Post on 14-Apr-2017
Corporate Profile2015Q2
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The Origin of Macronix
Miin Wu and other entrepreneurs turn Taiwan into Silicon Valley East and power the rich little island through Asia’s recession.
In 1989, the Dream and Passion to build Taiwan’s Silicon Valley –
Dr. Miin Wu brought 28 senior US engineers back to Taiwan to found Macronix.
Vision as a World-Class Memory Solutions Provider –
Macronix has been committed to developing technologies and products in-house for the past 26 years.
Today, the fruitful result –Macronix is a leading worldwide supplier of Flash memory and ROM products.
Business Overview
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Macronix at a GlanceA Leading Non-Volatile Memory Solutions Provider
150mm Fab 200mm Fab 300mm Fab
~40K wafer/month ~48K wafer/month ~50K wafer/month (Capable Capacity)
Complete In-house Wafer Manufacturing
HeadquartersHsinChu, Taiwan
1989Founded in Taiwan
5,833Patents Granted
(As of March 2015)
US$ 730 Million2014 Revenue
4,506 (19% in R&D)
Employees Worldwide (As of March 2015)
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Corporate Organization
Board of Directors
Chairman’s OfficeChairman and CEO Miin Wu
President’s OfficePresident C.Y. Lu
V.P. Y.H. Chao
Auditing Office
Microelectronics and Memory Solutions Group
President C.Y. Lu (Acting)V.P. F.L. Ni / V.P. W.S. Pan
Chief Scientific Consultant Rich Liu
Foundry Business Group(FBG)
Executive Director C.S. Wen
Conglomerate Marketing Office
Financial CenterV.P. Paul Yeh
Quality Engineering Center
Intellectual Property Office
Subsidiary Service Division
Overseas Support Office
Legal Office
Administration Service Center
Professional Development Center
Material Management Center
Safety & Health Center
Technology Development Center
Emerging Central Lab.
Emerging System Lab.
I.E. Div.
Biz Planning Supply Div.
MMSG Sales Center
Product Design & Engineering Center
Product Engineering Center
Marketing Center
Operation Center
Information Technology Center
Business Planning Div.
Sales Div.
Marketing Div.
FAB I
Technical Service Div.
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Broad Non-Volatile Memory Solutions Portfolio
Macronix has launched the high performance and reliability SLC NAND Flash product portfolio to complement the ROM and NOR Flash offerings for embedded and wireless applications
MACRONIX Source: IHS, March 2015
Macronix Marketing
NAND FlashEnter the market
since 2012
No.3NOR Flash2014 Market share:
18.8%
No.1 ROM
2014 Market share:Above 90%
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We are constantly inspired by the changing world and market demands around us to bring new, innovative products to customers.
In return, our innovations help customers build great products that connect the world and move the world forward.
Innovation Partner for Today and Tomorrow
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Building Intimacy within the Ecosystem
MACRONIXChipset Vendors
Leading System Providers
• Developing future technologies and products for Memory System Solutions with Reliable Support throughout the ecosystem.
• Focusing on core business, while fostering relationships with Customers and Partners built on Trust and Service to support long-term progress.
Engaged with Leading System Solution Providers & Chipset Vendors to align memory capabilities, feature sets and specifications for future applications.
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JAPANTOKYOKOREASEOULSINGAPORE
Global Ecosystem Services Network
AMERICASMILPITAS, CAAUSTIN, TXBOSTON, MADETROIT, MI
EUROPEWEMMEL, BELGIUMMUNICH, GERMANYMANCHESTER, U.K.PARIS, FRANCEMILAN, ITALY
TAIWANTAIPEIHSIN-CHU Headquarters
CHINASUZHOU, JIANGSUSHENZHEN, GUANGDONGHONGKONG
Financial Summary
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Steady Growth
Shipment (Billion units)
0.5
1
1.5
20142004 2005 2006 2007 2008 2009 2010 2011 2012 2013
Focus on Growth Drivers Wireless & Automotive
Y2014 Macronix Shipments1.82 Billion
Macronix continues to expand its NVM business & maintain a leadership position in the market with broad product offerings
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Continued Market Share Gains
Macronix : Leading Non-Volatile Memory Provider
4%
19%
NOR Flash Market Share Serial NOR Flash Market Share
30%
26%
Y2008 Y2014 Y2008 Y2014
Source: IHS, March 2015
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Consumer STB, DAM, DSC, DTV,
DVD Player, Game,
etc.
Diversified Applications
Y2014 Flash Revenue Breakdown by Segments
MACRONIX
ComputingNotebook, Desktop,
ODD, Printer,
etc.
Communication Switching, AP Router,
Home Gateway, Cable Modem,
etc.
WirelessHandset,
M2M, Wearable Devices,
IoT,etc.
AutomotiveInfotainment, Navigation,
ADAS, Cluster,
ECU,etc.
34% 22%20% 9%10%
IndustrialFactory
Automation,Smart Meter, Medical, POS,
Military,etc.
5%
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1Q’15 Financial Update
Flash: 71%ROM: 14%
1Q’15 Shipment418 Million Units
1Q’15 RevenueUS$ 148 Million
32% 24%21% 11%6%
1Q’15 Flash RevenueBreakdown by Segments
1Q’15Revenue
Consumer Computing Communication Wireless Automotive
6%
Industrial
Recent Event & PR
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Macronix at electronica 2014
Macronix exhibited at electronica to showcase its latest innovations in Flash Memory Solutions. Many visitors and editors came visit our booth to view our leading-edge solutions, built upon Macronix's own-developed new generation technology. Hall A6, Booth 147
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NXP Selects Macronix as Preferred QSPI Vendor
NXP has selected Macronix as preferred QSPI Serial NOR Flash vendor for the NXP LPC1800/4000/4300 ARM Cortex M3/M4 MCU line.
The Macronix MX25Lxxx35/33/45 3V serial flash product family is the ideal match for these microcontrollers with SPIFI interface.
Wide density range: 8Mb~1Gb (1MB~128MB) the high-speed Quad Interface broad range package options available (8SOP, 16SOP, 8WSON, 8USON).
Dr. Miin Wu, Chairman and CEO of Macronix Jim Trent, Vice President of NXP’s Microcontrollers Business
Product Development
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Continuous Product Development
Source: IHS, March 2015Macronix Marketing
Quad I/O
Market Share
SLC NAND
Ultra Low Power / Wide Range Vcc NOR
Octa Flash
Enhanced Parallel NOR
RPMC NOR
Dual Quad Flash
DTR NOR
MCP
SFDP NOR
KGD
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Major Breakthrough & Milestone
• Penetrated the wireless market with rich 1.8V Serial Flash products• Mass production (MP) of 75nm NAND Flash memory• Volume shipments of Wafer-Level-Chip-Scale-Package (WLCSP), one of the industry's smallest packages
• An early adopter of Serial Flash Discoverable Parameters (SFDP)• Released AEC Q100-compliant products
• KGD shipments have surpassed 900 million units since introduction in 2006• Joined Automotive Electronics Council (AEC) Component Technical Committee
• 36nm NAND Flash started production• 55nm NOR Flash started production• Developed multichip package (MCP) solutions for IoT and Cellular M2M
applications
• Released Ultra Low Power/Wide Range Vcc MX25R Product Family
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1Q’15 Product Highlight
• Ultra Low Power / Wide Range Vcc (MX25R family) Density: 512Kb~64Mb (sampling now) Ultra Low Power Consumption
Ultra-Low Deep Power Down Current < 0.5uA Ultra-Low Active Current < 4mA
Wide Range Vcc (1.7V ~ 3.6V)
Small Form Factor WSON, USON Packages, WLCSP, KGD
Standard Serial NOR Flash Interface Applications: IoT, Wearables Devices
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NVM Process Technology Roadmap
130nm
110nm
75nm
55nm
2007 2008 2009 2010 2011 2012 2013 2014 2016+
NOR Flash
NAND FlashFloating Gate Technology
3D NAND FlashCharge Trapping Technology
XtraROM Multi bit/cell TechnologyCharge Trapping Technology
Floating Gate Technology
75nm
65nm
45nm
32nm
75nm
36nm
19 nm
42nm
32L
Future Technology in Research
2015
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Comprehensive Product Portfolio
512Kb 1Mb 2Mb 4Mb 8Mb 16Mb 32Mb 64Mb 128Mb 256Mb 512Mb 1Gb 2Gb 4Gb 8Gb 16Gb 32Gb
Serial NOR Flash512Kb~1Gb, 3V / 2.5V / 1.8V
Parallel NOR Flash2Mb~2Gb, 5V / 3V / 1.8V
SLC NAND Flash512Mb~8Gb, 3V / 1.8V
Serial Mask ROM16Mb~128Mb, 3V
Parallel Mask ROM16Mb~128Mb, 3V
Customized XtraROM128Mb~32Gb, 3V
High DensityMid DensityLow Density
Future Technology Development
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Commitment to R&D
• Macronix has established an Emerging Central Lab and an Emerging System Lab to develop advanced technologies and system solutions that will be in demand over the next 5 to 10 years.
• Macronix believes that Innovation and Differentiation are key factors in creating a better, more valuable future for our customers and partners.
• Macronix has published more than 52 papers at IEDM over the past 14 years.
Macronix Strong Technology Portfolio with
5,833 Patents Granted (As of March 2015)
Acc. Patent Numbers
Macronix R&D Expense (% of Revenue)
Y2011 Y2014Y2012 Y2013
14% 27%19% 23%
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Pioneering Innovation in NVM Trend
• The top emerging NVM research topics in worldwide technology conferences are:
Macronix
Toshiba
Samsung
STMicro Spansion
Macronix/IBM
Numonyx/Intel/STMicro
/MicronSamsung
Macronix
Samsung
Spansion
Numonyx/Micron
Charge Trapping PCM ReRAM
(Source: IEDM/ VLSI/ ISSCC/ IRPS/ SSDM/ VLSITSA, 2008-2014)
Topic NumbersTopic NumbersTopic Numbers
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Emerging Technologies for the Future
3D NAND ReRAM(Resistive RAM) PCM
• Smallest PCM cell • Low latency and high
endurance• MLC possible• Co-developing with IBM
• BE-SONOS technology• Minimal incremental layer
cost • Demonstrated 512Mb MLC
test chip and Smallest unit cell (half pitch 37.5nm)
• High speed memory• Low power consumption• Simple cell structure• CMOS compatible• NAND replacement
Macronix Patents
TiN
TiN
TiNW
TiON WOx
TiON
SiO2SiO2
TiN
Substrate
T.E. Connection
B.E. Connection
Quality Management
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Best-in-Class Quality Management
• Stringent quality management to provide reliable products and services• Continuous improvement processes for quality assurance
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Quality Certifications
• Recognition received from our customers and partners (CANON/LG/SAMSUNG/SONY)
• Manufacturing flow certified in TS16949 (since 2004)
• Commitment to quality through continuous improvement of our quality management system
Core Values
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Differentiated and Trustworthy
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Customer Focused Philosophies
• Rigorous quality management system• Proven quality products
• Macronix has achieved continued growth and market share gains
• Continuous product development and R&D investment
• Collaborative product longevity program
• Global technical support team committed to best-in-class customer support
• Macronix is committed to the NOR & SLC NAND markets whilst other major players either pull-out or de-focus
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