Post on 10-Apr-2019
Brief Introduction of Sigurd Brief Introduction of Sigurd
IC package Assembly IC package Assembly
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ContentContent
� Package Development Trend
� Product Brief
� Sawing type QFN
� Representative MEMS Product
� LGA
� Light Sensor
� Proximity Sensor
� High Yield Capability
� Low Cost Solution
� Rapid Product Design / Phase-in
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Sigurd AssembliesSigurd Assemblies
LargeLarge SmallSmall
ThinThin
ThickThick
DIP DIP SOPSOP
PLCCPLCC
CIS/CCMCIS/CCM
SOT/TSOTSOT/TSOT
QFN/DFNQFN/DFN
TSOPTSOP
QFPQFP MEMS MEMS
LGALGA
SSOPSSOP
Today
Proximity Proximity
sensorsensor
WLCSPWLCSP
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Assembly Product RoadmapAssembly Product Roadmap
Development Photo type Production
Jan. 2010 Jan. 2011 Jan. 2012 Jan. 2013
MEMS SIP assembly
LGA
MEMS G-sensor technology
Integrate LED & Receiver
Solar cell module
RF 3G technology
Glass Wafer sawing
Embedded component
Light Sensor
Direction: small size, multi-chip, more component.
Single receiver
300mm WLCSP Technology
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Package Structure Package Structure –– Sawing type / QFNSawing type / QFN
Gold Wire Molding Compound Chip
DA EpoxyLead Frame (PPF/ Spot Ag)
Exposed
Die pad
Marking
OOOOO
OOOOO
Bottom view Top view
Chip
Mold Compound
0.55, 0.75 & 0.9
mm
Cross section
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Package Type Package Type –– QFN/ DFNQFN/ DFN
Remark:Remark:
●●●●●●●● : L/F is ready.: L/F is ready.
●●●●●●●● : L/F need to be created.: L/F need to be created.
Package thickness: 0.55, 0.75, and 0.90 mmPackage thickness: 0.55, 0.75, and 0.90 mm
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Representative MEMS ProductRepresentative MEMS Product
� MEMS Telecom Switch (production)
� High-volume application
� Stacked Die for small footprint and low impedance interconnect
� CMOS Controller for switch drive and digital interface
Leadframe
MEMS DieCMOS ControllerLid (LCP) Au Bond-wire
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� Design and develop MEMS with driver in one package – System in Package technology.
� Multi-layer bonding – 4-layer wire loop capability.
� Package thermal expansion control solution.
� Package type: Injection molded type & Air cavity type.
� Turn key solution.
MEMS Stacking Die TechnologyMEMS Stacking Die Technology
� Pictures of stacking die with wire bonding
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Thin Package Solution Thin Package Solution -- SOT / TSOTSOT / TSOT
Features:Features:
•• 2.9x1.6mm package size2.9x1.6mm package size
•• 1.9mm lead pitch1.9mm lead pitch
•• SOT thickness 1.1mmSOT thickness 1.1mm
•• TSOT thickness 0.75mmTSOT thickness 0.75mm
•• Green productGreen product
Application:Application:
•• Power managementPower management
•• Power switchPower switch
•• RFIDRFID
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LGA (land grid array)LGA (land grid array)Features:Features:
•• 3x3mm to 10x7mm package size3x3mm to 10x7mm package size
•• 77 to 29 pin countsto 29 pin counts
•• 0.0.44mm lead pitch mm lead pitch
•• Green finish available Green finish available
•• Excellent electrical and thermal performance Excellent electrical and thermal performance
•• Full in house design abilityFull in house design ability
Application:Application:
•• RF moduleRF module
•• LLogic ogic
•• MMemory emory
SubstrateSubstrateEpoxyEpoxy Passive Passive
componentcomponent
Passive componentPassive component
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Light SensorLight SensorFeatures:Features:
�� 1.6x1.6mm to 3x3mm package size1.6x1.6mm to 3x3mm package size
�� 4 to 12 pin counts4 to 12 pin counts
�� 0.5mm lead pitch 0.5mm lead pitch
�� Green finish available Green finish available
�� Excellent electrical and Excellent electrical and lightlight performance performance
�� Full in house design abilityFull in house design ability
Application:Application:
•• Cell phoneCell phone
•• NotebookNotebook
•• Touch control panelTouch control panel
ChipClear Compound
Silver Epoxy PPF Lead Frame
``
Gold Wire
Chip
Clear Compound
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Proximity SensorProximity SensorFeatures:Features:
�� Customized packageCustomized package
�� 4 to 12 pin counts4 to 12 pin counts
�� Integrate LED and Receiver Integrate LED and Receiver
in one package in one package
�� Green finish available Green finish available
�� Excellent electrical and Excellent electrical and lightlight performance performance
�� Full in house design abilityFull in house design ability
Application:Application:
•• Cell phoneCell phone
•• NotebookNotebook
•• Touch control panelTouch control panel
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WLCSP
Features:• Die size: 0.3mm x 0.3mm till 15mm x 15mm
• Bump size: 90 ~ 250um
• Carrier/Cover tape: 8/12/16/24/32 mm tape
width capability
• waffle pack: 2” x 2” ~ 4” x 4”
Chip
Carrier
Cover
Bump
Chip
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High yield capabilityHigh yield capability
Remark: average yield above 99.95%.Remark: average yield above 99.95%.
AssAss’’y Yield trend:y Yield trend:
Assembly Yield
99
99.5
100
Month
Yie
ld
Total
Power
QFN
LGA
Total 99.96 99.96 99.94 99.95 99.93 99.94 99.95 99.95 99.95 99.93 99.94 99.95 99.94 99.94 99.95 99.95 99.95 99.95
Power 99.96 99.94 99.95 99.95 99.93 99.95 99.95 99.95 99.95 99.94 99.95 99.96 99.95 99.95 99.95 99.95 99.96 99.94
QFN 99.95 99.96 99.94 99.95 99.94 99.94 99.94 99.94 99.93 99.90 99.92 99.94 99.94 99.94 99.94 99.95 99.94 99.95
LGA 99.93 99.95 99.93 99.95 99.95 99.96 99.96 99.95 99.92 99.93 99.93 99.94 99.96 99.93 99.95 99.94 99.95 99.95
Jan' 10 Feb' 10Mar'
10Apr' 10
May'
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Jun '
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July '
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Aug
'10Sep '10 Oct '10
Nov
'10Dec '10 Jan '11 Feb '11
Mar.
'11Apr '11
May
'11
Jun.
'11
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Process Vendor Remark
Grinding Okamoto Accuracy: +/- 5um
Saw Disco/TSC
Die Bond ESEC / ASM / Panasonic Accuracy: +/- 25um
Wire Bond ASM / KNS / Panasonic Accuracy: +/- 3um
Sealing RJR / GPM
Molding Towa / Ki-Giant Offset: +/- 20um
Marking GPM / E&R
Singulation saw Disco / KnS
Trim/Form GPM / Ki-Giant
Printer Hitchchi
Mounter Suzuki
Re-flow NRY540SCC7Z Yamato
Equipment List For Assembly
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Die BonderDie Bonder
Wire BonderWire Bonder
GrindingGrinding
Die SawerDie Sawer
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Mold SystemMold System PMC OvensPMC Ovens
Singulation SawSingulation SawSMT LineSMT Line
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MicroscopeMicroscope 3D Optic System3D Optic System
Die Shear SystemDie Shear System Wire Pull TesterWire Pull Tester
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Assembly capability(bond wire size (Au/Cu), bonding capability for single row/ dual
row and offset pads, grinding capability, and so on)
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Process Capability
Process Item Process Capability
Wafer Size 6'' / 8''
Minimum final thickness 4mils
Parallelism TTV < 5um
Thickness Variation between wafers <=10μμμμm
Wafer Size 4~8 inch
Cutting Method through Cut/ Step Cut
Minimum chip size cutting 0.2mm square
DI water Resistivity >=10MΩΩΩΩ
Chipping width <=10μμμμ m
Cutting street >50μμμμ m
Wafer Size 4 ~ 8''
Acceptable die size >0.2mm square
Pick Type wafer mapping/ Ink Dot
Bonding Type Epoxy type
Epoxy Bleeding <10mils
Epoxy thickness 5~40um
Epoxy Voids within 5% in die area
Die Placement Accuracy Theta :±0.5º ;X/Y:± 2 mils
Wafer Grinding
Wafer Sawing
Die Bonding
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Process Capability
Process Item Process Capability
Fine Pitch Capability 45um
wire size 0.7 ~2.0 mils
Loop height control ±25um
Bonding Frequency 138K HZ
Bond placement repeatability 3um
Bond pad pitch (single/ dual row) 45um
Bond pad openning 40um
Staggered bond 30um
Wire Span ~8mm
Fine Pitch Capability 60um
wire size 0.9~1.2 mils
Loop height control ±25um
Bonding Frequency 138K HZ
Bond placement repeatability 3um
Bond pad pitch (single/ dual row) 60um
Bond pad openning 50um
Staggered bond 40um
Wire Span ~10mm
Wire Bonding
(Cu wire)
Wire Bonding
(Au wire)
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Process Capability
Process Item Process Capability
Die Coating Viscosity 500 ~ 50000 cps
Sealing Accuracy 4mils
Molding thickness 0.55/0.75/0.90mm
Lead frame handling thickness 0.15mm
Molding Wire sweep <5%
Body offset/ off center <1 mil
Marking Symbol Laser/ Ink
Plating Plating composition Pb/Sn(85/15%)
(Apply to lead frmae type) Lead free capability Pure Tin (100%), Sn/Bi(98/2%), Sn/Cu(99/1%)
Trim \ Forming Coplanarity <4mils
Solder Thickness ≦≦≦≦ 0.12 ± 0.06 mm
Component size Min. 0201
Mount for SMD ≦≦≦≦ ± 2.0 mils
SMT
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Low Cost SolutionLow Cost Solution
� Material evaluationex.
• To study low cost materials with high quality
Au wire � Cu wire
• To co-work with customer to reduce the gold wire dimension
� Package design
ex.
• Smaller package design to increase product value
QFP � QFN
SOT � TSOT
� To integrate more chips and components in one package
(SIP design)
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Rapid Product Design/PhaseRapid Product Design/Phase--inin
1. Capability:
� Stack die
� SIP design
� MEMS product design/production
� Product design
2. Sample making timeline:
� Available package: 1 week for sample making.
� New type lead frame/substrate: 4~6 weeks for prototype.
� New package/product: around 3 months (based on product
requirement)