Post on 22-Dec-2015
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Evaporation Printing of Patterned Thin Films
May, 2013
Advantech US, Inc. COPYRIGHT 2013 2
OUTLINE
• Introduction• Company Overview and Key Staff• Evaporation Printing of Patterned Thin Films Technology
– Show mask management– Alignment registration
• Market Applications– Active Matrix Display Backplanes
• ESL• OLED
– Printed Electronics• Fine Lines• Embedded Components
• Facility Description• Technology and Product Roadmap
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Overview
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INTRODUCTION
1. Fabricate patterned thin films with feature size down to five micron with alignment accuracy better than one micron.
2. Simple approach to printed electronics thin film fabrication using additive manufacturing called evaporation printing
– Utilizes vapor deposition of evaporable metals, oxides and semiconductor materials through a shadow mask
– Nearly any substrate– Roll-to-roll capable
3. Simple, fast, low cost, efficient and green technology
4. Usage of multiple shadow masks combined with precision alignment enables multi-layer fabrication of arrays including embedded TFTs, capacitors and resistors
5. Active matrix backplanes for OLED and ePaper displays have been fabricated and demonstrated
6. Fine line and passive and active component fabrication development ability underway
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COMPANY OVERVIEW
• Founded by Dr. Peter Brody– active matrix display backplane pioneer– Winner of numerous awards including Draper Prize in 2012
• Developed alternative to photolithography-based microcircuit manufacturing– Display backplanes matrices – OLED and ePaper– Fine lines for chip packaging– Passive and active components
• Funded by private equity and successful entrepreneur family• Technology has been proven• Scaling up low volume in-line beta tool • Developing production process• Business model
– Sell products to prove process and tool– Sell process equipment; License Technologies
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MANAGEMENT & KEY STAFFADVANTECH TALENT BASE IS CONSIDERABLE
Sr. Management: CEO Whit Little, MBA, Edinburgh (Scotland). An experienced financial & operational officer in both technology startups and manufacturing.
VP Blake Brocato, with 30 years in thin film deposition with Seagate Technology and others.
VP Scott Lauer, EE and MBA, University of Pittsburgh 17 years in control systems and automation, with Rockwell Automation and II-IV, Inc. A licensed professional engineer.
Key Technical Staff:Tom Ambrose PhD, material physics (Johns Hopkins). Expert in thin film deposition methodologies.
Brian Bucci, PhD mechanical engineering (Pitt) with precision equipment experience
Prashin Sharma, mechanical eng’g MS degree (Carnegie-Mellon. Former researcher in micro-nano tooling.)
Chuck Harrigal, EE (Penn State). Multiple industry experience in embedded hardware/software development.
John Shelapinsky, ME (CMU), MBA (CMU). Prior electro- and optics-mechanical designer.
Jeff Conrad , Over 30 years experience with vacuum deposition equipment.
Tim Cowen, Over 30 years experience in shadow-mask vacuum deposition.
CONTINUED
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MANAGEMENT & KEY STAFFAMAX’S TALENT BASE IS CONSIDERABLE (CONTINUED)
Contracted Senior Staff:
Poohsan Tamura, optical sensing PhD (Arizona). expert in optical sensing, metrology and inspection. Vladimir Brajovic, PhD in Robotics, Carnegie Mellon. Broad research & applications expertise in computational imaging, algorithms and architecture.
Nebojsa Jankovic, PhD Professor University of Nis, Serbia Faculty of Electronic Engineering (EF) Department of Microelectronics
Bud Smith, mechanical engineer with MBA from MIT. Prior Booz-Allen consultant & senior executive/CEO in process control, microprocessing and tool manufacturing. University of Pittsburgh business faculty.
Joshua Ziff, nuclear eng’g (Purdue) &MBA (Carnegie-Mellon). Ex-CEO of Bridge Semiconductor.
Jean Nagy, Accounting (Penn State) and CPA. Prior Arthur Andersen auditor, and financial/operations director at GlaxoSmithKline.
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Technology Overview
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ADVANTECH US TECHNOLOGY
Evaporation PrintingAdditive process
Vacuum Deposition (thermal and/or e-beam)
Fine Metal Foil Shadow Masks
Depo
sition+ =
Sub 1 mil aperture Masks 1 mm Alignment Multiple Steps
+
High and Low temperature materials
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MATERIALS
• The range of materials is extensive, including pure metals, precious metals, standard alloys, oxides, nitrides, and fluorides. “Anything Evaporable”
Sample Evaporable Materials*Metals Oxides Semiconductor
Copper Nichrome Aluminum Oxide Tellurium
Nickel Nickel/Vanadium Silicon Dioxide IGZO
Aluminum Titanium ITO CdSe
Gold Silver ZnO
Indium Tin
* non-exhaustive list. Contact us about your specific material
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Fine metal foil (electro-formed) with distinct aperture features (cut outs) Nearly any shape imaginable: squares, circles, etc.
Current Mask Design specs:All feature sizes less than 1 mil (25 microns)
• Shadow mask thickness: 10 - 20 mm• Feature trace size: <10 mm• Feature spacing : ~20 mm • Mask fixed to rigid frame (held taut) • Mask cleaning: wet etch process• Mask lifetimes (> 2 years)
Proprietary Shadow Mask Management
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Proprietary Precision Alignment
Test Procedure: Align, Deposit, Remove sample and document alignment 10 timesGoal: Prove repeatable alignment
10th Deposition1st Deposition
Results: Independent alignments repeatable to within 1 micron
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SMALL METAL LINE FEATURES
15 mm
Minimum feature size : <10 mm
Minimum feature spacing: ~20 mm
Any type of substrate(rigid glass or flexible plastic)
30 mm
Advantech US Amax Evaporation Printing™
Position Accuracy +/- 1 micron
Feature Tolerance +/- 2 microns
Smallest Feature Size < 10 microns
Mask Size 370mmx470mm (G2.5) - currently
Evaporation Precision
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Masks and deposited materials can be configured for specific end-user requirements
Masks
Sem
icon
duct
or
Exi
t L
oadl
ock
Masks Masks
Ent
ran
ce
Loa
dloc
k
Oxi
des
Met
als
Etc
h C
lea
n
ConceptFlexible Multi-Chamber In-Line Manufacturing
•Modular
•Loadlocks to eliminate particles
•Reduce material cross contamination
•Improve substrate cleanliness
•Quick change product by changing masks
•Low volume production runs
•Add chambers = increase throughput
•Can make many configurations of passive and active components
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AMAX MINILINE™
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Build Examples
E-PaperShadow Mask Steps
6 total process build steps
PROPRIETARY AND CONFIDENTIAL
miniLineTM ESL Backplane Build
pre-patterned substratesemiconductorSource/Drain LeadsGate OxideCap/Cross Over OxideGate /Top Cap metalCrossover Straps
50 mmOptical Micrograph
Pixel Layout
TFT BuildShadow Mask Steps
7 total process build steps
PROPRIETARY AND CONFIDENTIAL
AM-OLED TFT Circuit Build Example
V Trigger
V Data
V DD
Output Pad
T1
T2
C
D
SG
D
S
G
Glass substrate
Oxide
Semiconductor
DrainGate Oxide
Metal Gate
DrainSource
2 transistor - 1 capacitor (2T/1C) active matrix array
Array specs: 960 x 240 pixels - 115 mm diagonal
Feature size is ~ 15 um with a better than 1 um alignment
Field Effect Transistor Cross Section TFT CircuitPROPRIETARY AND CONFIDENTIAL
Pre-Patterned Substrate
1
2
1 2 3 4 5 6 7
VDD
VTrigger
VData
PROPRIETARY AND CONFIDENTIAL
Oxide Deposition
1
2
1 2 3 4 5 6 7 1
PROPRIETARY AND CONFIDENTIAL
Oxide and Semiconductor
1
2
1 2 3 4 5 6 7 2
PROPRIETARY AND CONFIDENTIAL
Al and Ni contacts
1
2
1 2 3 4 5 6 7 3
PROPRIETARY AND CONFIDENTIAL
Gate Oxide
1
2
1 2 3 4 5 6 7 4
PROPRIETARY AND CONFIDENTIAL
Ni and Al strap
1
2
1 2 3 4 5 6 7 5
PROPRIETARY AND CONFIDENTIAL
Cap Oxide
1
2
1 2 3 4 5 6 7 6
PROPRIETARY AND CONFIDENTIAL
Top Gate
1
2
1 2 3 4 5 6 7 7
PROPRIETARY AND CONFIDENTIAL
1
2
1 2 3 4 5 6 7
Output Pad
T2
T1
CapVDD
VTrigger
VDataSub Pixel
RED GREEN BLUE25
0 um
83.3 um
PROPRIETARY AND CONFIDENTIAL
Chip CarrierShadow Mask Steps
3 total process build steps
PROPRIETARY AND CONFIDENTIAL
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CARRIER WITH DIE
Start Finish
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Mask 1
MASK 1
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Mask 1
LAYER 1
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Mask 2
MASK 2
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Mask 2
LAYER 2
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Mask 3
MASK 3
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Mask 3
LAYER 3: BUILD COMPLETE
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Markets
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MARKET APPLICATIONS
• End-user target markets– Active Matrix backplanes
• ePaper displays• OLED displays
– Printed Electronics• Electronic shelf labels (ESL) - segmented• Fine lines• Embedded active and passive components
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Note: Device fabrication in a single vacuum chamber (6 different deposition steps)
Vgate
V data
T1 T2
VddVdd
C
Vcom
Active Matrix backplanes
2T/1C circuit Mask layout Final device
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DISPLAY EXAMPLES – AMOLED
250 microns
83 microns
R G B
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EPAPER EXAMPLES: ACTIVE MATRIX ESL
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PRINTED ELECTRONICS
Beyond Backplanes• Fine Lines• Embedded Components
44
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FINE LINES – MICROLINES™
• New opportunity beyond display backplanes• Exploit ability to manufacture small feature sizes on
a variety of substrates• Chip Carriers need finer lines
– Miniaturization – space, weight and power– High speed transfer rates– Reduce number of PCB layers
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SEM OF MICROLINES CONNECTED TO VIAS
standard 10 mil via pads with 100 micron and 70 micron traces and a 50 micron space.
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SEM OF MICROLINES CONNECTED TO VIAS
4 mil pads with 2 mil vias connected with 1 mil lines
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MICROLINES
8 mm
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MICROLINES (CONT’D)
5 micron lines
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ACTIVE AND PASSIVE COMPONENTS
• Discrete components fabricated on substrates:– Resistors– Capacitors– Transistors– Diodes– Antennas
Technology Comparison for Active Matrix TFTsa-Si Poly-Si Organic ADV Technology
Circuit Type n-type n-type or p-type
n-type or p-type n-type, p-type possible
Stability (ΔVT) Issue More stable than a-Si
More stable than a-Si
More stable than poly-Si
VT (uniformity) High Low Low High
Mobility (cm2/Vs) 0.5 – 1.0 30-100 1 - 5 50-100
Process Annealing Temperature
No anneal T > 650C No anneal T < 450C
Manufacturability Mature New Not yet New
Cost Low High Maybe low Low
Flexible substrate Possible Uncertain Possible Promising
Shadow Mask Capable
Drive Capacity (Ion)
No
Large W/L to reduce VG
No
Small W/L at small VG
No
Large W/L to reduce VG
Yes
Small W/L atsmall VG
PROPRIETARY AND CONFIDENTIAL
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ACTIVE COMPONENTS – TFT (ESL)
Panel Summary Average St. Dev.Vth (V) 1.52 1.03
Mobility (cm2/Vs) 69 29.19Leakage Current (A) 2.97E-11 1.41E-11
Hysteresis (V) 4.79 1.05
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STEP COVERAGE
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CHARACTERISTIC IMPEDANCE (ZO) DATA
Minimum Maximum Average
4 mil 31.4 33.1 32.7
3 mil 39.6 41.4 40.3
2 mil 49.4 53.1 51.1
1.5 mil 58.4 63.9 61.5
1.0 mil 65.1 70.5 67.9
Line Parameters: 5000 Å Copper, 300 micron pitchSubstrate: 25 micron Kapton ESample Size: 10 sample lines measured per widthTest parameters: 1 MHz, Values in Ohms
Test Measurements compare well with Wheeler Formulations for Microstrips
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THICKNESS REQUIREMENTS
0 101,000
100,000
10,000,000
1,000,000,000
100,000,000,0000.01
0.1
1
10
100
1000
10000
100000
Skin Effect
CopperAluminumGoldSilverNickel
Frequency (Hz)
Mat
eria
l Thi
ckne
ss (m
icron
s)
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PASSIVE COMPONENTS - RESISTORS
25 microns (1 mil)
• Shown: test panel of resistors that are 1 mil wide connected to 1 mil lines.
• By changing the resistive material and thickness, virtually any resistance from fractional ohms to several megohms per resistor is possible
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PRELIMINARY RESISTOR DATA (0.5 MIL WIDE)
0 100 200 300 400 500 60025
26
27
28
29
30
31
32
33
34
35
Cu & NiCr Resistors on Kapton™
RESISTANCE
Resistor #
RESI
STAN
CE (O
hms)
30.0 target29.543 average
0.628 stdev
2.13% tolerance
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PASSIVE COMPONENTS - CAPACITORS
Average Measured Capacitance(pF) Tolerance
2.31pF 2%2.76pF 3%2.08pF 1%
• Parallel Plate Capacitors made with the process. • Devices were 100 square micron area with and a
dielectric layer of 3000 Å of Al2O3 with pad layers of 1000Å Al.
• Random sample of 100 capacitors on panels containing over 14,000 capacitors.
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“BALLPARK” PRICING ESTIMATES
• Mask NRE: $1,500 to $35,000 per layer– Dependent upon: Feature size, design complexity,
Overall dimensions• Set-up/prep: $500• Approx. $100/layer (affected by depo. time)
– Does not include substrate nor materials• Testing Requirements –as required
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Advantech US FacilityPittsburgh PA
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Description:21000 sqft Build Space
9000 sqft Clean Space (class 1000 and 10000)5000 sqft test and development space (non-cleanroom)7000 sqft office space
UtilitiesElectric: 500kva, 480v - 208/120vacWater/Sewage: PublicDI Water: Filtered in-houseLiquid Nitrogen: 1000 gallon external tankNatural Gas: available (currently minor usage)Chilled Water: In house
NEW FACILITY
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DEPOSITION EQUIPMENTPilot Production ManufacturerminiLine in-line process system custom
5 Chamber In-Line ProcessCapable of up to 370x470mm substrates (currently 200mmx200mm)Sputter/Etch Cleaning, Thermal, 4 e-beamExpected TACT: 10 minutesCustom sub-micron alignment stages (x,y,z, theta)
Research And Development Acquired from Kodak in-line Deposition System Plasmatron
5 Process ChambersE-Beam, Thermal, Sputter sourcesCapable of 6” square substrates
Balzers-Kurdex Box Coater Deposition System customSingle Chamber deposition, 8 inch substrate, 4 inch maskCapable of 6 masks e-beam , thermal, etch
Orion 3000 High Vacuum Deposition System customSingle Chamber Deposition, 8 inch substrate, 4 inch maskCapable of 8 masks: e-beam, thermal, etch
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PROCESS EQUIPMENT
Equipment ManufacturerRapid Thermal Annealer Modular Process Technology Corp.RGA on SCT Series Orion 3000 Deposition SystemCVC Model 601 High Vacuum Sputtering Deposition System CustomizedNeslab Model HX-750 Refrigerated Circulation ChillerAnnealerTemptronic RP350/TP2TD Hybrid EconoscopeSub-micron alignment stage(s) CustomFOG/AGF Bonding SystemUltratech Spin Rinse DryerSemi-tool Spin Rinse DryerRite Trak Developer/coaterLaminatorEnvironmental OvensSpin CoaterSub 40c Freezer ScienTemp
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TESTING EQUIPMENT
Equipment ManufacturerParameter Analyzer Value TronicsAutomatic Wafer Prober Texas InstrumentsCurve TracerManual ProberMeters for testing VariousOscilloscope TDS 3054 TecktronixOscilloscope TDS 3055 TektronixLCR Meter HP 4284A HPmicroscopes VariousSeiwa Optical PS-888 YAG Laser StationFinescan 120L CMMHitachi S520 Scanning Electron Microscope HitachiSUSS PA 300 Probe StationIntegral Vision Sharpeye Optical test stationDektak 8 Profilometer
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AUXILIARY EQUIPMENT
Equipment Manufacturer
Glove Box Controller/Sensor for OLED processing General Eastern
Dual Chamber Glove Box w/load lock for OLED processing
Equipment for Technology & Science Inc.
Vacuum Leak Detector
Laminar Flow Hood Ultrapure Technology
Milling machine Enco Manufacturing, Co.
Fisher Hamilton Safeaire flow hood 6' x 2'
Reynoldstech Wet bench
ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com
Roadmap
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COMPANY ROADMAP
• Phase I – Proof of Concept - Completed– Demonstrated 60x80 mm (100 dpi) color OLED displays and
25x35 mm (70 dpi) dot matrix ePaper displays using active matrix backplanes fabricated using evaporation printing in R&D Fab
• Phase II – Characterize In-line Manufacturability – Underway– Active matrix backplanes now being fabricated– Scale-up process– Validate performance, throughput, yield and cost assumptions– Identify modifications needed for production level equipment
• Phase III – Manufacturing - Future– Design and build manufacturing tool for production
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• Flexible substrates• Large area substrates• Higher resolution • Roll to roll manufacturing
LONG TERM VISION