Big Science Projects

Finnish approach on in-kind packages and future co-operation with GSI/FAIR

Antti Heikkilä, FinproGSI/FAIR, 20th April 2007

firstname.surname@finpro.fi +41 76 48 74 825

Common approach for Big Science

National coordination

Focus on joint R&D

• Knowledge transfer, learning

• National and international networking

• Market pull

Idea/need at

GSI/FAIRProject

Industry

Funding

Finpro Big Science framework

R&D funding in FIN - Tekes Funding for

R&D and development projects Feasibility studies for launching, finding

opportunities and utilising the results of R&D projects Starting a new technology-based business

Tekes Funding alternatives Tekes R&D -funding

Funding for product or technology R&D with market potential, 15 – 50% of project budget

TULI -funding For defining the business idea, 10k€

VARA -funding For preparing the project, partnering, business and

R&D plans, 15k€ TUPAS -funding

Funding makes it easier for SME’s to purchase research services, 15k€

Detector development co-operation?

• Silicon strip detectors

• Double sided

• Rad hard

• Thinned low mass

Might be a fruitfull project to pursue for!

Industry

Patria Aerostructures • Advanced composite structures• kimmo.myllyoja@patria.fi

Exel•composite structures to CMS tracker•Pentti.paajanen@exel.fi

Modulight•Transmitter lasers for optical communication 1310 nm, 1490 nm, 1550 nm•Petteri.uusimaa@modulight.com

VTI Technologies•High performance acceleration, inclination and pressure measurement based on MEMS technology, 3-axis measurement•Heikki.timonen@vti.fi

Detectors and Sensors

Oxford Instruments Analytical • X-ray fluorescence analyzers• Si and GaAs x-ray detectors for space• Heikki.sipila@oxinst.fi

Detection Technology• Detector solutions and subsystems to Medical

Imaging and Security and Safety Imaging• Mikko.juntunen@deetee.com

Aboa Space Research (ASRO)• Particle instruments – ESA’s BepiColombo • Energetic particle measurements in space and data analysis• Eino.valtonen@asro-space.com

More companies: http://www.avaruus.info/dyn/file.php?file=26

VTT• Detectors on 6” wafers, rad hard, thinned detectors,

bump bonding of pixel detectors (e.g. Medipix)• Ilkka.suni@vtt.fi

P1P2P3D1D2D3D4D5PDAC2AC1

13.5 o

35.0 oG = 0.023 cm sr + 6 x 0.019 cm sr

2

2

77,0 mm

Conclusions

• In-kind packages not yet decided• Preferably not just HW deliveries – R&D

component must be found

• Industry involved a long time at CERN - the experience can be transfered to GSI/FAIR

• Finland is very interested in GSI/FAIR R&D projects even outside in-kind packages

Thanks!

Please contact me if you think the project of yours might need

external funding and industry!

Antti Heikkila

Firstname.Surname@cern.ch+41 76 48 74 825