information
BTS6201UV.1.1 20200716 Objective data sheet - BTS6201UV.1
modification • updated some typical values to the latest validation results
BTS6201UV.1 20200401 Objective data sheet - -
Table 13. Revision history
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 202112 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
20 Legal information
20.1 Data sheet status
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for productdevelopment.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
20.2 DefinitionsDraft — A draft status on a document indicates that the content is stillunder internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included in a draft version of a document and shall have noliability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local NXPSemiconductors sales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed betweenNXP Semiconductors and its customer, unless NXP Semiconductors andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the NXP Semiconductors productis deemed to offer functions and qualities beyond those described in theProduct data sheet.
20.3 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does notgive any representations or warranties, expressed or implied, as to theaccuracy or completeness of such information and shall have no liabilityfor the consequences of use of such information. NXP Semiconductorstakes no responsibility for the content in this document if provided by aninformation source outside of NXP Semiconductors. In no event shall NXPSemiconductors be liable for any indirect, incidental, punitive, special orconsequential damages (including - without limitation - lost profits, lostsavings, business interruption, costs related to the removal or replacementof any products or rework charges) whether or not such damages are basedon tort (including negligence), warranty, breach of contract or any otherlegal theory. Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate and cumulativeliability towards customer for the products described herein shall be limitedin accordance with the Terms and conditions of commercial sale of NXPSemiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied priorto the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makesno representation or warranty that such applications will be suitablefor the specified use without further testing or modification. Customersare responsible for the design and operation of their applications andproducts using NXP Semiconductors products, and NXP Semiconductorsaccepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customer’s applicationsand products planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriatedesign and operating safeguards to minimize the risks associated withtheir applications and products. NXP Semiconductors does not accept anyliability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, orthe application or use by customer’s third party customer(s). Customer isresponsible for doing all necessary testing for the customer’s applicationsand products using NXP Semiconductors products in order to avoid adefault of the applications and the products or of the application or use bycustomer’s third party customer(s). NXP does not accept any liability in thisrespect.
Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductorsproducts are sold subject to the general terms and conditions of commercialsale, as published at http://www.nxp.com/profile/terms, unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. NXP Semiconductors hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of NXP Semiconductors products by customer.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 202113 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
No offer to sell or license — Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance orthe grant, conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expresslystates that this specific NXP Semiconductors product is automotive qualified,the product is not suitable for automotive use. It is neither qualified nortested in accordance with automotive testing or application requirements.NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Inthe event that customer uses the product for design-in and use in automotiveapplications to automotive specifications and standards, customer (a) shalluse the product without NXP Semiconductors’ warranty of the product forsuch automotive applications, use and specifications, and (b) whenevercustomer uses the product for automotive applications beyond NXPSemiconductors’ specifications such use shall be solely at customer’s ownrisk, and (c) customer fully indemnifies NXP Semiconductors for any liability,damages or failed product claims resulting from customer design and useof the product for automotive applications beyond NXP Semiconductors’standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.
Security — Customer understands that all NXP products may be subjectto unidentified or documented vulnerabilities. Customer is responsiblefor the design and operation of its applications and products throughouttheir lifecycles to reduce the effect of these vulnerabilities on customer’sapplications and products. Customer’s responsibility also extends to otheropen and/or proprietary technologies supported by NXP products for usein customer’s applications. NXP accepts no liability for any vulnerability.Customer should regularly check security updates from NXP and follow upappropriately. Customer shall select products with security features that bestmeet rules, regulations, and standards of the intended application and makethe ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirementsconcerning its products, regardless of any information or support that maybe provided by NXP. NXP has a Product Security Incident Response Team(PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation,reporting, and solution release to security vulnerabilities of NXP products.
20.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
BTS6201U All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 4 — 3 February 202114 / 15
NXP Semiconductors BTS6201UWideband high linearity pre-driver amplifier
Contents1 General description ............................................ 12 Features and benefits .........................................13 Applications .........................................................14 Quick reference data .......................................... 25 Ordering information .......................................... 26 Marking .................................................................27 Functional diagram ............................................. 28 Pinning information ............................................ 38.1 Pinning ...............................................................38.2 Pin description ................................................... 39 Functional description ........................................310 Limiting values ....................................................411 Recommended operating conditions ................ 412 Thermal characteristics ......................................413 Characteristics .................................................... 514 Application information ......................................615 Graphics ...............................................................716 Package outline .................................................1016.1 Footprint and solder information ......................1117 Handling information ........................................ 1118 Abbreviations .................................................... 1219 Revision history ................................................ 1220 Legal information ..............................................13
Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.
© NXP B.V. 2021. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 February 2021Document number: